Subject: General Tech | March 2, 2015 - 06:49 PM | Jeremy Hellstrom
Tagged: SoFIA, silvermont, modem, LTE, Intel, Cherry Trail, atom x7, atom x5, atom x3, 7260
With MWC in full swing Intel showed off their mobile silicon to Ryan and to The Tech Report who compiled complete specifications of the Cherry Trail based Atom x5-8300 and 8500 as well as the x7-8700. All three of these chips will have an Intel designed XMM 7260 LTE modem as well as WiFi and NFC connectivity with the X7 also featuring Intel WiGig. You can also expect RealSense, True Key facial recognition and Pro Wireless Display to send secure wireless video to compatible displays for meetings. Check out the full list of stats here.
"Intel says the dual-core Atom x3-C3130 is shipping now, while the quad-core Atom x3-C3230RK is coming later in the first half of the year. The LTE-infused Atom x3-C3440 will follow in the second half. In all, the chipmaker names 19 partners on board with the Atom x3 rollout, including Asus, Compal, Foxconn, Pegatron, Weibu, and Wistron."
Here is some more Tech News from around the web:
- News: The TR Podcast 171: Nvidia takes heat, Carrizo runs cool, and Fractal stays quiet
- Seagate NAS owners: hide it behind a firewall. Fast. @ The Register
- The Samsung Galaxy S6 & Galaxy S6 Edge Unpacked Event @ Tech ARP
- MWC: Galaxy S6 and Galaxy S6 Edge arrive with metal redesign and QHD screens @ The Inquirer
- Acer enters Windows Phone fray with cheap Liquid M220 mobe @ The Register
- Microsoft Swarms all over Docker Machines @ The Register
SoFIA, Cherry Trail Make Debuts
Mobile World Congress is traditionally dominated by Samsung, Qualcomm, HTC, and others yet Intel continues to make in-roads into the mobile market. Though the company has admittedly lost a lot of money during this growing process, Intel pushes forward with today's announcement of a trio of new processor lines that keep the Atom brand. The Atom x3, the Atom x5, and the Atom x7 will be the company's answer in 2015 for a wide range of products, starting at the sub-$75 phone market and stretching up to ~$400 tablets and all-in-ones.
There are some significant differences in these Atom processors, more than the naming scheme might indicate.
Intel Atom x3 SoFIA Processor
For years now we have questioned Intel's capability to develop a processor that could fit inside the thermal envelope that is required for a smartphone while also offering performance comparable to Qualcomm, MediaTek, and others. It seemed that the x86 architecture was a weight around Intel's ankles rather than a float lifting it up. Intel's answer was the development of SoFIA, (S)mart (o)r (F)eature phone with (I)ntel (A)rchitecture. The project started about 2 years ago leading to product announcements finally reaching us today. SoFIA parts are "designed for budget smartphones; SoFIA is set to give Qualcomm and MediaTek a run for their money in this rapidly growing part of the market."
The SoFIA processors are based on the same Silvermont architecture as the current generation of Atom processors, but they are more tuned for power efficiency. Originally planned to be a dual-core only option, Intel has actually built both dual-core and quad-core variants that will pair with varying modem options to create a combination that best fit target price points and markets. Intel has partnered with RockChip for these designs, even though the architecture is completely IA/x86 based. Production will be done on a 28nm process technology at an unnamed vendor, though you can expect that to mean TSMC. This allows RockChip access to the designs, to help accelerate development, and to release them into the key markets that Intel is targeting.
Subject: Mobile | February 24, 2014 - 09:00 AM | Ryan Shrout
Tagged: xmm, MWC 14, MWC, lte-advanced, LTE, Intel, 7260
Intel also announced Merrifield and Moorefield SoCs at Mobile World Congress today.
In 2011, Intel acquired SysDSoft to improve and accelerate the companies transition into the mobile wireless controllers, LTE in particular. As a result, Intel released the XMM 7160 modem in 2013 which included the X-GOLD 716 baseband controller that could support LTE and HSPA functions. This modem was adopted by a handful of OEMs in the market with Cat 4 bandwidth up to 150 Mbps (downstream) and 50 Mbps (upstream), LTE voice implementation and globally capability with 15 bands.
This modem was available as a multi-chip solution for mobile device vendors to implement but was shipped in a M.2 module. The latter form gave a quick option for notebook and tablet vendors to include in ready-built systems.
At Mobile World Congress today though, Intel is announcing its next generation modem, the XMM 7260 LTE-Advanced. As the name implies, this update includes support for LTE-Advanced that adds in features like carrier aggregation and a pair of downlink channels for up to 300 Mbps data rates. Carrier aggregation can be used for additional bandwidth performance or to disperse spectrum in a more efficient way to improve reliability. Intel claims that this controller and modem meets the maximum specification levels of LTE today.
The XMM 7260 LTE-Advanced includes the X-GOLD 726 that is truly a global market ready part with frequency compatibility on LTE FDD/TDD, WCDMA/HSPA+, TD-SCDMA/TD-HSPA/EDGE. This iteration uses fewer components, thus is smaller and easier to integrate than the 7160, and will be "on shelf" as early as next quarter. There is no CDMA support included, though. For users on Verizon and Sprint, we'll have to see if handset makers for those carriers have adjusted their timelines for LTE-only devices. AT&T and T-Mobile, in the US, will have no issues with 4G and 3G support.
This modem is meant to compete directly with the stranglehold that Qualcomm has on the LTE market (and one source tells me that carriers "are dying for an alternative" to help drive down costs). Though it might seem odd in some ways, I fully expect this XMM 7260 modem to be paired with non-Intel SoC devices, including smartphones and tablets. In fact, it is quite possible that the XMM 7260 LTE-Advanced modem might have more successful adoption than the upcoming Merrifield SoCs, also announced today. Device manufacturers might be satisfied with their choice in SoCs, not demanding an alternative in x86, but also might appreciate a new modem.
As a side note, the XMM 7260 is being built on TSMC's 28nm process technology rather than on Intel's own fabs (this isn't the first time it has happened). I don't expect this to be a concern for performance but it is interesting to see a chip that Intel is placing so much emphasis on being constructed outside its own walls.
The XMM 7269 LTE-Advanced modem is currently in certification and is expected to be available for integration in Q2, 2014.