Subject: Graphics Cards | January 7, 2016 - 02:36 PM | Jeremy Hellstrom
Tagged: XFX R9 380X Double Dissipation XXX OC 4GB, xfx, amd, 380x
Take a quick break from reading about the soon to be released technology at CES for a look at a GPU you can buy right now. The XFX DD XXX series has been around for a few generations and the XFX R9 380X Double Dissipation XXX OC 4GB sports the same custom DD cooler you would expect. The factory overclock is quite modest, 20MHz on the GPU taking it to 990MHz and retaining the default 5.7GHz memory clock. Of course [H]ard|OCP were not going to leave that as is, they hit a 1040MHz core and 6.1GHz memory clock thanks to the custom cooling on the card, although with no way to adjust voltage they felt this card could be capable of more if that feature was added to the card. Read on to see how this card compares against the ASUS STRIX GTX 960 DCU II OC in this ~$220 GPU showdown.
"On our test bench today is the XFX R9 380X Double Dissipation XXX OC 4GB video card. It features the latest Ghost Thermal 3.0 cooling technology from XFX and a factory overclock. We will compare it to the ASUS STRIX GTX 960 DCU II OC 4GB in a battle of the $229 price point video cards to determine the better overall value."
Here are some more Graphics Card articles from around the web:
- ASUS R9 390 STRIX DirectCU III @ [H]ard|OCP
- ASUS R9 390X STRIX OC Review @ Hardware Canucks
- New AMD GPU Performance To Be Boosted By Linux 4.5; How It Compares To The Binary Blob @ Phoronix
- NVIDIA Linux Driver 2015 Year-in-Review @ Phoronix
- NVIDIA Quadro M4000 @ Kitguru
- Gigabyte GeForce GTX 950 Xtreme Review @ HiTech Legion
May the Radeon be with You
In celebration of the release of The Force Awakens as well as the new Star Wars Battlefront game from DICE and EA, AMD sent over some hardware for us to use in a system build, targeted at getting users up and running in Battlefront with impressive quality and performance, but still on a reasonable budget. Pairing up an AMD processor, MSI motherboard, Sapphire GPU with a low cost chassis, SSD and more, the combined system includes a FreeSync monitor for around $1,200.
Holiday breaks are MADE for Star Wars Battlefront
Though the holiday is already here and you'd be hard pressed to build this system in time for it, I have a feeling that quite a few of our readers and viewers will find themselves with some cash and gift certificates in hand, just ITCHING for a place to invest in a new gaming PC.
The video above includes a list of components, the build process (in brief) and shows us getting our gaming on with Star Wars Battlefront. Interested in building a system similar the one above on your own? Here's the hardware breakdown.
|AMD Powered Star Wars Battlefront System|
|Processor||AMD FX-8370 - $197
Cooler Master Hyper 212 EVO - $29
|Motherboard||MSI 990FXA Gaming - $137|
|Memory||AMD Radeon Memory DDR3-2400 - $79|
|Graphics Card||Sapphire NITRO Radeon R9 380X - $266|
|Storage||SanDisk Ultra II 240GB SSD - $79|
|Case||Corsair Carbide 300R - $68|
|Power Supply||Seasonic 600 watt 80 Plus - $69|
|Monitor||AOC G2460PF 1920x1080 144Hz FreeSync - $259|
|Total Price||Full System (without monitor) - Amazon.com - $924|
For under $1,000, plus another $250 or so for the AOC FreeSync capable 1080p monitor, you can have a complete gaming rig for your winter break. Let's detail some of the specific components.
AMD sent over the FX-8370 processor for our build, a 4-module / 8-core CPU that runs at 4.0 GHz, more than capable of handling any gaming work load you can toss at it. And if you need to do some transcoding, video work or, heaven forbid, school or productivity work, the FX-8370 has you covered there too.
For the motherboard AMD sent over the MSI 990FXA Gaming board, one of the newer AMD platforms that includes support for USB 3.1 so you'll have a good length of usability for future expansion. The Cooler Master Hyper 212 EVO cooler was our selection to keep the FX-8370 running smoothly and 8GB of AMD Radeon DDR3-2133 memory is enough for the system to keep applications and the Windows 10 operating system happy.
Subject: Graphics Cards | January 13, 2015 - 12:22 PM | Ryan Shrout
Tagged: rumor, radeon, r9 380x, 380x
Spotted over at TechReport.com this morning and sourced from a post at 3dcenter.org, it appears that some additional information about the future Radeon R9 380X is starting to leak out through AMD employee LinkedIn pages.
Ilana Shternshain is a ASIC physical design engineer at AMD with more than 18 years of experience, 7-8 years of that with AMD. Under the background section is the line "Backend engineer and team leader at Intel and AMD, responsible for taping out state of the art products like Intel Pentium Processor with MMX technology and AMD R9 290X and 380X GPUs." A bit further down is an experience listing of the Playstation 4 APU as well as "AMD R9 380X GPUs (largest in “King of the hill” line of products)."
Interesting - though not entirely enlightening. More interesting were the details found on Linglan Zhang's LinkedIn page (since removed):
Developed the world’s first 300W 2.5D discrete GPU SOC using stacked die High Bandwidth Memory and silicon interposer.
Now we have something to work with! A 300 watt TDP would make the R9 380X more power hungry than the current R9 290X Hawaii GPU. High bandwidth memory likely implies memory located on the substrate of the GPU itself, similar to what exists on the Xbox One APU, though configurations could differ in considerable ways. A bit of research on the silicon interposer reveals it as an implementation method for 2.5D chips:
There are two classes of true 3D chips which are being developed today. The first is known as 2½D where a so-called silicon interposer is created. The interposer does not contain any active transistors, only interconnect (and perhaps decoupling capacitors), thus avoiding the issue of threshold shift mentioned above. The chips are attached to the interposer by flipping them so that the active chips do not require any TSVs to be created. True 3D chips have TSVs going through active chips and, in the future, have potential to be stacked several die high (first for low-power memories where the heat and power distribution issues are less critical).
An interposer would allow the GPU and stacked die memory to be built on different process technology, for example, but could also make the chips more fragile during final assembly. Obviously there a lot more questions than answers based on these rumors sourced from LinkedIn, but it's interesting to attempt to gauge where AMD is headed in its continued quest to take back market share from NVIDIA.