Subject: Storage | May 31, 2016 - 07:38 PM | Allyn Malventano
Tagged: TurboWrite, Samsung, PM971-NVMe, BGA, 512GB, 48-layer, 32GB, 256Gbit
Have you ever checked out one of those laptops with the soldered-on eMMC SSD, where the manufacturer was basically checking the 'SSD' box for forgetting the 'Performance' box entirely? What if I told you that it was possible to fit an entire PCIe NVMe SSD with performance comparable to a 950 Pro into a package similar to those eMMC parts?
FMS 2015: *UPDATED* Samsung Adds Layers to its 3D VNAND, Doubling Capacity While Reducing Power Consumption
Subject: Storage | August 11, 2015 - 08:39 PM | Allyn Malventano
Tagged: vnand, tlc, Samsung, FMS 2015, 48-layer, 32GB, 32-layer, 256Gbit
FMS 2015: Samsung Adds Layers to its 3D VNAND, Doubling Capacity While Reducing Power Consumption
Samsung recently added 2TB capacity parts to their 850 EVO SATA SSDs, but today’s announcement may double that. Today at Flash Memory Summit, Samsung has announced a new iteration on their 3D VNAND technology.
Cross section of Samsung 32-layer VNAND. (TechInsights)
The announcement is a new TLC 3D VNAND (the type present in the 850 EVO Series). The new parts consist of an updated die with the following improvements:
- 48 layer VNAND - up from 32 layers of the previous generation
- 256Gbit (32GB) capacity - up from 128Gbit (16GB) capacity of 32-layer VNAND
- 30% reduction in power consumption over 32-layer VNAND
Samsung’s new 48-layer VNAND.
I suspected Samsung would go this route in order to compete with the recent announcements from Intel/Micron and SanDisk. Larger die capacities may not be the best thing for keeping performance high in smaller capacity SSDs (a higher number of smaller capacity dies helps there), but it is definitely a good capability to have since higher capacity per die translates to more efficient flash die production.
The Samsung keynote is at noon today (Pacific), and I will update this piece with any photos relevant to the announcement after that keynote.
I just got out of the Samsung keynote. There were some additional slides with data relevant to this post:
This image simply shows the additional vertical stacking, but adds that Samsung has this new flash in production right now.
The new higher capacity dies enable 1.4x greater density per wafer (realize that this does not mean more dies per wafer, as the image incorrectly suggests).
The power consumption improvements (right) were in the press release, however the speed improvements (left) were not. A 2x improvement in per-die speeds means that Samsung should not see a performance hit if they migrate their existing 128Gbit TLC VNAND SSDs over to these new 256Gbit parts. Speaking of which...
Not only is this new VNAND being produced *this month*, Samsung is retrofitting their 850 EVO line with the new parts. Again, we expect no performance delta but will likely retest these new versions just to double check for any outliers.
There was some more great info from the keynote, but that will appear in another post later today.
Subject: Memory | February 8, 2013 - 12:13 AM | Jeremy Hellstrom
Tagged: G.Skill Trident X, DDR3-2400, 32GB, dual channel
At $280 the 32GB kit of DDR3-2400 RAM from G.Skill costs more than an SSD but if you consider what you would have paid for 4GB of DDR3 when it first hit the market you can't argue that the price of a kit like this has fallen drastically. The timings are not even particularly loose for DIMMs of this speed, 10-12-12-31 @ 2T is not too shabby, though Neoseeker didn't have much luck tightening them as they couldn't get to the fully rated speed of the DIMMs due to their motherboard not being able to support that speed. Keep note of that, many motherboards simply do not have 2400MHz as a choice in the BIOS and many CPUs won't be able to keep these DIMMs fully active. You could always opt for using a goodly chunk of the memory as a RAM drive, no matter what speed your BIOS supports. Check the full review here.
"Today I will be looking at G. Skill's Trident X DDR3 2400MHz 32GB quad channel memory kit. With their goal of extreme overclocking performance, G. Skill uses the highest quality memory IC's available when manufacturing their memory. To ensure trouble-free operation, their memory undergoes rigorous testing to verify their craftsmanship and performance."
Here are some more Memory articles from around the web:
- Crucial Ballistix Tactical 16GB DDR3 PC3-12800 Low Profile Memory Kit Review @ Madshrimps
- G.SKILL TRIDENTX 8GB 2400C10 Dual Channel RAM Kit Review @ Madshrimps
- ADATA XPG Gaming Series V2.0 PC3-19200 16GB Dual Channel @ Tweaktown
- Patriot Memory for Ultrabook - Scaling SODIMM RAM Density vs. Battery Life @ Tweaktown
- G.Skill RipjawsX (F3-1600C9Q-32GXM) 1600MHz 32GB (4x 8GB) @ Kitguru
- Affordable DDR3-2400 kits review: Corsair Vengeance vs Kingstone HyperX Beast @ Hardware.info
- Kingston HyperX '10th Anniversary' DDR3 1866MHz 8GB @ eTeknix
- Patriot Limited Edition 'Intel Extreme Masters' DDR3 2133MHz 8GB @ eTeknix
- Crucial Ballistix Sport VLP & Tactical LP 16GB Low-Profile Memory @ TechnologyX
Subject: Memory | August 14, 2012 - 08:18 PM | Jeremy Hellstrom
Tagged: ridgeback, redline, Mushkin, ddr3-1866, 32GB, 16GB
You can pick up two DIMMs with the 16GB kit or four with the 32GB, either way you end up with DDR3-1866MHz @ 10-10-10-27 running on 1.5v, with a lifetime warranty to boot! When Overclockers Club went to work the two kits did end up showing some difference as the 16GB kit hit 2288MHz @ 11-11-12-28 2T while the 32GB only managed 2202MHz @ 11-12-12-28 2T. If you check out the Mushkin Redline series on NewEgg you will see a wide variety of models, so pick the ones with the lowest latency for the best performance out of the box as well as more overclocking headroom.
"Looking at these two kits of memory from Mushkin shows that it has another pair of kits that deliver performance indicative of their specifications and more. First up are the distinctive good looks and functionality of the cooling solutions employed on each kit. The 32GB kit part number 994071 uses the "Ridgeback" design. This robust heatsink package uses a series of angle shaped (think Mushkin logo) fins on top of a thick body to effectively wick away the thermal load generated by these high density modules. Packing them into a four DIMM configuration like used in the testing will allow a higher heat load to be retained but is nothing to be concerned about. Using an air cooled CPU cooling solution would fix that issue as once air starts moving over the modules they cool down fast."
Here are some more Memory articles from around the web:
- AVEXIR AVD3U16001008G-4CI 32GB C10 1600MHz Memory Kit Review @ Madshrimps
- 3 Way DDR3 SODIMM Comparison @ NikKTech
- Patriot Intel Extreme Masters Limited Edition 16GB DDR3-1866MHz Memory Kit @Hi Tech Legion
- Patriot Viper 3 8GB 2133MHz Review @ OCC
- G.SKILL TridentX 2400 MHz F3-2400C10D-8GTX @ Bjorn3D
- Crucial Ballistix Tactical Review - 16GB Dual Channel @ HCW
- Patriot Viper ‘Black Mamba’ 2133mhz Gen 3 16GB @ Kitguru