Author:
Subject: Editorial
Manufacturer: ARM

28HPCU: Cost Effective and Power Efficient

Have you ever been approached about something and upon first hearing about it, the opportunity just did not seem very exciting?  Then upon digging into things, it became much more interesting?  This happened to me with this announcement.  At first blush, who really cares that ARM is partnering with UMC at 28 nm?  Well, once I was able to chat with the people at ARM, it is much more interesting than initially expected.

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The new hotness in fabrication is the latest 14 nm and 16 nm processes from Samsung/GF and TSMC respectively.  It has been a good 4+ years since we last had a new process node that actually performed as expected.  The planar 22/20 nm products just were not entirely suitable for mass production.  Apple was one of the few to actually develop a part for TSMC’s 20 nm process that actually sold in the millions.  The main problem was a lack of power and speed scaling as compared to 28 nm processes.  Planar was a bad choice, but the development of FinFET technologies hadn’t been implemented in time for it to show up at this time by 3rd party manufacturers.

There is a problem with the latest process generations, though.  They are new, expensive, and are production constrained.  Also, they may not be entirely appropriate for the applications that are being developed.  There are several strengths with 28 nm as compared.  These are mature processes with an excess of line space.  The major fabs are offering very competitive pricing structures for 28 nm as they see space being cleared up on the lines with higher end SOCs, GPUs, and assorted ASICs migrating to the new process nodes.

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TSMC has typically been on the forefront of R&D with advanced nodes.  UMC is not as aggressive with their development, but they tend to let others do some of the heavy lifting and then integrate the new nodes when it fits their pricing and business models.  TSMC is on their third generation of 28 nm.  UMC is on their second, but that generation encompasses many of the advanced features of TSMC’s 3rd generation so it is actually quite competitive.

Click here to continue reading about ARM, UMC, and the 28HPCU process!