Intel's cup of hot Coffee has sprung a leak

Subject: General Tech | July 4, 2018 - 01:32 PM |
Tagged: coffee lake refresh, i5-9600K, i3-9000, 14nm

Today's Intel leak is a little less of a rumour than the AMD GPUs of yesterday as Intel accidentally published the model information themselves.  The process node, price and any release dates are speculation but we do have specs on two 9th generation Core processors.  The i5-9600K will be a six core, six thread CPU with top clock of 4.5GHz, 9MB of L3 cache and a 95W TDP.  The other model revealed is the i3-9000 will have four 3.7GHz cores with 4 threads, 6MB of L3 cache and a 65W TDP.   These Coffee Lake Refresh chips will a tough time on the market as AMD offers higher thread counts, albeit at a lower frequency. 

Things are getting very interesting in the CPU world; The Inquirer has links if you want to dig.

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"The document appears to have now been updated to strip out mention of the 9th-gen processors, but PC Gamer reports that a separate PDF was also posted online - though it now results in a page missing error - that listed some of the specs of the incoming chips."

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Source: The Inquirer
Author:
Subject: Editorial
Manufacturer: Intel

2018: A banner year

Intel has a long history of generating tremendous amounts of revenue and income. This latest quarter is no exception. Intel has announced record Q1 revenues for this year and they look to continue that trend throughout 2018. AMD released their very positive results yesterday, but their finances are dwarfed by what Intel has brought to market. The company had revenue of $16.1 billion with a net income of $4.5 billion. Compare this to AMD’s $1.625B revenue and $81M net income we see that the massive gulf between these two companies will not be bridged anytime soon with either Intel falling or AMD gaining.

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Intel has put its money to good use with a wide variety of products that stretch between the PC market and datacenters. While their low power and ultra-mobile strategies have been scaled back and cancelled in some cases, their core markets are unaffected and they continue to make money hand over fist. The company has always been fundamentally sound in terms of finances and they do not typically spend money recklessly. They continue to feature market leading IPC with their product lines and can address multiple markets with the x86 products they have.

Click here to continue reading about Intel's Q1 results!

Intel Core i9-7980XE Pushed to 6.1 GHz On All Cores Using Liquid Nitrogen

Subject: Processors | September 25, 2017 - 09:36 PM |
Tagged: skylake-x, overclocking, Intel Skylake-X, Intel, Cinebench, 7980xe, 3dmark, 14nm

Renowned overclocker der8auer got his hands on the new 18-core Intel Core i9-7980XE and managed to break a few records with more than a bit of LN2 and thermal paste. Following a delid, der8auer slathered the bare die and surrounding PCB with a polymer-based (Kryonaut) TIM and reattached the HIS to prepare for the extreme overclock. He even attempted to mill out the middle of the IHS to achieve a balance between direct die cooling and using the IHS to prevent bending the PCB and spread out the pressure from the LN2 cooler block, but ran into inconsistent results between runs and opted not to proceed with that method.

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Using an Asus Rampage VI Apex X299 motherboard and the Core i9-7980XE at an Asus ROG event in Taiwan der8auer used liquid nitrogen to push all eighteen cores (plus Hyper-Threading) to 6.1 GHz for a CPU-Z validation. To get those clockspeeds he needed to crank up the voltage to 1.55V (1.8V VCCIN) which is a lot for the 14nm Skylake X processor. Der8auer noted that overclocking was temperature limited beyond this point as at 6.1 GHz he was seeing positive temperatures on the CPU cores despite the surface of the LN2 block being as low as -100 °C! Perhaps even more incredible is the power draw of the processor as it runs at these clockspeeds with the system drawing as much as 1,000 watts (~83 amps) on the +12V rail with the CPU being responsible for almost all of that number! That is a lot of power running through the motherboard VRMs and the on-processor FIVR!

For comparison, at 5.5 GHz he measured 70 amps on the +12V rail (840W) with the chip using 1.45V vcore under load.

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For Cinebench R15, the extreme overclocker opted for a tamer 5.7 GHz where the i9-7980XE achieved a multithreaded score of 5,635 points. He compared that to his AMD Threadripper overclock of 5.4 GHz where he achieved a Cinebench score of 4,514 (granted the Intel part was using four more threads and clocked higher).

To push things (especially his power supply heh) further, the overclocker added a LN2 cooled NVIDIA Titan Xp to the mix and managed to overclock the graphics card to 2455 MHz at 1.4V. With the 3840 Pascal cores at 2.455 GHz he managed to break three single card world records by scoring 45,705 in 3DMark 11, 35,782 in 3DMark Fire Strike, and 120,425 in 3DMark Vantage!

Der8auer also made a couple interesting statements regarding overclocking at these levels including the issues of cold bugs not allowing the CPU and/or GPU to boot up if the cooler plate is too cold. On the other side of things, once the chip is running the power consumption can jump drastically with more voltage and higher clocks such that even LN2 can’t maintain sub-zero core temperatures! The massive temperature delta can also create condensation issues that need to be dealt with. He mentions that while for 24/7 overclocking liquid metal TIMs are popular choices, when extreme overclocking the alloy actually works against them because the sub-zero temperatures reduce the effectiveness and thermal conductivity of the interface material which is why polymer-based TIMs are used when cooling with liquid nitrogen, liquid helium, or TECs. Also, while most people apply a thin layer of thermal paste to the direct die or HIS, when extreme overclocking he “drowns” the processor die and PCB in the TIM to get as much contact as possible with the cooler as every bit of heat transfer helps even the small amount he can transfer through the PCB. Further, FIVR has advantages such as per-core voltage fine tuning, but it also can hold back further overclocking from cold bugs that will see the processor shut down past -100 to -110 °C temperature limiting overclocks whereas with an external VRM setup they could possibly push the processor further.

For the full scoop, check out his overclocking video. Interesting stuff!

Also read:

Source: der8auer

GLOBALFOUNDRIES Technical Conference Releases

Subject: General Tech | September 20, 2017 - 09:44 PM |
Tagged: GLOBALFOUNDRIES, FinFET, FD-SOI, 12nm, 14nm, 14nm+, 22FDX, 28FDX, 12FDX, amd, Vega, ryzen

The day after Intel had its Technology and Manufacturing expo in China, GLOBALFOUNDRIES kicks off their own version of the event and has made a significant number of announcements concerning upcoming and next generation process technologies. GF (GLOBALFOUNDRIES) had been the manufacturing arm of AMD until it was spun off as its own entity in 2009. Since then GF has been open to providing fabless semiconductor firms a viable alternative to TSMC and other foundries. Their current 14nm process is licensed from Samsung, as GF had some significant issues getting their own version of that technology into production. GF looks to be moving past their process hiccups in getting to FinFET technologies as well as offering other more unique process nodes that will serve upcoming mobile technologies very well.
 
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The big announcement today was the existence of the 12LP process. This is a "12 nm" process that looks to be based off of their previous 14nm work. It is a highly optimized variant that offers around 15% better density and 10% better performance than current 14/16nm processes from competing firms. Some time back GF announced that it would be skipping the 10nm node and going directly to 7nm, but it seems that market forces have pushed them to further optimize 14nm and offer another step.  Regular process improvement cadences are important to fabless partners as they lay out their roadmaps for future products.
 
12FP is also on track to be Automotive Grade 2 Certified by Q4 2017, which opens it up to a variety of automotive applications. Self-driving cars are the hot topic these days and it appears as though GF will be working with multiple manufacturers including Tesla. The process also has an RF component that can be utilized for those designs.
 
There had been some questions before this about what GF would do between 14nm and their expected 7nm offering. AMD had previously shown a roadmap with the first generation Zen being offered on 14nm and a rather nebulous sounding 14nm+ process. We now know that 12LP is going to be the process that AMD leverages for Zen and Vega refreshes next year. GF is opening up risk production in 1H 2018 for early adopters. This typically means that tuning is still going on with the process, and wafer agreements tend to not hinge on "per good die". Essentially, just as the wording suggest, the monetary risks of production fall more on the partner rather than the foundry. I would expect the Zen/Vega refreshes to start rolling out mid-Summer 2018 if all goes well with 12LP.
 
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RF is getting a lot of attention these days. In the past I had talked quite a bit about FD-SOI and the slow adoption of that technology. In the 5G world that we are heading to, RF is becoming far more important. Currently GF has their 28FDX and 22FDX processes which utilize FD-SOI (Fully Depleted Silicon On Insulator). 22FDX is a dual purpose node that can handle both low-leakage ASICs as well as RF enabled products (think cell-phone modems). GF has also announced a new RF centric process node called 8SW SOI. This is a 300mm wafer based technology at Fab 10 located in East Fishkill, NY. This was once an IBM fab, but was eventually "given" to GF for a variety of reasons. The East Fishkill campus is also a center for testing and advanced process development.
 
22FDX is not limited to ASIC and RF production. GF is announcing that it is offering eMRAM (embedded magnetoresistive non-volatile memory) support. GF claims that ic an retain data through a 260C solder reflow while retaining data for more than 10 years at 125C. These products were developed through a partnership with Everspin Technologies. 1Gb DDR MRAM chips have been sampled and 256Mb DDR MRAM chips are currently available through Everspin. This technology is not limited to standalone chips and can be integrated into SOC designs utilizing eFlash and SRAM interface options.
 
GLOBALFOUNDRIES has had a rocky start since it was spun off from AMD. Due to aggressive financing from multiple sources it has acquired other pure play foundries and garnered loyal partners like AMD who have kept revenue flowing. If GF can execute on these new technologies they will be on a far more even standing with TSMC and attract new customers. GF has the fab space to handle a lot of wafers, but these above mentioned processes could be some of their first truly breakthrough products that differentiates itself from the competition.

Raven Ridge rumours

Subject: General Tech | September 18, 2017 - 04:17 PM |
Tagged: amd, raven ridge, Bristol Ridge, Ryzen 5 2500U, Zen, Vega, 14nm

If the rumours are true, the new 14nm Raven Ridge based AMD Ryzen 5 2500U will offer an impressive jump in performance compared to AMD's current generation of APUs.  The Inquirer's source suggests the new APU will offer a 50% jump in single threaded performance and an impressive 90% advantage on multi-threaded performance.  The multithreaded performance improvement may be the headline but seeing a huge increase in single threaded applications, AMD's recent Achilles Heel, shows some interesting improvements to Zen.  This will also mark the arrival of their first APU with Vega onboard, so you can expect better graphics performance as well.  The benchmark numbers and links are here.

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"LEAKED BENCHMARKS for AMD's forthcoming Raven Ridge APUs suggest that upcoming devices, expected to be launched in time for Christmas, will outperform current Bristol Ridge APUs by up to 90 per cent on multicore applications."

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Source: The Inquirer

Samsung Announces 11nm LPP and 7nm LPP Processes

Subject: General Tech | September 11, 2017 - 05:27 PM |
Tagged: Vega, TSMC, Samsung, ryzen, Intel, euv, 8nm, 7nm, 14nm, 11nm, 10nm

Process technology is extremely complex today, and getting more and more complex by the minute.  The billions of dollars invested in each process node essentially insures that it will have to be used for years to come to get back that investment.  It not only needs to get back that investment, but provide more funds to start R&D on the next series of nodes that will come down the line.  It has only been a couple of years since the introduction of multiple 14nm processes from Intel and Samsung, as well as the 16nm node from TMSC.  We are already moving towards an introduction of 10nm parts from these manufacturers in bulk starting next year.  So have these manufacturers gotten their money worth out of their current processes?
 
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Kinam Kim, President of Samsung Electronics’ Semiconductor Business, discloses the latest process advances from his division.
 
Part of that answer somes in the form of Samsung's latest product.  Samsung is announcing the availability of a new 11nm FinFET process that looks to be a pretty extensive optimization of the company's 14nm FF.  The new process promises 15% better performance and 10% chip area reduction at the same power consumption as the older 14nm FF.  The idea here is to further improve upon their 14nm process all the while retaining the economics of it.  This process exists separately from the latest 10nm LPP which can be considered a full jump from the previous 14nm.  11nm LPP will be primarily aimed at midrange and high end products, but will not reach the full scaling and performance of the 10nm LPP product.
 
This "little steps" philosophy has been around for ages, as AMD utilized it for most of their existence when they owned their own Fabs.  Other companies have done the same by including small improvements over the lifetime of the process so that the final product is signficantly better in terms of yield, transistor switching speed, and thermal dissipation.  Samsung looks to be doing this with their 11nm process by providing all those little steps of improvement from 14nm.
 
The second part of the announcement is that Samsung has announced their 7nm process using EUV.  Samsung had previously announced their 8nm process, but it still relies upon multi-patterning immersion litho.  Samsung has been testing their 250 watt EUV source with fairly good results.  The company is quoted as to processing over 200,000 wafers since 2014 and has achieved an 80% yeild on 256 Mb SRAM.  This is somewhat impressive, but still not ready for primetime.  SRAM features highly consistent structures and is typically one of the first complex chips tested on a new process.
 
Samsung is offering orders now of its 11nm line and it will be very interesting to see who jumps on board.  I would not expect AMD to transfer their designs to 11nm, as a tremendous amount of reworking and validating are required. Instead we will see AMD going for the 10nm node with their Zen 2 based products while continuing to produce Ryzen, Vega, and Polaris at 14nm. Those that will be taking advantage of 11nm will probably be groups pushing out smaller products, especially for the midrange and high end cell phone SOCs.
 
10nm LPP is expected in early 2018, 8nm LPP in 2019, and finally Samsung hopes for 7nm to be available in 2020.
Source: Samsung

Details on Intel's Gemini Lake SoC Leak: A Refined Apollo Lake Coming Soon

Subject: Processors | May 31, 2017 - 02:33 PM |
Tagged: Intel, goldmont+, gemini lake, apollo lake, 14nm

Information recently leaked on the successor to Intel’s low power Apollo Lake SoCs dubbed Gemini Lake. Several sites via FanlessTech claim that Gemini Lake will launch by the end of the year and will be the dual and quad core processors used to power low cost notebooks, tablets, 2-in-1 convertibles, and SFF desktop and portable PCS.

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A leaked Intel roadmap.

Gemini Lake appears to be more tick than tock in that it uses a similar microarchitecture as Apollo Lake and relies mainly on process node improvements with the refined 14nm+ process to increase power efficiency and performance per watt. On the CPU side of things, Gemini Lake utilizes the Goldmont+ microarchitecture and features two or four cores paired with 4MB of L2 cache. Intel has managed to wring higher clockspeeds while lowering power draw out of the 14nm process. A doubling of the L2 cache versus Apollo Lake will certainly give the chip a performance boost. The SoC will use Intel Gem9 graphics with up to 18 Execution Units (similar to Apollo Lake) but the GPU will presumably run at higher clocks. Additionally, the Gemini Lake SoC will integrate a new single channel DDR4 memory controller that will support higher memory speeds, s WLAN controller (a separate radio PHY is still required on the motherboard) supporting 802.11 b/g/n and Bluetooth 4.0.

Should the leaked information turn out to be true, he new Gemini Lake chips are shaping up to be a good bit faster than their predecessor while sipping power with TDPs of up to 6W for mobile devices and 10W for SFF desktop.

The lower power should help improve battery life a bit which is always a good thing. And if they can pull off higher performance as well all the better!

Unfortunately, it is sounding like Gemini Lake will not be ready in te for the back to school or holiday shopping seasons this year. I expect to see a ton of announcements on devices using the new SoCs at CES though!

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Intel is proud of its tiny sized FinFET

Subject: General Tech | March 30, 2017 - 01:20 PM |
Tagged: Intel, 14nm, 14 nm FinFET

At Intel's Technology and Manufacturing Day event in San Francisco there was a lot of talk about how Intel's 14nm process technology compares to the 16nm, 14nm, and 10nm offerings of their competitors.  Investors and enthusiasts are curious if Intel can hold their lead in process tech as Samsung seems to be on track to release chips fabbed on 10nm process before Intel will.  Intel rightly pointed out that not all process tech is measured the same way and that pitch measurements give only one part of the picture; meaning Samsung might not actually be smaller than them.

The Tech Report were present at that meeting and have written up an in depth look at what Intel means when they dispute the competitions claims, as well as their rationale behind their belief that the 14nm node still has a lot of life left in it.

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"As process sizes grow smaller and smaller, Intel believes that the true characteristics of those technology advances are being clouded by an over-reliance on a single nanometer figure. At its Technology and Manufacturing Day this week, the company defended its process leadership and proposed fresh metrics that could more accurately describe what a given process is capable of."

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Three Kaby Lakes for three Z270s; it's an overclocking menage a trois

Subject: Processors | January 3, 2017 - 03:54 PM |
Tagged: z270, overclocking, kaby lake, Intel, i7-7700k, core i7-7700k, 7th generation core, 7700k, 14nm

Having already familiarized yourself with Intel's new Kaby Lake architecture and the i7-7700k processor in Ryan's review you may now be wondering how well the new CPU overclocks for others.  [H]ard|OCP received three i7-7700k's and three different Z270 motherboards for testing and they set about overclocking these in combination to see what frequency they could reach.  Only one of the chips was ever stable at 5GHz, and it is reassuring that it managed that on all three motherboards, the remaining two would only hit 4.8GHz which is still not a bad result.  Drop by to see their settings in full detail.

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"After having a few weeks to play around with Intel's new Kaby Lake architecture Core i7-7700K processors, we finally have some results that we want to discuss when it comes to overclocking and the magic 5GHz many of us are looking for, and what we think your chances are of getting there yourself."

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Source: [H]ard|OCP
Author:
Subject: Processors
Manufacturer: Intel

Architectural Background

It probably doesn't surprise any of our readers that there has been a tepid response to the leaks and reviews that have come out about the new Core i7-7700K CPU ahead of the scheduled launch of Kaby Lake-S from Intel. Replacing the Skylake-based 6700K part as the new "flagship" consumer enthusiast CPU, the 7700K has quite a bit stacked against it. We know that Kaby Lake is the first in the new sequence of tick-tock-optimize, and thus there are few architectural changes to any portion of the chip. However, that does not mean that the 7700K and Kaby Lake in general don't offer new capabilities (HEVC) or performance (clock speed). 

The Core i7-7700K is in an interesting spot as well with regard to motherboards and platforms. Nearly all motherboards that run the Z170 chipset will be able to run the new Kaby Lake parts without requiring an upgrade to the newly released Z270 chipset. However, the likelihood that any user on a Z170 platform today using a Skylake processor will feel the NEED to upgrade to Kaby Lake is minimal, to say the least. The Z270 chipset only offers a couple of new features compared to last generation, so the upgrade path is again somewhat limited in excitement.

Let's start by taking a look at the Core i7-7700K and how it compares to the previous top-end parts from the consumer processor line and then touch on the changes that Kaby Lake brings to the table.

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With the beginning of CES just days away (as I write this), Intel is taking the wrapping paper off of its first gift of 2017 to the industry. As you can see from the slide above, more than just the Kaby Lake-S consumer socketed processors are launching today, but other components including Iris Plus graphics implementations and quad-core notebook implementations will need to wait for another day.

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For DIY builders and OEMs, Kaby Lake-S, now known as the 7th Generation Core Processor family, offer some changes and additions. First, we will get a dual-core HyperThreaded processor with an unlocked designation in the Core i3-7350K. Other than the aforementioned Z270 chipset, Kaby Lake will be the first platform compatible with Intel Optane memory. (To be extra clear, I was told that previous processors will NOT be able to utilize Optane in its M.2 form factor.)

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Though we have already witnessed Lenovo announcing products using Optane, this is the first official Intel discussion about it. Optane memory will be available in M.2 modules that can be installed on Z270 motherboards, improving snappiness and responsiveness. It seems this will be launched later in the quarter as we don't have any performance numbers or benchmarks to point to demonstrating the advantages that Intel touts. I know both Allyn and I are very excited to see how this differs from previous Intel caching technologies.

  Core i7-7700K Core i7-6700K Core i7-5775C Core i7-4790K Core i7-4770K Core i7-3770K
Architecture Kaby Lake Skylake Broadwell Haswell Haswell Ivy Bridge
Process Tech 14nm+ 14nm 14nm 22nm 22nm 22nm
Socket LGA 1151 LGA 1151 LGA 1150 LGA 1150 LGA 1150 LGA 1155
Cores/Threads 4/8 4/8 4/8 4/8 4/8 4/8
Base Clock 4.2 GHz 4.0 GHz 3.3 GHz 4.0 GHz 3.5 GHz 3.5 GHz
Max Turbo Clock 4.5 GHz 4.2 GHz 3.7 GHz 4.4 GHz 3.9 GHz 3.9 GHz
Memory Tech DDR4 DDR4 DDR3 DDR3 DDR3 DDR3
Memory Speeds Up to 2400 MHz Up to 2133 MHz Up to 1600 MHz Up to 1600 MHz Up to 1600 MHz Up to 1600 MHz
Cache (L4 Cache) 8MB 8MB 6MB (128MB) 8MB 8MB 8MB
System Bus DMI3 - 8.0 GT/s DMI3 - 8.0 GT/s DMI2 - 6.4 GT/s DMI2 - 5.0 GT/s DMI2 - 5.0 GT/s DMI2 - 5.0 GT/s
Graphics HD Graphics 630 HD Graphics 530 Iris Pro 6200 HD Graphics  4600 HD Graphics 4600 HD Graphics  4000
Max Graphics Clock 1.15 GHz 1.15 GHz 1.15 GHz 1.25 GHz 1.25 GHz 1.15 GHz
TDP 91W 91W 65W 88W 84W 77W
MSRP $339 $339 $366 $339 $339 $332

Continue reading our review of the Intel Core i7-7700K Kaby Lake processor!!