Subject: Processors | September 25, 2017 - 09:36 PM | Tim Verry
Tagged: skylake-x, overclocking, Intel Skylake-X, Intel, Cinebench, 7980xe, 3dmark, 14nm
Renowned overclocker der8auer got his hands on the new 18-core Intel Core i9-7980XE and managed to break a few records with more than a bit of LN2 and thermal paste. Following a delid, der8auer slathered the bare die and surrounding PCB with a polymer-based (Kryonaut) TIM and reattached the HIS to prepare for the extreme overclock. He even attempted to mill out the middle of the IHS to achieve a balance between direct die cooling and using the IHS to prevent bending the PCB and spread out the pressure from the LN2 cooler block, but ran into inconsistent results between runs and opted not to proceed with that method.
Using an Asus Rampage VI Apex X299 motherboard and the Core i9-7980XE at an Asus ROG event in Taiwan der8auer used liquid nitrogen to push all eighteen cores (plus Hyper-Threading) to 6.1 GHz for a CPU-Z validation. To get those clockspeeds he needed to crank up the voltage to 1.55V (1.8V VCCIN) which is a lot for the 14nm Skylake X processor. Der8auer noted that overclocking was temperature limited beyond this point as at 6.1 GHz he was seeing positive temperatures on the CPU cores despite the surface of the LN2 block being as low as -100 °C! Perhaps even more incredible is the power draw of the processor as it runs at these clockspeeds with the system drawing as much as 1,000 watts (~83 amps) on the +12V rail with the CPU being responsible for almost all of that number! That is a lot of power running through the motherboard VRMs and the on-processor FIVR!
For comparison, at 5.5 GHz he measured 70 amps on the +12V rail (840W) with the chip using 1.45V vcore under load.
For Cinebench R15, the extreme overclocker opted for a tamer 5.7 GHz where the i9-7980XE achieved a multithreaded score of 5,635 points. He compared that to his AMD Threadripper overclock of 5.4 GHz where he achieved a Cinebench score of 4,514 (granted the Intel part was using four more threads and clocked higher).
To push things (especially his power supply heh) further, the overclocker added a LN2 cooled NVIDIA Titan Xp to the mix and managed to overclock the graphics card to 2455 MHz at 1.4V. With the 3840 Pascal cores at 2.455 GHz he managed to break three single card world records by scoring 45,705 in 3DMark 11, 35,782 in 3DMark Fire Strike, and 120,425 in 3DMark Vantage!
Der8auer also made a couple interesting statements regarding overclocking at these levels including the issues of cold bugs not allowing the CPU and/or GPU to boot up if the cooler plate is too cold. On the other side of things, once the chip is running the power consumption can jump drastically with more voltage and higher clocks such that even LN2 can’t maintain sub-zero core temperatures! The massive temperature delta can also create condensation issues that need to be dealt with. He mentions that while for 24/7 overclocking liquid metal TIMs are popular choices, when extreme overclocking the alloy actually works against them because the sub-zero temperatures reduce the effectiveness and thermal conductivity of the interface material which is why polymer-based TIMs are used when cooling with liquid nitrogen, liquid helium, or TECs. Also, while most people apply a thin layer of thermal paste to the direct die or HIS, when extreme overclocking he “drowns” the processor die and PCB in the TIM to get as much contact as possible with the cooler as every bit of heat transfer helps even the small amount he can transfer through the PCB. Further, FIVR has advantages such as per-core voltage fine tuning, but it also can hold back further overclocking from cold bugs that will see the processor shut down past -100 to -110 °C temperature limiting overclocks whereas with an external VRM setup they could possibly push the processor further.
For the full scoop, check out his overclocking video. Interesting stuff!
- The Intel Core i9-7980XE and 7960X Review: Skylake-X at $1999 and 18-cores
- Delidded Ryzen 7 1700 Confirms AMD Is Using Solder With IHS On Ryzen Processors
- The AMD Ryzen Threadripper 1950X and 1920X Review
- Overclocking the AMD Ryzen 7 1700 - The Real Winner?
- Overclockers Push Ryzen 7 1800X to 5.2 GHz On LN2, Break Cinebench Record
Subject: General Tech | September 20, 2017 - 09:44 PM | Josh Walrath
Tagged: GLOBALFOUNDRIES, FinFET, FD-SOI, 12nm, 14nm, 14nm+, 22FDX, 28FDX, 12FDX, amd, Vega, ryzen
Subject: General Tech | September 18, 2017 - 04:17 PM | Jeremy Hellstrom
Tagged: amd, raven ridge, Bristol Ridge, Ryzen 5 2500U, Zen, Vega, 14nm
If the rumours are true, the new 14nm Raven Ridge based AMD Ryzen 5 2500U will offer an impressive jump in performance compared to AMD's current generation of APUs. The Inquirer's source suggests the new APU will offer a 50% jump in single threaded performance and an impressive 90% advantage on multi-threaded performance. The multithreaded performance improvement may be the headline but seeing a huge increase in single threaded applications, AMD's recent Achilles Heel, shows some interesting improvements to Zen. This will also mark the arrival of their first APU with Vega onboard, so you can expect better graphics performance as well. The benchmark numbers and links are here.
"LEAKED BENCHMARKS for AMD's forthcoming Raven Ridge APUs suggest that upcoming devices, expected to be launched in time for Christmas, will outperform current Bristol Ridge APUs by up to 90 per cent on multicore applications."
Here is some more Tech News from around the web:
- Unloved Microsoft Edge is much improved – but will anyone use it? @ The Register
- CCleaner hack: 'Supply-chain attack' saw app install malware on users' machines @ The Inquirer
- Superconference Speakers Revealed @ Hack a Day
- Microsoft Confirms Outlook Issues @ Slashdot
- These Twenty Assistive Technologies Projects Won $1000 In The Hackaday Prize @ Hack a Day
- Linux 4.14 'getting very core new functionality' says Linus Torvalds @ The Register
- Top 5 Worst GPUs @ TechSpot
- Reolink Argus Wireless Battery-Powered Security Camera Review @ OCC
Subject: General Tech | September 11, 2017 - 05:27 PM | Josh Walrath
Tagged: Vega, TSMC, Samsung, ryzen, Intel, euv, 8nm, 7nm, 14nm, 11nm, 10nm
Subject: Processors | May 31, 2017 - 02:33 PM | Tim Verry
Tagged: Intel, goldmont+, gemini lake, apollo lake, 14nm
Information recently leaked on the successor to Intel’s low power Apollo Lake SoCs dubbed Gemini Lake. Several sites via FanlessTech claim that Gemini Lake will launch by the end of the year and will be the dual and quad core processors used to power low cost notebooks, tablets, 2-in-1 convertibles, and SFF desktop and portable PCS.
A leaked Intel roadmap.
Gemini Lake appears to be more tick than tock in that it uses a similar microarchitecture as Apollo Lake and relies mainly on process node improvements with the refined 14nm+ process to increase power efficiency and performance per watt. On the CPU side of things, Gemini Lake utilizes the Goldmont+ microarchitecture and features two or four cores paired with 4MB of L2 cache. Intel has managed to wring higher clockspeeds while lowering power draw out of the 14nm process. A doubling of the L2 cache versus Apollo Lake will certainly give the chip a performance boost. The SoC will use Intel Gem9 graphics with up to 18 Execution Units (similar to Apollo Lake) but the GPU will presumably run at higher clocks. Additionally, the Gemini Lake SoC will integrate a new single channel DDR4 memory controller that will support higher memory speeds, s WLAN controller (a separate radio PHY is still required on the motherboard) supporting 802.11 b/g/n and Bluetooth 4.0.
Should the leaked information turn out to be true, he new Gemini Lake chips are shaping up to be a good bit faster than their predecessor while sipping power with TDPs of up to 6W for mobile devices and 10W for SFF desktop.
The lower power should help improve battery life a bit which is always a good thing. And if they can pull off higher performance as well all the better!
Unfortunately, it is sounding like Gemini Lake will not be ready in te for the back to school or holiday shopping seasons this year. I expect to see a ton of announcements on devices using the new SoCs at CES though!
Subject: General Tech | March 30, 2017 - 01:20 PM | Jeremy Hellstrom
Tagged: Intel, 14nm, 14 nm FinFET
At Intel's Technology and Manufacturing Day event in San Francisco there was a lot of talk about how Intel's 14nm process technology compares to the 16nm, 14nm, and 10nm offerings of their competitors. Investors and enthusiasts are curious if Intel can hold their lead in process tech as Samsung seems to be on track to release chips fabbed on 10nm process before Intel will. Intel rightly pointed out that not all process tech is measured the same way and that pitch measurements give only one part of the picture; meaning Samsung might not actually be smaller than them.
The Tech Report were present at that meeting and have written up an in depth look at what Intel means when they dispute the competitions claims, as well as their rationale behind their belief that the 14nm node still has a lot of life left in it.
"As process sizes grow smaller and smaller, Intel believes that the true characteristics of those technology advances are being clouded by an over-reliance on a single nanometer figure. At its Technology and Manufacturing Day this week, the company defended its process leadership and proposed fresh metrics that could more accurately describe what a given process is capable of."
Here is some more Tech News from around the web:
- Scientists Discover Way To Transmit Taste of Lemonade Over Internet @ Slashdot
- There's a Samsung Galaxy S8 Microsoft Edition, for some reason @ The Inquirer
- 'Trash-80' escapes the dustbin of history with new TRS-80 emulator @ The Register
- Beyond Zelda: The first month of Switch games acts as a promising crystal ball @ Ars Technica
- ZX Spectrum Vega Plus backers complain of months-long refund delays @ The Register
- Microsoft wants screaming Windows fans, not just users @ The Register
- GDC 2017 and NVIDIA Editor's Day Coverage @ Neoseeker
Subject: Processors | January 3, 2017 - 03:54 PM | Jeremy Hellstrom
Tagged: z270, overclocking, kaby lake, Intel, i7-7700k, core i7-7700k, 7th generation core, 7700k, 14nm
Having already familiarized yourself with Intel's new Kaby Lake architecture and the i7-7700k processor in Ryan's review you may now be wondering how well the new CPU overclocks for others. [H]ard|OCP received three i7-7700k's and three different Z270 motherboards for testing and they set about overclocking these in combination to see what frequency they could reach. Only one of the chips was ever stable at 5GHz, and it is reassuring that it managed that on all three motherboards, the remaining two would only hit 4.8GHz which is still not a bad result. Drop by to see their settings in full detail.
"After having a few weeks to play around with Intel's new Kaby Lake architecture Core i7-7700K processors, we finally have some results that we want to discuss when it comes to overclocking and the magic 5GHz many of us are looking for, and what we think your chances are of getting there yourself."
Here are some more Processor articles from around the web:
- Intel's Core i7-7700K 'Kaby Lake' CPU @ The Tech Report
- Intel Kaby Lake i7-7700K & i5-7600K Review @ Hardware Canucks
- Intel Core i7-7700K vs 6700K: 22 Games, RX 480 & GTX 1080 @ techPowerUp
- ntel Kaby Lake Core i7-7700K Performance & Z270 Chipset Overview @ Techgage
- Intel 7th Generation Core i7 7700K Processor Review @ OCC
- Intel Kaby Lake Core i7-7700K IPC @ [H]ard|OCP
- Core i5-6400 @ Hardware Secrets
- FX-4300 @ Hardware Secrets
- AMD's New Ryzen CPU - SMT and IPC @ [H]ard|OCP
It probably doesn't surprise any of our readers that there has been a tepid response to the leaks and reviews that have come out about the new Core i7-7700K CPU ahead of the scheduled launch of Kaby Lake-S from Intel. Replacing the Skylake-based 6700K part as the new "flagship" consumer enthusiast CPU, the 7700K has quite a bit stacked against it. We know that Kaby Lake is the first in the new sequence of tick-tock-optimize, and thus there are few architectural changes to any portion of the chip. However, that does not mean that the 7700K and Kaby Lake in general don't offer new capabilities (HEVC) or performance (clock speed).
The Core i7-7700K is in an interesting spot as well with regard to motherboards and platforms. Nearly all motherboards that run the Z170 chipset will be able to run the new Kaby Lake parts without requiring an upgrade to the newly released Z270 chipset. However, the likelihood that any user on a Z170 platform today using a Skylake processor will feel the NEED to upgrade to Kaby Lake is minimal, to say the least. The Z270 chipset only offers a couple of new features compared to last generation, so the upgrade path is again somewhat limited in excitement.
Let's start by taking a look at the Core i7-7700K and how it compares to the previous top-end parts from the consumer processor line and then touch on the changes that Kaby Lake brings to the table.
With the beginning of CES just days away (as I write this), Intel is taking the wrapping paper off of its first gift of 2017 to the industry. As you can see from the slide above, more than just the Kaby Lake-S consumer socketed processors are launching today, but other components including Iris Plus graphics implementations and quad-core notebook implementations will need to wait for another day.
For DIY builders and OEMs, Kaby Lake-S, now known as the 7th Generation Core Processor family, offer some changes and additions. First, we will get a dual-core HyperThreaded processor with an unlocked designation in the Core i3-7350K. Other than the aforementioned Z270 chipset, Kaby Lake will be the first platform compatible with Intel Optane memory. (To be extra clear, I was told that previous processors will NOT be able to utilize Optane in its M.2 form factor.)
Though we have already witnessed Lenovo announcing products using Optane, this is the first official Intel discussion about it. Optane memory will be available in M.2 modules that can be installed on Z270 motherboards, improving snappiness and responsiveness. It seems this will be launched later in the quarter as we don't have any performance numbers or benchmarks to point to demonstrating the advantages that Intel touts. I know both Allyn and I are very excited to see how this differs from previous Intel caching technologies.
|Core i7-7700K||Core i7-6700K||Core i7-5775C||Core i7-4790K||Core i7-4770K||Core i7-3770K|
|Architecture||Kaby Lake||Skylake||Broadwell||Haswell||Haswell||Ivy Bridge|
|Socket||LGA 1151||LGA 1151||LGA 1150||LGA 1150||LGA 1150||LGA 1155|
|Base Clock||4.2 GHz||4.0 GHz||3.3 GHz||4.0 GHz||3.5 GHz||3.5 GHz|
|Max Turbo Clock||4.5 GHz||4.2 GHz||3.7 GHz||4.4 GHz||3.9 GHz||3.9 GHz|
|Memory Speeds||Up to 2400 MHz||Up to 2133 MHz||Up to 1600 MHz||Up to 1600 MHz||Up to 1600 MHz||Up to 1600 MHz|
|Cache (L4 Cache)||8MB||8MB||6MB (128MB)||8MB||8MB||8MB|
|System Bus||DMI3 - 8.0 GT/s||DMI3 - 8.0 GT/s||DMI2 - 6.4 GT/s||DMI2 - 5.0 GT/s||DMI2 - 5.0 GT/s||DMI2 - 5.0 GT/s|
|Graphics||HD Graphics 630||HD Graphics 530||Iris Pro 6200||HD Graphics 4600||HD Graphics 4600||HD Graphics 4000|
|Max Graphics Clock||1.15 GHz||1.15 GHz||1.15 GHz||1.25 GHz||1.25 GHz||1.15 GHz|
Subject: General Tech | November 5, 2016 - 07:01 AM | Scott Michaud
Tagged: Samsung, euv, 7nm, 14nm, 10nm
As the comments usually remind us, the smallest feature size varies in interpretation from company to company, and node to node. You cannot assume how Samsung compares with Intel, GlobalFoundries, or TSMC based on the nanometer rating alone, better or worse. In fact, any specific fabrication process, when compared to another one, might be better in some ways yet worse in others.
With all of that in mind, Samsung has announced the progress they've made with 14nm, 10nm, and 7nm fabrication processes. First, they plan to expand 14nm production with 14LPU. I haven't been able to figure out what this specific branding stands for, but I'm guessing it's something like “Low Power Ultra” given that it's an engineering name and those are usually super literal (like the other suffixes).
As for the other suffixes, Samsung begins manufacturing nodes with Low Power Early (LPE). From there, they improve upon their technique, providing higher performance and/or lower power, and call this new process Low Power Plus (LPP). LPC, which I believe stands for something like Low Power Cost, although I haven't seen this acronym officially expanded, removes a few manufacturing steps to make the end product cheaper. LPU is an extension of LPC with higher performance. Add the appropriate acronym as a suffix to the claimed smallest feature size, and you get the name of the node: xxLPX.
14LPU is still a ways out, though. Their second announcement, 10LPU, is expected to be their cost-reduction step for 10nm, which I interpret to mean they are omitting LPC from their 10nm production. You may think this is very soon, given how 10LPE has just started mass production a few weeks ago. Really, this is a quite early announcement in terms of overall 10nm production. The process design kits (PDKs) for both 14LPU and 10LPU, which are used by hardware vendors to design their integrated circuits, won't ship until 2Q17. As such, products will be a while behind that.
To close out, Samsung reiterated that 7nm is planned to use extreme ultraviolet lithography (EUV). They have apparently created a wafer using 7nm EUV, but images do not seem to be provided.
Development kits for 14LPU and 10LPU are expected to ship in the second quarter of 2017.
Subject: Processors | September 2, 2016 - 01:39 AM | Tim Verry
Tagged: IBM, power9, power 3.0, 14nm, global foundries, hot chips
Earlier this month at the Hot Chips symposium, IBM revealed details on its upcoming Power9 processors and architecture. The new chips are aimed squarely at the data center and will be used for massive number crunching in big data and scientific applications in servers and supercomputer nodes.
Power9 is a big play from Big Blue, and will help the company expand its precense in the Intel-ruled datacenter market. Power9 processors are due out in 2018 and will be fabricated at Global Foundries on a 14nm HP FinFET process. The chips feature eight billion transistors and utilize an “execution slice microarchitecture” that lets IBM combine “slices” of fixed, floating point, and SIMD hardware into cores that support various levels of threading. Specifically, 2 slices make an SMT4 core and 4 slices make an SMT8 core. IBM will have Power9 processors with 24 SMT4 cores or 12 SMT8 cores (more on that later). Further, Power9 is IBM’s first processor to support its Power 3.0 instruction set.
According to IBM, its Power9 processors are between 50% to 125% faster than the previous generation Power8 CPUs depending on the application tested. The performance improvement is thanks to a doubling of the number of cores as well as a number of other smaller improvements including:
- A 5 cycle shorter pipeline versus Power8
- A single instruction random number generator (RNG)
- Hardware assisted garbage collection for interpreted languages (e.g. Java)
- New interrupt architecture
- 128-bit quad precision floating point and decimal math support
- Important for finance and security markets, massive databases and money math.
- IEEE 754
- CAPI 2.0 and NVLink support
- Hardware accelerators for encryption and compression
The Power9 processor features 120 MB of direct attached eDRAM that acts as an L3 cache (256 GB/s). The chips offer up 7TB/s of aggregate fabric bandwidth which certainly sounds impressive but that is a number with everything added together. With that said, there is a lot going on under the hood. Power9 supports 48 lanes of PCI-E 4.0 (2 GB/s per lane per direction), 48 lanes of proprietary 25Gbps accelerator lanes – these will be used for NVLink 2.0 to connect to NVIDIA GPUs as well as to connect to FPGAs, ASICs, and other accelerators or new memory technologies using CAPI 2.0 (Coherent Accelerator Processor Interface) – , and four 16Gbps SMP links (NUMA) used to combine four quad socket Power9 boards into a single 16 socket “cluster.”
These are processors that are built to scale and tackle the big data problems. In fact, not only is Google interested in Power9 to power its services, but the US Department of Energy will be building two supercomputers using IBM’s Power9 CPUs and NVIDI’s Volta GPUs. Summit and Sierra will offer between 100 to 300 Petaflops of computer power and will be installed at Oak Ridge National Laboratory and Lawrence Livermore National Laboratory respectively. There, some of the projects they will tackle is enabling the researchers to visualize the internals of a virtual light water reactor, research methods to improve fuel economy, and delve further into bioinformatics research.
The Power9 processors will be available in four variants that differ in the number of cores and number of threads each core supports. The chips are broken down into Power9 SO (Scale Out) and Power9 SU (Scale Up) and each group has two processors depending on whether you need a greater number of weaker cores or a smaller number of more powerful cores. Power9 SO chips are intended for multi-core systems and will be used in servers with one or two sockets while Power9 SU chips are for multi-processor systems with up to four sockets per board and up to 16 total sockets per cluster when four four socket boards are linked together. Power9 SO uses DDR4 memory and supports a theoretical maximum 4TB of memory (1TB with today’s 64GB DIMMS) and 120 GB/s of bandwidth while Power9 SU uses IBM’s buffered “Centaur” memory scheme that allows the systems to address a theoretical maximum of 8TB of memory (2TB with 64GB DIMMS) at 230 GB/s. In other words, the SU series is Big Blue’s “big guns.”
A photo of the 24 core SMT4 Power9 SO die.
Here is where it gets a bit muddy. The processors are further broken down by an SMT4 or SMT8 and both Power9 SO and Power9 SU have both options. There are Power9 CPUs with 24 SMT4 cores and there are CPUs with 12 SMT8 cores. IBM indicated that SMT4 (four threads per core) was suited to systems running Linux and virtualization with emphasis on high core counts. Meanwhile SMT8 (eight threads per core) is a better option for large logical partitions (one big system versus partitioning out the compute cluster into smaller VMs as above) and running IBM’s Hypervisor. In either case (24 SMT4 or 12 SMT8) there is the same number of total threads, but you are able to choose whether you want fewer “stronger” threads on each core or more (albeit weaker) threads per core depending on which you workloads are optimized for.
Servers supporting Power9 are already under development by Google and Rackspace and blueprints are even available from the OpenPower Foundation. Currently, it appears that Power9 SO will emerge as soon as the second half of next year (2H 2017) with Power9 SU following in 2018 which would line up with the expected date for the Summit and Sierra supercomputer launches.
This is not a chip that will be showing up in your desktop any time soon, but it is an interesting high performance processor! I will be keeping an eye on updates from Oak Ridge lab hehe.