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AMD Ryzen 5 2500U APU With Vega Graphics Spotted in Geekbench Benchmarks

Subject: General Tech | September 16, 2017 - 03:32 AM |
Tagged: Zen, Vega, ryzen 5, ryzen, raven ridge, APU, amd

Back in May AMD made Ryzen Mobile official indicating that the APUs previously known as "Raven Ridge" would be launching in the second half of 2017. As that launch window closes, more details are starting to trickle out including benchmarks scores. The latest appearance of Raven Ridge is in a Geekbench benchmark score results page where a "Ryzen 5 2500U" APU achieves a single core score of 3,561 and a multi-core score of 9,421. These are fairly impressive results on their own, but especially considering that Ryzen Mobile chips are reportedly using up to 50% less power versus last generation Bristol Ridge processors while handily beating them in performance offered.

AMD has previously claimed that its Ryzen Mobile (Raven Ridge) APUs will offer up to 50% more CPU performance and 40% more GPU performance compared to its 7th Generation APUs. The leaked Geekbench scores seem to back up those claims (for the most part) with the Ryzen 5 2500U scoring slightly above 36% better single core performance and 48% better multi-core performance compared to the AMD A12-9800 APU with the latter being due primarily to the addition of SMT to the processor design allowing for twice the number of CPU threads (eight total). The performance improvements are also due to the move from Excavator to a Zen-based design on a smaller more power efficient process node. What is most impressive about this mobile part is that it is that much faster than a 65W quad core (4 core / 4 thread) desktop Bristol Ridge APU clocked at 3.8 GHz base and 4.2 GHz boost while using approximately half the power!

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The Geekbench benchmark is only one data point, but is still a positive sign. One thing it does not reveal is clockspeed as while it lists 2.0 GHz that number is likely only the base and not the maximum boost frequency. Further, details on the Vega-based GPU are still unknown although the Infinity Fabric should help tremendously in reducing the bottleneck and keeping the on die GPU fed with data while gaming especially when paired with fast dual channel memory or HBM (I just hope that Ryzen Mobile is not held back like previous generation mobile APUs were with laptop manufacturers pairing them with single channel memory setups). We also do not know officially the number of stream processors that will be included in any of the Vega GPUs used in Ryzen Mobile with past rumors going up to 1024 SPs (mobile parts will likely be capped at 512 or 768 at the extreme). AMD claims that Ryzen Mobile will offer up to 40% more GPU performance, which to me suggests that we will possibly see higher GPU core counts but for the most part performance improvements are going to come from architecture improvements.

I am really interested to see how Raven Ridge plays out and hope that it is one step closer to finally realizing that HSA future AMD has been promsing me for years!

Also read: AMD Teases Ryzen Mobile APUs with Zen CPU Cores and On-Die Vega Graphics

Source: Guru3D

Intel Technology and Manufacturing Day in China

Subject: General Tech | September 19, 2017 - 11:33 PM |
Tagged: Intel, China, cannon lake, coffee lake, 10nm, 14nm+, 14nm++, 22FFL, GLOBALFOUNDRIES, Samsung, 22FDX

Today in China Intel is holding their Technology and Manufacturing Day. Unlike previous "IDF" events this appears to be far more centered on the manufacturing aspects of Intel's latest process nodes. During presentations Intel talked about their latest steps down the process ladder to smaller and smaller geometries all the while improving performance and power efficiency.
 
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Mark Bohr presenting at Intel Technology and Manufacturing Day in China. (Image courtesy of Intel Corporation)
 
It really does not seem as though 14nm has been around as long as it has, but the first Intel products based on that node were released in the 2nd half of 2014.  Intel has since done further work on the process. Today the company talked about two other processes as well as products being made on these nodes.
 
The 10nm process has been in development for some time and we will not see products this year. Instead we will see two product cycles based on 14nm+ and 14nm++ parts. Intel did show off a wafer of 10nm Cannon Lake dies. Intel claims that their 10nm process is still around 3 years more advanced than the competition. Other foundry groups have announced and shown off 10nm parts, but overall transistor density and performance does not look to match what Intel has to offer.
 
We have often talked about the marketing names that these nodes have been given, and how often their actual specifications have not really lived up to the reality. Intel is not immune to this, but they are closer to describing these structures than the competition. Even though this gap does exist, competition is improving their products and offering compelling solutions at decent prices so that fabless semi firms can mostly keep up with Intel.
 
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Nothing like handling a 10nm Cannon Lake wafer with bare hands! (Image courtesy of Intel Corporation)
 
A new and interesting process is being offered by intel in the form of 22FFL. This is an obviously larger process node, but it is highly optimized for low power operation with far better leakage characteristics than the previous 22nm FF process that Intel used all those years ago. This is aimed at the ultra-mobile devices with speeds above 2 GHz. This seems to be a response to other low power lines like the 22FDX product from GLOBALFOUNDRIES. Intel did not mention potential RF implementations which is something of great interest from those also looking at 22FDX.
 
Perhaps the biggest news that was released today is that of Intel Custom Foundry announcing and agreement with ARM to develop and implement those CPUs on the upcoming 10nm process. This can have a potentially huge impact depending on the amount of 10nm line space that Intel is willing to sell to ARM's partners as well as what timelines they are looking at to deliver products. ARM showed off a 10nm test wafer of Cortex-A75 CPUs. The company claims that they were able to design and implement these cores using industry standard design flows (automated place and route, rather than fully custom) and achieving performance in excess of 3 GHz.
 
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Gus Yeung of ARM holding a 10nm Cortex-A75 based CPUs designed by Intel. (Image courtesy of Intel Corporation)
 
Intel continues to move forward and invest a tremendous amount of money in their process technology. They have the ability to continue at this rate far beyond that of other competitors. Typically the company does a lot of the heavy lifting with the tools partners, which then trickles down to the other manufacturers. This has allowed Intel to stay so far ahead of the competition, and with the introduction of 14nm+, 14nm++, and 10nm they will keep much of that lead. Now we must wait and see what kind of clockspeed and power performance we see from these new nodes and how well the competition can react and when.

EPYC headed for the top of the charts!

Subject: Systems | September 19, 2017 - 06:57 PM |
Tagged: 7351P, amd, EPYC

Patrick Kennedy of Serve The Home has just published his server-centric test EPYC test results and in his own words, "while AMD is very competitive at the high-end, its mainstream offerings are competing with de-featured Xeon Silver CPUs and absolutely obliterate what Intel is offering."

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The EPYC 7351P, which should sell for roughly $750 was tested against Intel's Xeon Silver 4108 which runs about $440 in various server applications such as GROMACS, OpenSSL and even a chess benchmark.  The tests were done with single socket EPYCs, the "P" series, which are offered at a significant discount when compared to AMD's dual socket family; benchmarked against Intel's Xeon Silver in both single and dual socket configurations.  The only time that the Xeon's performance came close to the single socket 7351P were when they were configured in dual socket systems, even then AMD's EPYC chip came out on top, often by a significant margin.

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Raw performance is not the only advantage AMD offers on EPYC, the feature sest also far outstrips the somewhat watered down Xeon Silver family.  The single socket 7351P offers 128 PCIe lanes while a dual socket Xeon Silver can only offer 96 and EPYC can handle up to 2TB of DDR4-2666 in its eight channel memory controller whereas Intel is limited to 1.5TB DDR4-2400 in a dual socket server nor can it support dual AVX-512 nor Omni-Path fabric.

Intel does have some advantages that come with the maturity of their platform, including superb NVMe hotswap support as well as QuickAssist and they do have higher end Xeon Gold chips which include the aforementioned features that the Xeon Silver line lacks, however they are also significantly more expensive than EPYC. 

You can expect more tests to appear in the future as STH invested a lot of money in new hardware to test and as the tests can take days to complete there will be some delay before they have good data to share.  It is looking very positive for AMD's EPYC family, they offer an impressive amount of value for the money and it will be interesting to see how Intel reacts.

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EPYC Linux performance from AMD

Subject: Processors | September 18, 2017 - 05:13 PM |
Tagged: linux, EPYC 7601, EPYC

Phoronix have been hard at work testing out AMD's new server chip, specifically the 2.2/2.7/3.2GHz EPYC 7601 with 32 physical cores.  The frequency numbers now have a third member which is the top frequency all 32 cores can hit simultaneously, for this processor that would be 2.7GHz.  Benchmarking server processors is somewhat different from testing consumer CPUs, gaming performance is not as important as dealing with specific productivity applications.   Phoronix started their testing of EPYC, in both NUMA and non-NUMA configurations, comparing against several Xeon models and the performance delta is quite impressive, sometimes leaving even a system with dual Xeon Gold 6138's in the dust.  They also followed up with a look at how EPYC compares to Opteron, AMD's last server offerings.  The evolution is something to behold.

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"By now you have likely seen our initial AMD EPYC 7601 Linux benchmarks. If you haven't, check them out, EPYC does really deliver on being competitive with current Intel hardware in the highly threaded space. If you have been curious to see some power numbers on EPYC, here they are from the Tyan Transport SX TN70A-B8026 2U server. Making things more interesting are some comparison benchmarks showing how the AMD EPYC performance compares to AMD Opteron processors from about ten years ago."

Here are some more Processor articles from around the web:

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Source: Phoronix

More Threadripper waterblocks, including an unfamiliar name

Subject: Cases and Cooling | September 19, 2017 - 03:59 PM |
Tagged: XSPC, water cooler, Threadripper, RayStorm Neo, Bykski, amd, A-RYZEN-Th-X

[H]ard|OCP have been hard at work testing a variety of Threadripper compatible AIO watercoolers, sometimes with their own adapters as these products are very new.  They just revisited the XSPC RayStorm Neo which performed exceptionally and also note that the retail version will not feature mounting for AM4 processors.  The second waterblock they tested was the Bykski A-RYZEN-Th-X, not a familiar name but also a very effective choice for cooling ThreadRipper processors.  Take a look at the testing process as well as their recommended methods for properly spreading thermal paste on AMD's new big silicon.

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"We have been waiting for AMD Threadripper CPU custom cooling parts to make their way to us. We have our first two purpose-built Threadripper waterblocks from XSPC and Bykski. We put both these coolers to the test with our 4GHz overclocked Threadripper in hour long stress tests to see how our temperatures fare."

Here are some more Cases & Cooling reviews from around the web:

CASES & COOLING

 

Source: [H]ard|OCP

Podcast #468 - AMD Raven Ridge rumors, Intel and Global Foundries new fabrication technology!

Subject: General Tech | September 21, 2017 - 12:43 PM |
Tagged: z270, windows 10, WD, video, toshiba, ShadowPlay, ryzen, podcast, nvidia, nuc, msi, max-q, Intel, gs63vr, GLOBALFOUNDRIES, gigabyte, EPYC, ansel, 2500U, 12TB

PC Perspective Podcast #468 - 09/21/17

Join us for discussion on AMD Raven Ridge rumors,  Intel and Global Foundries new fabrication technology!

You can subscribe to us through iTunes and you can still access it directly through the RSS page HERE.

The URL for the podcast is: http://pcper.com/podcast - Share with your friends!

Hosts: Ryan Shrout, Josh Walrath, Sebastion Peak, Allyn Malventano

Peanut Gallery: Ken Addison, Alex Lustenberg

Program length: 1:39:59

Podcast topics of discussion:
  1. Week in Review:
  2. News items of interest:
  3. Hardware/Software Picks of the Week
  4. Closing/outro

Subscribe to the PC Perspective YouTube Channel for more videos, reviews and podcasts!!

Source:

Raven Ridge rumours

Subject: General Tech | September 18, 2017 - 04:17 PM |
Tagged: amd, raven ridge, Bristol Ridge, Ryzen 5 2500U, Zen, Vega, 14nm

If the rumours are true, the new 14nm Raven Ridge based AMD Ryzen 5 2500U will offer an impressive jump in performance compared to AMD's current generation of APUs.  The Inquirer's source suggests the new APU will offer a 50% jump in single threaded performance and an impressive 90% advantage on multi-threaded performance.  The multithreaded performance improvement may be the headline but seeing a huge increase in single threaded applications, AMD's recent Achilles Heel, shows some interesting improvements to Zen.  This will also mark the arrival of their first APU with Vega onboard, so you can expect better graphics performance as well.  The benchmark numbers and links are here.

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"LEAKED BENCHMARKS for AMD's forthcoming Raven Ridge APUs suggest that upcoming devices, expected to be launched in time for Christmas, will outperform current Bristol Ridge APUs by up to 90 per cent on multicore applications."

Here is some more Tech News from around the web:

Tech Talk

Source: The Inquirer

Western Digital Launches 12TB Gold Hard Drive To Consumers

Subject: Storage | September 18, 2017 - 09:35 PM |
Tagged: western digital, wd gold, TLER, enterprise, datacenter

Western Digital has a new mechanical hard drive for your treasure trove of digital data. Utilizing fourth generation HelioSeal technology and eight PMR platters to fit 1.5TB of data per platter, the WD121KRYZ has a capacity of 12TB and features quite a few enterprise technologies to improve reliability and reduce data loss.

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The WD Gold 12TB drive is an eight-platter 3.5" drive spinning at 7200RPM paired with 256 MB of cache and featuring a SATA III interface. The helium sealed hard drive uses a dual stage actuator head positioning system that can adjust the fly height of the read-write heads in real time. Enterprise focused features include RAFF to monitor and correct linear and rotational vibrations and TLER to protect the integrity of a RAID array. The vibration monitoring Is overkill for a desktop PC or even a NAS, but can be useful in a datacenter environment where hundreds of drives are packed together. The time limited error recovery technology ensures that bad sectors do not cause a RAID rebuild to fail (and Allyn has a more in-depth explanation here).

The WD Gold 12TB is built for continuous operation with an annual workload rate of 550TB running 24/7 with a 5-year warranty and 2.5 million hours MTBF. The maximum sustained transfer is 255 MB/s. The digital hoarder’s dream is available for $521.99 from Western Digital which works out to $0.0435 / GB. If you do not want to wait for a Red Pro 12TB variant (there does not appear to be one available and WD only recently launched 10TB models), the Gold series drive might be a good option with a better warranty and lower error rate.

Also read:

NUC-kle up Baby, we're off to Hades Canyon!

Subject: General Tech | September 20, 2017 - 01:39 PM |
Tagged: nuc, kaby lake h, Intel, Hades Canyon VR, Hades Canyon

CNXSoft were granted a look at upcoming Intel NUC models this morning, including the next generation of systems, dubbed Hades Canyon, with a variety of other Canyons as well.  The most interesting are the top models, powered by Kaby Lake H and a discrete GPU, the NUCxi7HVK aka Hades Lake VR and NUCxi7HNK which is Hades Lake without VR.  Those two models will support for up to six displays and offer two Thunderbolt 3 ports, a pair of PCIe SSDs as well as support for Intel Optane.  All of these features could require a slightly larger footprint than we are used to with NUCs especially considering the dGFX.  Head on over for more details on the other NUC models you can expect to see in the coming years. 

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"Intel’s new generation of Gemini Lake and Coffee Lake processors is expected to launch at the end of this year, beginning of next, and this morning I received Intel’s NUC roadmap that gives a good idea of what’s coming in 2018 and 2019."

Here is some more Tech News from around the web:

Tech Talk

Source: CNXSoft

GLOBALFOUNDRIES Technical Conference Releases

Subject: General Tech | September 20, 2017 - 09:44 PM |
Tagged: GLOBALFOUNDRIES, FinFET, FD-SOI, 12nm, 14nm, 14nm+, 22FDX, 28FDX, 12FDX, amd, Vega, ryzen

The day after Intel had its Technology and Manufacturing expo in China, GLOBALFOUNDRIES kicks off their own version of the event and has made a significant number of announcements concerning upcoming and next generation process technologies. GF (GLOBALFOUNDRIES) had been the manufacturing arm of AMD until it was spun off as its own entity in 2009. Since then GF has been open to providing fabless semiconductor firms a viable alternative to TSMC and other foundries. Their current 14nm process is licensed from Samsung, as GF had some significant issues getting their own version of that technology into production. GF looks to be moving past their process hiccups in getting to FinFET technologies as well as offering other more unique process nodes that will serve upcoming mobile technologies very well.
 
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The big announcement today was the existence of the 12LP process. This is a "12 nm" process that looks to be based off of their previous 14nm work. It is a highly optimized variant that offers around 15% better density and 10% better performance than current 14/16nm processes from competing firms. Some time back GF announced that it would be skipping the 10nm node and going directly to 7nm, but it seems that market forces have pushed them to further optimize 14nm and offer another step.  Regular process improvement cadences are important to fabless partners as they lay out their roadmaps for future products.
 
12FP is also on track to be Automotive Grade 2 Certified by Q4 2017, which opens it up to a variety of automotive applications. Self-driving cars are the hot topic these days and it appears as though GF will be working with multiple manufacturers including Tesla. The process also has an RF component that can be utilized for those designs.
 
There had been some questions before this about what GF would do between 14nm and their expected 7nm offering. AMD had previously shown a roadmap with the first generation Zen being offered on 14nm and a rather nebulous sounding 14nm+ process. We now know that 12LP is going to be the process that AMD leverages for Zen and Vega refreshes next year. GF is opening up risk production in 1H 2018 for early adopters. This typically means that tuning is still going on with the process, and wafer agreements tend to not hinge on "per good die". Essentially, just as the wording suggest, the monetary risks of production fall more on the partner rather than the foundry. I would expect the Zen/Vega refreshes to start rolling out mid-Summer 2018 if all goes well with 12LP.
 
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RF is getting a lot of attention these days. In the past I had talked quite a bit about FD-SOI and the slow adoption of that technology. In the 5G world that we are heading to, RF is becoming far more important. Currently GF has their 28FDX and 22FDX processes which utilize FD-SOI (Fully Depleted Silicon On Insulator). 22FDX is a dual purpose node that can handle both low-leakage ASICs as well as RF enabled products (think cell-phone modems). GF has also announced a new RF centric process node called 8SW SOI. This is a 300mm wafer based technology at Fab 10 located in East Fishkill, NY. This was once an IBM fab, but was eventually "given" to GF for a variety of reasons. The East Fishkill campus is also a center for testing and advanced process development.
 
22FDX is not limited to ASIC and RF production. GF is announcing that it is offering eMRAM (embedded magnetoresistive non-volatile memory) support. GF claims that ic an retain data through a 260C solder reflow while retaining data for more than 10 years at 125C. These products were developed through a partnership with Everspin Technologies. 1Gb DDR MRAM chips have been sampled and 256Mb DDR MRAM chips are currently available through Everspin. This technology is not limited to standalone chips and can be integrated into SOC designs utilizing eFlash and SRAM interface options.
 
GLOBALFOUNDRIES has had a rocky start since it was spun off from AMD. Due to aggressive financing from multiple sources it has acquired other pure play foundries and garnered loyal partners like AMD who have kept revenue flowing. If GF can execute on these new technologies they will be on a far more even standing with TSMC and attract new customers. GF has the fab space to handle a lot of wafers, but these above mentioned processes could be some of their first truly breakthrough products that differentiates itself from the competition.

NVIDIA news; Ansel and ShadowPlay walk into Mordor

Subject: General Tech, Graphics Cards | September 20, 2017 - 06:21 PM |
Tagged: nvidia, ShadowPlayk, ansel, battlegrounds, shadow of mordor

Gamescom 2017 just wrapped up and NVIDIA made a few interesting announcements during the conference.  For those enjoying PlayerUnknown’s Battlegrounds, they announced the game now fully supports ShadowPlay Highlights along with the newly released Lawbreakers.  That means you can capture all your gameplay in 4K 60 FPS, with either always-on or manual saving, and built-in uploading tools.

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In addition to video capture of gameplay, their Ansel screen capture tool for the artistically inclined has also been updated.  Ansel now works in 25 titles, from The Witcher 3 through Hellblade: Senua’s Sacrifice to new genres like Pro Evolution Soccer 2018 so you can truly show that the 'injured' player lying on the turf truly did take a dive.  NVIDIA reports that you will be able to capture super-resolution, 360-degree, HDR, and stereo photographs in games developed in either the Unity Engine or the Unreal Engine as Ansel will now be provided as an add-in for those game engines.

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Last but not least is a giveaway.  NVIDIA will be giving away 50,000 Middle Earth: Shadow of Mordor game codes to GeForce Experience community members!  You do have to sign up to win but once you are a member of GFE you are automagically entered to win.  They will message you in app on Sept 26th to let you know if you are a winner so you can still sign up if you are interested.  It will also support Ansel, if you run across a photogenic orc beheading you want to share.

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As a reminder, the offer for any who purchases of select GeForce GTX 1080 Ti or 1080 GPUs, as well as systems and laptops containing the same will get Destiny 2 on the PC launch date.

 

Source: NVIDIA

Corsair Overclocks With a Vengeance, Launches DDR4 4600 MHz Memory Kit

Subject: Memory | September 21, 2017 - 11:46 AM |
Tagged: X399, ryzen, overclocking, Intel X299, ddr4-4600, ddr4, corsair

Corsair has launched a new Vengeance LPX DDR4 memory kit that is capable of hitting 4600 MHz at 1.5 volts. The new kit is a 16GB (2 x 8GB) kit that Corsair reportedly co-developed with AsRock for fine tune using their X299 OC Formula motherboard. The DDR4 kit is made using hand sorted Samsung B-dies and it supports Intel XMP 2.0 standards allowing it to clock at 4600 MHz with a single setting change in the UEFI.

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The Vengeance LPX DIMMs run with CAS timings of 19-26-26-46 and need only 1.5V to clock at 4600 MHz. This kit will be ideal for Intel’s X299 as well as AMD’s X399 platforms. While Ryzen and Threadripper platforms may need a bit more tweaking to get working, they would benefit the most from the higher clocked memory allowing the Infinity Fabric to clock higher.

Being one of the highest factory clocked DIMMs, they come at a cost. The new RAM kit (CMK16GX4M2F4600C19) is available now for $549.99 with a lifetime limited warranty.

For something a bit more tame, earlier this week Corsair launched a 2 x 8GB kit (CMK16GX4M2F4500C19) clocked at 4500 MHz with CL19-19-19-39 timings (at 1.45V) that is also available now for $479.99 MSRP. Enthusiasts might be better off buying the cheaper kit and overclocking them (though not guaranteed and might need a bit more than 1.5V) while workstation and enterprise customers with corporate expense accounts can opt for the more expensive but factory clocked 4600 MHz kit.

At time of writing the new kits were not up on Amazon yet, but they should be shortly. You can find the cheaper 4500 MHz kit on Corsair's web store but it is listed at $504.99 currently. If you wait a bit, that price should go down closer to MSRP as other retailers put up their listings.

Source: TechPowerUp

IBC 2017: AMD Radeon Pro Graphics Cards Will Support External Graphics Card (eGPU) Docks

Subject: Graphics Cards | September 16, 2017 - 01:43 AM |
Tagged: WX 7100, Radeon Pro WX 5100, radeon pro, prorender, amd

At IBC 2017 (International Broadcasting Convention) in Amsterdam AMD made several announcements surrounding its Radeon Pro graphics cards for workstations. The graphics cards, which are aimed at professionals and replace the FirePro lineup, are now shipping to AMD customers with the Radeon Pro WX 5100 and WX 7100 available now and the higher end Radeon Pro WX 9100 and Radeon Pro SSG available from distributors and systems partners starting at the end of this quarter. The former two (the WX 5100 and WX 7100) carry a SEP (suggested e-tail price) of $499 and 799 respectively and are now officially support usage in external graphics setups (eGPU) for use with mobile workstations that can connect to an external graphics dock with the Pro series GPUs for things like 4K video editing and rendering on-the-go.

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Currently AMD is partnered with Sonnet Technologies for the eGPU support and the Radeon Pro graphics cards fully support docks such as the Sonnet eGFX Breakaway Box. Of course, being able to plug into the raw computing horsepower does not mean much if it cannot be effectively utilized, and to that end AMD revealed several software design wins including the integration of its cross-platform OpenCL-based ray tracing renderer Radeon ProRender into MAXON Cinema 4D Release 19. ProRender is supported in the Adobe After Effects integration of Cinema 4D R19, and it is the first major application to implement it. Further, the Foundry Nuke 11 and Avid Media Composer 8.9 are also able to see performance improvements in effects rendering by using OpenCL-based programming techniques to harness GPU horsepower.

Finally, AMD casually reiterated another big design with for its professional series graphics cards with Radeon Pro Vega being used in the iMac Pro coming later this year. Considering the professional market is where the big money is to be made when it comes to graphics cards it is nice to see AMD making inroads with its revamped professional lineup and continuing to push for the cross platform OpenCL-based GPGPU technologies to be supported by the major software developers. Not much major news coming out of IBC from AMD (no new hardware revealed), but good news nonetheless.

Source: AMD

PCPer Mailbag #10 - 9/22/2017

Subject: Editorial | September 22, 2017 - 09:00 AM |
Tagged: video, Ryan Shrout, pcper mailbag, pcper

It's Friday, which means it's time for PC Perspective's weekly mailbag, our video show where Ryan and team answer your questions about the tech industry, the latest and greatest hardware, the process of running a tech review website, and more!

Here's what you'll find on today's show:

00:22 - PCPer Mailbag audio podcast?
01:14 - Games with DirectX, OpenGL, and Vulkan?
02:44 - Where are the AMD-based laptops?
06:51 - Does faster RAM = higher IPC?
08:28 - Using an iGPU with a discrete GPU?
10:55 - Why are Vega GPUs still so expensive?
14:41 - Do you need to reinstall Windows after upgrading CPU?
16:48 - How to minimize screen tearing without G-SYNC?
18:58 - Dummy dies and 32-core/64-thread Threadripper parts?
22:14 - The Cincinnati Bengals offense?

Be sure to subscribe to our YouTube Channel to make sure you never miss our weekly reviews and podcasts, and please consider supporting PC Perspective via Patreon to help us keep videos like our weekly mailbag coming!

Source: YouTube

Texting troubles with 2FA

Subject: General Tech | September 19, 2017 - 02:07 PM |
Tagged: security, sms, 2fa

Two factor authentication is the way to go when dealing with important information online, unfortunately the most common way of enabling 2FA has proven rather vulnerable.  With just your name, surname and phone number an unsavoury type could use a vulnerability on cellular networks to gain access to your accounts.  The example given over at Slashdot is of a Coinbase wallet with 2FA, registered with a Gmail address also protected by 2FA, which the security researchers easily took control of.  Take a look at the article for more details on the SS7 network vulnerabilities this attack exploits as well as better ways of making use of 2FA. 

If you do intend to continue to use SMS as part of your 2FA, at least consider disabling the feature on your phone which allows you to breifly read a text without unlocking your phone.

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"The report notes of several ways you can protect yourself from this sort of attack: "On some services, you can revoke the option for SMS two-factor and account recovery entirely, which you should do as soon as you've got a more secure app-based method established. Google, for instance, will let you manage two-factor and account recovery here and here; just set up Authenticator or a recovery code, then go to the SMS option for each and click 'Remove Phone.'"

Here is some more Tech News from around the web:

Tech Talk

 

Source: Slashdot

Divinity: Original Sin 2 arrives

Subject: General Tech | September 20, 2017 - 02:13 PM |
Tagged: gaming, divinity original sin 2

The original game was the first RPG that offered you a chance to argue with yourself, with a unique method of dialogue between the two main characters you played.  It incorporated the environmental effects of spells in a much more effective way than the majority of RPGs, making it wise to dump water on an opponent before zapping them with a lightning bolt.  The quests were often quite unique and the sequel seems to keep that alive, one reviewer at Rock, Paper, SHOTGUN describes how they "ate the meat from the shark’s mouth" as part of the solution to a quest.  If you are looking for a different type of fantasy RPG that will make you smile, cry and scratch your head, often simultaneously, then check out the review and see if you want to pick up the game that launched today.

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"Divinity: Original Sin 2 is out of Early Access and fully released. Adam and John have both spent many, many hours with the alpha, and are now beginning to chew their way through the full version."

Here is some more Tech News from around the web:

Gaming

 

Street View Added to Google Earth VR Desktop

Subject: General Tech | September 17, 2017 - 08:57 PM |
Tagged: google, VR

So this is a bit of a weird one. As our readers are probably well aware, Google Maps offers Street View, which allows you to see 360-degree images from a car as it travels as many roads as it can... since, like, 2007. Also, this year, they are beginning to upgrade the quality of these images with new cars. Now that VR is taking off, it would be kind-of cool to see this data around you. Daydream (and apparently Cardboard) have an app that offers a few locations that you can view... sort-of like you would see in QuickTime in the 90s. Meanwhile, on Oculus, you had Google Earth, which let you see a view that was based on their new 3D Google Maps Satellite view, but it wouldn’t pull in the Street View data.

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Image Credit: Google

Now it will. A couple of days ago, Google updated Google Earth VR to allow teleporting into that spherical image. You will see a preview in a sphere atop your left hand. The weird part, though, is that you can’t travel while within street view. As far as I can tell, you need to jump back to the satellite view, move, then drop back down into street view any time you want to go anywhere. This... makes little sense to me, unless they plan on adding that feature but it just didn’t make this release schedule. It seems like they have all of the pieces scattered across existing software, but it's obviously next-to-impossible to tell for sure from the outside. Perhaps the data linked into the web-based Street View is insufficient for some reason?

Rant aside, if you have a compatible headset (which Steam says is an Oculus Rift or an HTC Vive) then it’s worth a free download to check it out.

Source: Google

Still no good news on the DRAM front

Subject: General Tech | September 22, 2017 - 02:05 PM |
Tagged: DRAM, Samsung, SK Hynix, micron

The change process technology continues to have a negative effect on DRAM supplies and according to the story posted on Electronics Weekly there is no good news in sight.  The three major vendors, Samsung, SK Hynix and Micron are all slowing production as a result of new fabs being built and existing production lines upgraded for new process technology such as EUV.  This will ensure that prices continue to slowly creep up over the remainder of this year and likely into 2018.  Drop by for more information on the challenges each are facing.

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"While overall DRAM demand will remain high in 2018, new fabs being planned will not be ready for mass production until 2019 at the earliest."

Here is some more Tech News from around the web:

Tech Talk

Subject: Motherboards
Manufacturer: GIGABYTE

Introduction and Technical Specifications

Introduction

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Courtesy of GIGABYTE

With the release of Intel Z270 chipset, GIGABYTE unveiled its AORUS line of products. The AORUS branding differentiates the enthusiast and gamer friendly products from other GIGABYTE product lines, similar to how ASUS uses the ROG branding to differentiate their high performance product line. The Z270X-Gaming 8 is one of two "enhanced" boards in the AORUS, factory-customized with a Bitspower designed VRM hybrid water block. The board features the black and white branding common to the AORUS product line, with the rear panel cover and chipset featuring the brand logos. The board is designed around the Intel Z270 chipset with in-built support for the latest Intel LGA1151 Kaby Lake processor line (as well as support for Skylake processors) and Dual Channel DDR4 memory running at a 2400MHz speed. The Z270X-Gaming 8 can be found in retail with an MRSP of $399.99.

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Courtesy of GIGABYTE

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Courtesy of GIGABYTE

GIGABYTE integrated the following features into the Z270X-Gaming 8 motherboard: four SATA III 6Gbps ports; two SATA-Express 10Gbps ports; two U.2 PCIe Gen3 x4 32Gbps ports; two M.2 PCIe Gen3 x4 32Gbps capable ports with Intel Optane support built-in; two RJ-45 GigE ports - an Intel I219-V Gigabit NIC and a Rivet Networks Killer E2500 NIC; a Rivet Networks Killer 802.11ac 2x2 Wireless adapter; four PCI-Express x16 slots; two PCI-Express x1 slots; Creative® Sound Core 3D 8-Channel audio subsystem; integrated DisplayPort and HDMI video ports; Intel Thunderbolt 40Gbps support; G-Chill hybrid VRM water block (designed by Bitspower); and USB 2.0, 3.0, and 3.1 Type-A and Type-C port support.

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Courtesy of GIGABYTE

GIGABYTE partnered with Bitspower in designing the integrated cooling solution for the Z270X-Gaming 8 motherboard. The integrated VRM hybrid block, dubbed G-Chill by GIGABYTE, can operate with or without coolant. The block itself consists of a nickel-plated copper base plate, an acrylic top plate, a metal overplate, and a plastic cover to give it a unified appearance with the rest of the board components. The inlet and outlet ports are sealed with port covers by default, and are G1/4" threaded for use with any after-market water fittings currently available.

Continue reading our preview of the GIGABYTE Z270X-Gaming 8 motherboard!

Extra memory! The EVGA GeForce GTX 1080 Ti FTW3 ELITE

Subject: Graphics Cards | September 22, 2017 - 02:23 PM |
Tagged: GTX 1080 Ti FTW3 ELITE, gtx 1080 ti, evga

EVGA has released a new improved GTX 1080 Ti FTW3 Elite card, with 11GB of GDDR5x, running at 12GHz with a bandwidth of 528.3 GB/s.  The reference card has GDDR5x running at 11GHz with 484 GB/s of memory bandwidth so it will be interesting to see how this changes the performance of the card. 

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The iCX cooler on the card offers nine thermal sensors and multiple MCUs along with asynchronous fan control to manage both heat and sound simultaneously.  You can choose between black or white models depending on the colour scheme in your PC and there are customizable RGB colour for the visual alarms present on the card.  PR just below the back end.

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September 21st, 2017 – The EVGA GeForce GTX 1080Ti FTW3 ELITE cards are now available with 12GHz of GDDR5 memory, giving it 528 GB/s of memory bandwidth! These cards are available with either the ELITE Black or White shroud, and of course comes with EVGA’s exclusive iCX technology, giving you 9 thermal sensors, onboard thermal LED indicators and incredible cooling with quiet operation.

Features

  • Includes EVGA iCX Technology
  • 12GHz GDDR5 Memory
  • 528 GB/s of Memory Bandwidth
  • Available in ELITE Black and White Colors

Includes EVGA iCX Technology

  • Featuring a total of 11 global patents (pending and granted), iCX is efficiency perfected.
  • 9 Additional Sensors and MCU's embedded on the PCB.
  • Purposefully-directed Airflow Chambers.
  • Newly Designed Die-Cast Baseplate and Backplate.
  • Full Control Using EVGA Precision XOC.
  • EVGA's iCX is the Very Definition of Interactive Cooling.

Learn more and buy now at https://www.evga.com/articles/01149/evga-geforce-gtx-1080-ti-12ghz/

Source: EVGA