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Huawei Announces Mate 10 and Mate 10 Pro Smartphones

Subject: Mobile | October 16, 2017 - 10:23 AM |
Tagged: SoC, smartphone, phone, Oreo, mobile, Mate 10 Pro, Mate 10, Kirin 970, Huawei, Android 8, Android

Huawei has announced the successor(s) to the Mate 9 smartphone with the new Mate 10 and Mate 10 Pro, which feature a new "3D Glass Body" industrial design along with the new Kirin 970 processor and other improvements.

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The key features from Huawei include:

  • Kirin 970, the world’s first AI processor for smartphones with a dedicated Neural Network Processing Unit (NPU)
  • A 3D Glass Body featuring a barely-there-bezel, HUAWEI FullView Display and HDR10 supported technology for intensely vivid and brighter colors
  • TÜV Fast-Charge Safety Certified HUAWEI SuperCharge and 4000 mAh battery with AI-powered Battery Management
  • New Leica Dual Camera with SUMMILUX-H lenses, with both featuring  an aperture of f/1.6, and intelligent photography including AI-powered Real-Time Scene and Object Recognition and AI-powered Bokeh Effect;
  • An all-new, simplified EMUI 8.0 based on Android 8.0

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The Mate 10 Pro features an 18:9 OLED display

The Mate 10 is a 5.9-inch device with a 16:9 IPS display supporting HDR10, while the Mate 10 Pro offers an 18:9 OLED display (also with HDR10 support).

The new dual-camera system is again a joint effort with Leica, and combines a 12 MP color sensor with a 20 MP monochrome sensor, using lenses with a aperture of f/1.6 - and Huawei says this aperture is the "world's largest" for a smartphone. The digital zoom and bokeh effects are AI-powered, along with real-time scene and object recognition.

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The new Kirin 970 combines an 8-core CPU with a 12-core Mali-G72 GPU, and includes an NPU (neural processing unit) for AI-related tasks as well as a new dual ISP for the AI-powered camera features mentioned above.

Both phones include a 4000 mAh battery which offers "smart battery management" which Huawei states "understands user behavior and intelligently allocates resources to maximize battery life". The new TÜV-certified fast charging feature supports low-voltage charging of 4.5V / 5A, and Huawei states this will charge the phones from 1% to 20% in 10 minutes, or 1% to 58% in 30 minutes.

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The Mate 10 lineup

The Mate 10 and Mate 10 Pro ship with Android 8.0 and a new "simplified" version of Huawei's EMUI interface. Pricing and availablity for the U.S. was not revealed, but the phones will go on sale internationally starting this month for the Mate 10, and mid-November for the Mate 10 Pro.

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The Mate 10 Pro lineup

While we don't have U.S. pricing yet, European pricing for the Mate 10 with 64GB of storage and 4GB memory is set at €699, and the Mate 10 Pro with 128GB/6GB will be €799.

Source: HUAWEI

NZXT adds a trio of cases to their lineup, and a brain as well

Subject: Cases and Cooling | October 19, 2017 - 07:37 PM |
Tagged: H700i, H400i, H200i, nzxt, Grid+ V3, CAM

To start with the most interesting of the four product announcements from NZXT, take a look at the Grid+ V3.  This is a smart fan controller which offers both voltage and PWM control via the CAM software suite.

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There are six separate channels on the Grid, allowing you to control each fan individually or you can use the included splitters to add more than one fan to a channel.  You are able to choose between manual control or the Adaptive Noise Reduction feature to allow the device to determine the proper fan curves for your system, even if you swap hardware after the initial setup.

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Along with their advanced fan controller, NZXT announced three new cases, the H700i, H400i, and H200i.  The H700i is a full sized case standing 230x494x494mm and is capable of holding even eATX motherboards with seven slots.  It is also a good choice for data hoarders, with seven 2.5" bays and up to three 3.5" bays. It is available now for $200.

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The H400i is the mATX case, a svelte 210x393x421mm in size but still able to handle a pair of 120/140mm fans or radiators in the front, behind the filters you can see as the front panel has been removed in the picture below.  It will be available late next month for $140.

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Last, and only least in volume is the H200i, the mini-ITX case.  At 210x334x372mm and 6kg in weight it is not quite as small as a NUC, good news for those of us who need a bit of space to manoeuvre when installing components.  It will arrive before the end of the year, for about $120.

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All of the above cases are constructed with SECC steel and tempered glass side panels, available in matte black or white as well as matte black with blue or red trim.  The cases are compatible with the CAM software mentioned previously and have space to install the GRID+ V3 digital controller.  Your R's G's and B's can be managed through NZXT's HUE+ software, with support for numerous LED strips as well as ones built into your components.  Aer F fans are included or you could take advantage of the drop-in brackets and integrated reservoir mounting to switch to watercooling. 

 

Source: NZXT

Qualcomm shows first 5G Smartphone Reference Design, mmWave module in silicon

Subject: Mobile | October 16, 2017 - 09:30 PM |
Tagged: x50, qualcomm, mmWave, 5g nr, 5G

Earlier this year Qualcomm announced that it had made its first connection with the 5G NR (new radio) through its prototype system. This prototype was constructed to help with the build outs with Ericsson and Vodafone to get 5G in trials in the second of half this year. The device was crude, but effective, and took up a lot of space in a 2U rackmount design.

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Today Qualcomm steps up its investment and apparent leadership position with the next generation connectivity technology by showcasing a reference smartphone design that implements the X50 5G modem for the first time.

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Though far from a retail-ready announcement, this 9mm thin smartphone design proves that the future of 5G is strong and allows Qualcomm to crow about its position in the field. This design makes several key points, according to the connectivity giant:

  1. It is the first smartphone-style design integration for the X50 modem, announced a year ago at the company’s 4G/5G summit in Hong Kong.
     
  2. Showcases greater than 1Gbps data connectivity on the 100 MHz bands with only a 2xCA (carrier aggregation) implementation.
     
  3. Proves the feasibility of mmWave (millimeter wave) technology at 28 GHz in a smartphone with a silicon-based chip that fits four mmWave antenna and a 5G transceiver.

The real bright spot on this design is the inclusion of connectivity support on mmWave technology, previously thought to be extremely difficult to do in a smartphone form factor. Using mmWaves creates complexity due to its reluctance to transmit THROUGH things (including people), so the small surface area of a phone was going to cause issues. By integrating support for four large surface area antenna on this design and the 5G module, Qualcomm believes it has taken a large step in productization.

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This reference design will enable trials of 5G technology in real-world environments and use cases. Qualcomm also claims that at launch time (early 2019), the module for the mmWave transceiver will be shrunk by another 50%. Qualcomm hopes that by showing OEMs and carriers that 5G technology challenges are addressable in common and expected form factors, it can accelerate and ease the adoption of the technology for consumers and enterprise applications.

Source: Qualcomm