Today Micron initiated the first of a multi-tier launch of a new SATA Enterprise SSD lineup built around their IMFT 32-layer 3D NAND Flash. It may seem odd for a full enterprise line to use IMFT 3D TLC, as that flash has not been known for the high random IOPS demands of the datacenter, but Micron looks to be making it work, and work well.
Above is a performance consistency plot of their MAX model. While this does have the highest OP of all of the models, the consistency is surpassing even NVMe models (using a bus *much* faster than SATA). Sure the results are only using 1-second averages and not our Latency Percentile, but we will be able to pick out any single-IO inconsistencies once we get samples in for detailed review.
Saturated IOPS performance also looks good 'on paper'.
The advantage to operating their flash in TLC mode is that the per die capacity moves from 32GB to 48GB, ultimately driving down the cost/GB of these products and making them an easier sell to enterprise customers. It also enables high capacities - the max capacity of the model with the least overprovisioning (ECO) will reach 8TB in a 2.5" SATA form factor when the last leg of this launch is completed later next year.
The three lines are all using the same controller and base firmware, but with differences in how the dies are laid out with respect to expected performance and endurance.
Below are all of the products being launched. All products use a Marvell 88SS1074 controller at SATA 6Gbit:
- 5100 ECO
- 2.5" 7mm: 480, 960, 1920, 3840, 7680 GB
- M.2 2280: 480, 960, 1920 GB
- Sequential read/write: 540 / 380-520 MB/s
- Random read/write: 93k / 9k-31k IOPS
- Endurance: <=1 DWPD
- Cost / GB: $0.45 - $0.55
- 5100 PRO
- 2.5" 7mm: 240, 480, 960, 1920, 3840 GB
- M.2 2280: 240, 480, 960, 1920 GB
- Sequential read/write: 540 / 380-520 MB/s
- Random read/write: 78 (240GB)-93k / 26k-43k IOPS
- Endurance: 1-3 DWPD
- Cost / GB: $0.55 - $0.65
- 5100 MAX
- 2.5" 7mm: 240, 480, 960, 1920 GB
- M.2 2280: (none)
- Sequential read/write: 540 / 310-520 MB/s
- Random read/write: 93k / 48k-74k IOPS
- Endurance: 5 DWPD
- Cost / GB: $0.65 - $0.75
All models come with Micron 'Flex Capacity', which enables custom *increases* in OverProvisioning. Flex Security enables FIPS 140-2 validated 256-bit AES encryption.
The specs are very good when you consider their performance consistency claims, meaning a 74k IOPS random write rating applies to random writes across the *entire span* of the SSD *at steady state*. Consumer SSD firmware typically chokes with this type of workload, even ones equipped with MLC flash.
We will have more on the 5100 Series from Micron as these products are rolled out and sampled to us for performance review.
Press blast after the break.
Subject: General Tech | December 4, 2016 - 02:42 PM | Scott Michaud
Tagged: pc gaming, vulkan, libretro
About half of a year ago, LibRetro added Vulkan support to their Nintendo 64 renderer. This allowed them to do things like emulate the console’s hardware rasterization in software, and do so as an asynchronous shader, circumventing limitations in their OpenGL path trying to emulate the console’s offbeat GPU.
Image Credit: Universal Interactive via Wikipedia
They have now turned their sights (“for the lulz”) to the original PlayStation, creating a Vulkan back-end for emulators like Beetle PSX.
The fairly long blog post discusses how the PlayStation is designed in detail, making it an interesting read for anyone curious. One point that I found particularly interesting is how the video memory is configured as a single, 1MB, 2D array (1024x512x16-bit). At this time, texture resolution was quite small, and frame buffers were between 256x224 and 640x480, so that’s a lot of room to make a collage out of your frame and all textures in the scene, but it’s still odd to think about a console imposing such restrictions now that we’re spoiled by modern GPUs.
In terms of performance, the developer claims that modern GPUs can handle 8k resolutions with relative ease, and four-digit FPS at lower resolutions.
Subject: Processors | December 8, 2016 - 09:00 AM | Josh Walrath
Tagged: Xilinx, TSMC, standard cells, layout, FinFET, EDA, custom cell, arm, 7nm
Today ARM is announcing their partnership with Xilinx to deliver design solutions for their products on TSMC’s upcoming 7nm process node. ARM has previously partnered with Xilinx on other nodes including 28, 20, and 16nm. Their partnership extends into design considerations to improve the time to market of complex parts and to rapidly synthesize new designs for cutting edge process nodes.
Xilinx is licensing out the latest ARM Artisan Physical IP platform for TSMC’s 7nm. Artisan Physical IP is a set of tools to help rapidly roll out complex designs as compared to what previous generations of products faced. ARM has specialized libraries and tools to help implement these designs on a variety of processes and receive good results even on the shortest possible design times.
Design relies on two basic methodologies. There is custom cell and then standard cell designs. Custom cell design allows for a tremendous amount of flexibility in layout and electrical characteristics, but it requires a lot of man-hours to complete even the simplest logic. Custom cell designs typically draw less power and provide higher clockspeeds than standard cell design. Standard cells are like Legos in that the cells can be quickly laid out to create complex logic. Software called EDA (Electronic Design Automation) can quickly place and route these cells. GPUs lean heavily on standard cells and EDA software to get highly complex products out to market quickly.
These two basic methods have netted good results over the years, but during that time we have seen implementations of standard cells become more custom in how they behave. While not achieving full custom performance, we have seen semi-custom type endeavors achieve appreciable gains without requiring the man hours to achieve fully custom.
In this particular case ARM is achieving a solid performance in power and speed through automated design that improves upon standard cells, but without the downsides of a fully custom part. This provides positive power and speed benefits without the extra power draw of a traditional standard cell. ARM further improves upon this with the ARM Artisan Power Grid Architect (PGA) which simplifies the development of a complex power grid that services a large and complex chip.
We have seen these types of advancements in the GPU world that NVIDIA and AMD enjoy talking about. A better power grid allows the ASIC to perform at lower power envelopes due to less impedence. The GPU guys have also utilized High Density Libraries to pack in the transistors as tight as possible to utilize less space and increase spatial efficiency. A smaller chip, which requires less power is always a positive development over a larger chip of the same capabilities that requires more power. ARM looks to be doing their own version of these technologies and are applying them to TSMC’s upcoming 7nm FinFET process.
TSMC is not releasing this process to mass production until at least 2018. In 1H 2017 we will see some initial test and early production runs for a handful of partners. Full blown production of 7nm will be in 2018. Early runs and production are increasingly being used for companies working with low power devices. We can look back at 20/16/14 nm processes and see that they were initially used by designs that do not require a lot of power and will run at moderate clockspeeds. We have seen a shift in who uses these new processes with the introduction of sub-28nm process nodes. The complexity of the design, process steps, materials, and libraries have pushed the higher performance and power hungry parts to a secondary position as the foundries attempt to get these next generation nodes up to speed. It isn’t until after some many months of these low power parts are pushed through that we see adjustments and improvements in these next generation nodes to handle the higher power and clockspeed needs of products like desktop CPUs and GPUs.
ARM is certainly being much more aggressive in addressing next generation nodes and pushing their cutting edge products on them to allow for far more powerful mobile products that also exhibit improved battery life. This step with 7nm and Xilinx will provide a lot of data to ARM and its partners downstream when the time comes to implement new designs. Artisan will continue to evolve to allow partners to quickly and efficiently introduce new products on new nodes to the market at an accelerated rate as compared to years past.
Subject: General Tech | December 8, 2016 - 01:22 PM | Jeremy Hellstrom
Tagged: rumour, Intel, skylake-x, kaby lake x, LGA 2066
DigiTimes today published a possibly accurate post on the upcoming replacement for the ageing Broadwell-E platform, Skylake-X and Kaby Lake-X. These chips will feature a new socket and along with that a new chipset, bearing the predictable name of X299. The quoted prices seem to fit with Intel's pricing scheme, from $468 to $1,780 but we did not hear of any core counts or frequency ranges, the expected release date is about a year away. The new chips will of course support DDR4 and we might see a hint of them at Gamescom 2017 in Germany. They also state you can expect to see Intel's 7xxx family of chips and the accompanying Z270 and H270 chipsets at CES this January; a reasonable expectation.
"The new Skylake-X and Kaby Lake-X processors will feature a new LGA 2066 socket and support DDR4 memory. The CPUs will pair with Intel's new X299 chipsets."
Here is some more Tech News from around the web:
- Bluetooth 5 launches with eight times the capacity and double the speed @ The Inquirer
- Sigh... 'Hundreds of thousands' of... sigh, web CCTV cams still at risk of... sigh, hijacking @ The Register
- Symantec: 95.4 percent of PowerShell script is malicious @ The Inquirer
- Improving Storage Performance with Ceph and Flash @ Linux.com
- Firmware freakout sends Epson Wi-Fi printers into reboot loop @ The Register
- Microsoft Officially Closes Its $26.2B Acquisition of LinkedIn @ Slashdot
- Christmas 2016 Mega Worldwide Giveaway @ NikKTech
Subject: Editorial | December 8, 2016 - 04:00 PM | AlexL
Tagged: podcast, Thrustmaster, thermaltake, tablet, snapdragon, razer, nvidia, microsoft, Mechwarrior, Khronos, Intel, hp, evga, Deepcool, AUKEY
PC Perspective Podcast #428 - 12/8/16
Join us this week as we discuss Khronos Group, Enterprise SSDs, Water cooled cases and more!
The URL for the podcast is: http://pcper.com/podcast - Share with your friends!
- iTunes - Subscribe to the podcast directly through the iTunes Store (audio only)
- Google Play - Subscribe to our audio podcast directly through Google Play!
- RSS - Subscribe through your regular RSS reader (audio only)
- MP3 - Direct download link to the MP3 file
Hosts: Allyn Malventano, Josh Walrath, Jeremy Hellstrom
Program length: 1:13:35
- Join our spam list to get notified when we go live!
- Win a White Special Edition Corsair RM1000i Power Supply!
- Week in Review:
- 0:04:16 AUKEY KM-G3 RGB Mechanical Gaming Keyboard Review
- 0:08:06 Thrustmaster TMX Review: Budget FFB for Xbox One and PC
- 0:15:16 Deepcool GamerStorm GENOME Liquid-Cooled Case Review
- 0:23:06 EVGA SuperNOVA 550W G3 Power Supply Review
- 0:28:01 Qualcomm and Microsoft Bring Full Windows 10 to Snapdragon Devices
- News items of interest:
- 0:32:07 Razer Joins The Khronos Group
- 0:36:54 Thermaltake Launches Water Cooling Friendly E-ATX Tower 900 Series Case
- 0:39:32 Intel Z270 Express and H270 Express Chipsets Support Kaby Lake, More PCI-E 3.0 Lanes
- 0:42:12 MechWarrior 5: Mercenaries Announced on Unreal Engine 4
- 0:46:10 HP Launches Ruggedized Apollo Lake Powered Convertible Tablet For Students
- 0:47:33 Micron Launches 5100 Series Enterprise SSDs - 3D TLC up to 8TB!
- 0:52:12 WD and HGST Refresh Enterprise SSDs to Include 8TB, Push HDDs to 12TB and Beyond
- 1:02:37 NVIDIA Releases GeForce 376.19 Drivers (and Two Contests)
- 1:04:14 The Khronos Group Announces VR Standard Initiative
- Hardware/Software Picks of the Week
- http://twitter.com/ryanshrout and http://twitter.com/pcper
Subject: Storage | December 8, 2016 - 05:59 PM | Tim Verry
Tagged: Seagate, external hard drive, cloud storage, cloud backup, amazon drive, amazon
Seagate and Amazon have partnered up to offer a new USB external hard drive called the Seagate Duet that, while functioning as you would expect an external drive to, also automatically keeps files synced between itself and the user's Amazon Drive cloud storage. The Duet is based on Seagate's Backup Plus drive series and is a 1TB drive with two platters and PMR (perpendicular magnetic recording) technology that spins at 5400 RPM. It connects to PCs over USB 3.0.
During the initial setup, users provide their Amazon Drive login to the Duet software which will upload all media files stored on the external drive to Amazon Drive as well as download any files stored on Amazon Drive regardless of whether they were uploaded by the Duet or other devices not using the Duet software.
Seagate offers a two year warranty on the drive which will be an Amazon.com exclusive and available on December 10th for $99.99. The Duet does come at quite the premium over other drives (even Seagate's own) with non-automatic cloud syncing 1TB USB 3.0 drives coming in at around $50 and 2TB drives able to be found easily for less than the Duet's $100 price.
However, there is a bit of a saving grace in that the Seagate Duet does come with one year of free Amazon Drive Unlimited storage which normally costs $59.99 a year.
For enthusiasts, there are cheaper 1TB or higher capacity drives for the same price as the Duet, but I find myself thinking that this would be a great gift for family members to help them protect their precious family photos and videos from a drive failure or lost drive! With the holidays coming up fast, if you have not figured out the perfect gift yet this may just be the thing to buy – and if something does happen, the real gift is that their photos are safely backed up!
Subject: Motherboards | December 5, 2016 - 03:02 PM | Jeremy Hellstrom
Tagged: gigabyte, Intel X99, designare EX
Gigabyte's Designare EX is even more full of extras and add-ins than the non-EX model, featuring everything but an easily accessible CMOS battery. Ten SATA ports, although only six are RAID capable, one U.2 and a pair of M.2 ports are available and there is an Avago PEX8747 assuming to help your CPU provide enough PCIe lanes for everything. The USB Type-C port on the back is Thunderbolt 3 rated and there is a DisplayPort input on the back panel so you can use your graphics card to provide output for that Thunderbolt connection. The Tech Report loved the look of the board but ran into some hurdles when using and tweaking it, check out the full review for details.
"Broadwell-E CPUs brought a new wave of X99 motherboards to go with them at price points both high and low. The GA-X99-Designare EX shows what's possible when Gigabyte's motherboard designers get to pull out all the stops. We put this board to the test to see what it's like to live the high life."
Here are some more Motherboard articles from around the web:
- ASRock Fatal1ty X99 Professional Gaming i7 @ techPowerUp
- GIGABYTE X99-Ultra Gaming Motherboard Review @ Techgage
- MSI X99A XPower Gaming Titanium @ Kitguru
Subject: Cases and Cooling | December 9, 2016 - 02:16 AM | Tim Verry
Tagged: SFF case, SFF, OEM, ODM, micro ATX, jonsbo, itx
Jonsbo, an OEM based in Hong Kong that also does ODM designs for other brands (such as Newegg’s house brand Rosewill) has announced a new Micro ATX chassis called the VR2. The upcoming small form factor case measures 14.9” x 9.4” x 15.8” and is constructed using an SGCC (cold rolled steel) frame along with 3mm thick aluminum-magnesium alloy body panels and 5mm tempered glass side panels on both the left and right sides. The case comes in black, silver, and red.
The SFF VR2 case uses a vertical motherboard design that places the rear IO, power supply input, and PCI slots at the top of the case. The cable clutter is hidden by the top panel of the case and cables are routed out of the back of the case. The vertical mounting design allows for larger graphics cards (up to 12.6" / 320mm) to be installed along with standard ATX power supplies up to 250mm long. Further, while we are on measurements, CPU coolers can be up to 190mm tall.
Further, the motherboard tray can hold either ITX or Micro ATX motherboards with four external PCI slots available for expansion cards.
Cooling is handled by two 120mm fans in the bottom and a single 120mm fan up top. Airflow is going to be restricted with this design, but according to Jonsbo the cooling setup will generate positive pressure and bring in enough cool air to keep things running smoothly even with the single exhaust fan that does not have a direct outside vent above it (we will have to see if reviews confirm these claims, of course!).
The outside of the case is kept simple with subtle curved edges, rounded case feet, and clean front and top panels sans vents. There are two USB 3.0 (USB 3.1 Gen 1) ports and two 3.5mm audio jacks nestled in the bottom right corner and a single silver power button in the top left corner of the front panel. Other than that, even the vents are hidden from view. The red version in particular is quite attractive. The left and right sides of the case feature tempered glass to show off your components as well as your awesome cable management behind the motherboard tray (it's not a rat's nest back there right?? heh).
Internally, the Jonsbo VR2 has a motherboard tray with a very large CPU cutout and cable routing grommets along the bottom edge. This actually works out well except for perhaps the CPU power connector (the grommets are close to the bulky 24-pin and GPU inputs though). A modular power supply is a must though if you want a clean build though; there is no space to easily hide away unused cables.
The case has room for a total of four 2.5" drives and a single 3.5" drive with the 3.5" and two 2.5" SSDs in the main compartment and two SSD mounts behind the motherboard tray.
It is an interesting case from a company that I had not heard of before. More photos and specifications can be found on the company's website.
It is not clear whether we will see the Jonsbo branded version in the US soon or if we will have to wait for a US company to pick up the design and sell it under their own brand (or import it I suppose). Pricing and availability have not been announced yet, but hopefully more information will be released next month at CES.
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