Flash player not detected. Click here to install flash.
« 1 2 3 4 5 »

Huawei Announces Mate 10 and Mate 10 Pro Smartphones

Subject: Mobile | October 16, 2017 - 10:23 AM |
Tagged: SoC, smartphone, phone, Oreo, mobile, Mate 10 Pro, Mate 10, Kirin 970, Huawei, Android 8, Android

Huawei has announced the successor(s) to the Mate 9 smartphone with the new Mate 10 and Mate 10 Pro, which feature a new "3D Glass Body" industrial design along with the new Kirin 970 processor and other improvements.

Mate 10_Front and Back.jpg

The key features from Huawei include:

  • Kirin 970, the world’s first AI processor for smartphones with a dedicated Neural Network Processing Unit (NPU)
  • A 3D Glass Body featuring a barely-there-bezel, HUAWEI FullView Display and HDR10 supported technology for intensely vivid and brighter colors
  • TÜV Fast-Charge Safety Certified HUAWEI SuperCharge and 4000 mAh battery with AI-powered Battery Management
  • New Leica Dual Camera with SUMMILUX-H lenses, with both featuring  an aperture of f/1.6, and intelligent photography including AI-powered Real-Time Scene and Object Recognition and AI-powered Bokeh Effect;
  • An all-new, simplified EMUI 8.0 based on Android 8.0

Mate 10 Pro_Blue Front.jpg

The Mate 10 Pro features an 18:9 OLED display

The Mate 10 is a 5.9-inch device with a 16:9 IPS display supporting HDR10, while the Mate 10 Pro offers an 18:9 OLED display (also with HDR10 support).

The new dual-camera system is again a joint effort with Leica, and combines a 12 MP color sensor with a 20 MP monochrome sensor, using lenses with a aperture of f/1.6 - and Huawei says this aperture is the "world's largest" for a smartphone. The digital zoom and bokeh effects are AI-powered, along with real-time scene and object recognition.

Mate 10 Pro_Camera.jpg

The new Kirin 970 combines an 8-core CPU with a 12-core Mali-G72 GPU, and includes an NPU (neural processing unit) for AI-related tasks as well as a new dual ISP for the AI-powered camera features mentioned above.

Both phones include a 4000 mAh battery which offers "smart battery management" which Huawei states "understands user behavior and intelligently allocates resources to maximize battery life". The new TÜV-certified fast charging feature supports low-voltage charging of 4.5V / 5A, and Huawei states this will charge the phones from 1% to 20% in 10 minutes, or 1% to 58% in 30 minutes.

Mate 10_Group.jpg

The Mate 10 lineup

The Mate 10 and Mate 10 Pro ship with Android 8.0 and a new "simplified" version of Huawei's EMUI interface. Pricing and availablity for the U.S. was not revealed, but the phones will go on sale internationally starting this month for the Mate 10, and mid-November for the Mate 10 Pro.

Mate 10 Pro_Group.jpg

The Mate 10 Pro lineup

While we don't have U.S. pricing yet, European pricing for the Mate 10 with 64GB of storage and 4GB memory is set at €699, and the Mate 10 Pro with 128GB/6GB will be €799.

Source: HUAWEI

NZXT adds a trio of cases to their lineup, and a brain as well

Subject: Cases and Cooling | October 19, 2017 - 07:37 PM |
Tagged: H700i, H400i, H200i, nzxt, Grid+ V3, CAM

To start with the most interesting of the four product announcements from NZXT, take a look at the Grid+ V3.  This is a smart fan controller which offers both voltage and PWM control via the CAM software suite.

large_4068bef381db0e33.png

There are six separate channels on the Grid, allowing you to control each fan individually or you can use the included splitters to add more than one fan to a channel.  You are able to choose between manual control or the Adaptive Noise Reduction feature to allow the device to determine the proper fan curves for your system, even if you swap hardware after the initial setup.

Grid+v3-system-S340Rear_preview.jpeg

Along with their advanced fan controller, NZXT announced three new cases, the H700i, H400i, and H200i.  The H700i is a full sized case standing 230x494x494mm and is capable of holding even eATX motherboards with seven slots.  It is also a good choice for data hoarders, with seven 2.5" bays and up to three 3.5" bays. It is available now for $200.

H700i_Matte BlackBlue_Front Fans_preview.jpeg

The H400i is the mATX case, a svelte 210x393x421mm in size but still able to handle a pair of 120/140mm fans or radiators in the front, behind the filters you can see as the front panel has been removed in the picture below.  It will be available late next month for $140.

H400i-Matte Black_FrontFilter_preview.jpeg

Last, and only least in volume is the H200i, the mini-ITX case.  At 210x334x372mm and 6kg in weight it is not quite as small as a NUC, good news for those of us who need a bit of space to manoeuvre when installing components.  It will arrive before the end of the year, for about $120.

H200i-Matte White_Top45_preview.jpeg

All of the above cases are constructed with SECC steel and tempered glass side panels, available in matte black or white as well as matte black with blue or red trim.  The cases are compatible with the CAM software mentioned previously and have space to install the GRID+ V3 digital controller.  Your R's G's and B's can be managed through NZXT's HUE+ software, with support for numerous LED strips as well as ones built into your components.  Aer F fans are included or you could take advantage of the drop-in brackets and integrated reservoir mounting to switch to watercooling. 

 

Source: NZXT

ASUS Announces ROG Strix X370-I and B350-I Gaming Mini-ITX Motherboards for AMD Ryzen

Subject: Motherboards | October 20, 2017 - 12:25 AM |
Tagged: X370-I Gaming, strix, small form factor, SFF, ryzen, motherboard, mITX, mini-itx, gaming, B350-I Gaming, amd, AM4

While Intel users have long enjoyed the option of a premium ASUS ROG mini-ITX experience, AMD Ryzen owners are now on equal footing with the annoucement of a pair of mITX gaming boards with premium features. ASUS has apparently been working on these for a while now, and they think they will be worth the wait.

Strix_AM4.jpg

"Mini-ITX boards are among the most difficult to produce. Their diminutive 6.7” x 6.7” dimensions leave little real estate for slots and ports, let alone the extra features that make ROG unique. We’re not willing to compromise your experience for a compact footprint, so it takes some time and creativity to make everything fit. But it’s worth the effort, because our new Strix X370-I Gaming and Strix B350-I Gaming motherboards for Socket AM4 raise the bar for small-form-factor Ryzen builds. They match the cutting-edge features of their full-sized siblings, including liquid-ready cooling and addressable RGB lighting, and they combine an M.2 SSD heatsink and amped-up audio on an innovative riser card."

X370I.jpg

The motherboards both feature a 6-phase VRM design, which ASUS says is the same as their full-sized AM4 motherboards, with memory support of up to DDR4-3600. One-click overclocking is provided via the ASUS "5-Way Optimization technology", which can calibrate fan curves in addition to tuning CPU speeds. Speaking of fans, there are three PWM fan headers, one of which is configured by default for a liquid cooling pump.

An interesting design choice was made in the interest of space, as the sound card (S1220A codec) and M.2 slot (PCIe Gen 3 x4) are part of a shared riser card:

M2_Audio.jpg

"The Republic of Gamers has a history of working around Mini-ITX limitations by building up with additional circuit boards. Our Maximus Impact series made room for upgraded audio with a dedicated riser, and the Strix X370-I and B350-I Gaming go one step further with an M.2 Audio Combo card that contains both SupremeFX sound and M.2 storage. This small PCB is sandwiched between isolated heatsinks for an M.2 drive and the platform chipset, ensuring effective cooling without taking up too much space."

ASUS Aura Sync RGB lighting effects are on board, as is an 802.11ac Wi-Fi solution with 2x2 antenna and integrated Bluetooth. Connectivity includes a pair of USB 3.1 Gen 2 ports and four USB 3.1 Gen 1 ports, Gigabit LAN, and multi-channel audio on the rear panel, with 4x SATA ports, the M.2 slot, and headers for both USB 3.0 and 2.0 onboard.

Rear_IO.jpg

The ASUS ROG Strix X370-I and B350-I Gaming motherboards will "be available starting late-October in the United States with pricing to be released in the coming weeks" according to ASUS.

Source: ASUS

Qualcomm shows first 5G Smartphone Reference Design, mmWave module in silicon

Subject: Mobile | October 16, 2017 - 09:30 PM |
Tagged: x50, qualcomm, mmWave, 5g nr, 5G

Earlier this year Qualcomm announced that it had made its first connection with the 5G NR (new radio) through its prototype system. This prototype was constructed to help with the build outs with Ericsson and Vodafone to get 5G in trials in the second of half this year. The device was crude, but effective, and took up a lot of space in a 2U rackmount design.

5G NR Sub 6 GHz prototype.jpg

Today Qualcomm steps up its investment and apparent leadership position with the next generation connectivity technology by showcasing a reference smartphone design that implements the X50 5G modem for the first time.

small1.jpg

Though far from a retail-ready announcement, this 9mm thin smartphone design proves that the future of 5G is strong and allows Qualcomm to crow about its position in the field. This design makes several key points, according to the connectivity giant:

  1. It is the first smartphone-style design integration for the X50 modem, announced a year ago at the company’s 4G/5G summit in Hong Kong.
     
  2. Showcases greater than 1Gbps data connectivity on the 100 MHz bands with only a 2xCA (carrier aggregation) implementation.
     
  3. Proves the feasibility of mmWave (millimeter wave) technology at 28 GHz in a smartphone with a silicon-based chip that fits four mmWave antenna and a 5G transceiver.

The real bright spot on this design is the inclusion of connectivity support on mmWave technology, previously thought to be extremely difficult to do in a smartphone form factor. Using mmWaves creates complexity due to its reluctance to transmit THROUGH things (including people), so the small surface area of a phone was going to cause issues. By integrating support for four large surface area antenna on this design and the 5G module, Qualcomm believes it has taken a large step in productization.

small3.jpg

This reference design will enable trials of 5G technology in real-world environments and use cases. Qualcomm also claims that at launch time (early 2019), the module for the mmWave transceiver will be shrunk by another 50%. Qualcomm hopes that by showing OEMs and carriers that 5G technology challenges are addressable in common and expected form factors, it can accelerate and ease the adoption of the technology for consumers and enterprise applications.

Source: Qualcomm