Flash player not detected. Click here to install flash.
« 1 2 3 4 5 »

HEATKILLER is not the latest superhero, unless you're running a Threadripper

Subject: Cases and Cooling | February 23, 2018 - 01:49 PM |
Tagged: water cooler, Threadripper, HEATKILLER IV Pro, amd

You may not see WaterCool.de mentioned frequently in reviews unless you are deeply into watercooling.  They have been producing impressive products for quite a while now and the HEATKILLER IV Pro is no exception.  [H]ard|OCP's tests showed it to be equal in performance to the best they have seen.  If you don't like the clear look of the cooler [H] reviewed the waterblock also comes in copper and copper with nickel plating as well.  See the cooler in action here.

1519279007f4wbo5i5wz_1_5_l.jpg

"WaterCool.de does not mess around when it comes to water cooling enthusiasts computers for well over a decade now. Many of us have been waiting with bated breath for Watercool's entry into the Threadripper cooling market, and it finally is with the HEATKILLER IV Pro. We compare it to five other water blocks."

Here is some more Tech News from around the web:

Tech Talk

Source: [H]ard|OCP
Author:
Manufacturer: AMD

Overview

It's clear by now that AMD's latest CPU releases, the Ryzen 3 2200G and the Ryzen 5 2400G are compelling products. We've already taken a look at them in our initial review, as well as investigated how memory speed affected the graphics performance of the internal GPU but it seemed there was something missing.

Recently, it's been painfully clear that GPUs excel at more than just graphics rendering. With the rise of cryptocurrency mining, OpenCL and CUDA performance are as important as ever.

Cryptocurrency mining certainly isn't the only application where having a powerful GPU can help system performance. We set out to see how much of an advantage the Radeon Vega 11 graphics in the Ryzen 5 2400G provided over the significantly less powerful UHD 630 graphics in the Intel i5-8400.

DSC04637.JPG

Test System Setup
CPU AMD Ryzen 5 2400G
Intel Core i5-8400
Motherboard Gigabyte AB350N-Gaming WiFi
ASUS STRIX Z370-E Gaming
Memory 2 x 8GB G.SKILL FlareX DDR4-3200
(All memory running at 3200 MHz)
Storage Corsair Neutron XTi 480 SSD
Sound Card On-board
Graphics Card AMD Radeon Vega 11 Graphics
Intel UHD 630 Graphics
Graphics Drivers AMD 17.40.3701
Intel 23.20.16.4901
Power Supply Corsair RM1000x
Operating System Windows 10 Pro x64 RS3

 

GPGPU Compute

Before we take a look at some real-world examples of where a powerful GPU can be utilized, let's look at the relative power of the Vega 11 graphics on the Ryzen 5 2400G compared to the UHD 630 graphics on the Intel i5-8400.

sisoft-screen.png

SiSoft Sandra is a suite of benchmarks covering a wide array of system hardware and functionality, including an extensive range of GPGPU tests, which we are looking at today. 

sandra1.png

Comparing the raw shader performance of the Ryzen 5 2400G and the Intel i5-8400 provides a clear snapshot of what we are dealing with. In every precision category, the Vega 11 graphics in the AMD part are significantly more powerful than the Intel UHD 630 graphics. This all combines to provide a 175% increase in aggregate shader performance over Intel for the AMD part. 

Now that we've taken a look at the theoretical power of these GPUs, let's see how they perform in real-world applications.

Continue reading our look at the GPU compute performance of the Ryzen 5 2400G!

PCPer Mailbag #32 - 2/23/2018

Subject: Editorial | February 23, 2018 - 09:00 AM |
Tagged: video, Ryan Shrout, pcper mailbag

It's time for the PCPer Mailbag, our weekly show where Ryan and the team answer your questions about the tech industry, the latest and greatest GPUs, the process of running a tech review website, and more!

On today's show:

00:37 - Ryzen vs. Coffee Lake for Meltdown/Spectre?
02:50 - NVIDIA CPUs?
04:35 - Selling bare GPUs for water coolers?
07:01 - Hard drive data recovery?
09:35 - Why does Apple use ARM?
11:22 - PCPer's advertising disclosure?
12:44 - Hard drive cloning software?
14:18 - PCPer history?
16:53 - Mobile World Congress?
17:26 - Pinnacle Ridge IPC improvements?
18:43 - Consumer cards for machine learning?
21:47 - Refining display technologies?

Want to have your question answered on a future Mailbag? Leave a comment on this post or in the YouTube comments for the latest video. Check out new Mailbag videos each Friday!

Be sure to subscribe to our YouTube Channel to make sure you never miss our weekly reviews and podcasts, and please consider supporting PC Perspective via Patreon to help us keep videos like our weekly mailbag coming!

Source: YouTube
Author:
Subject: Storage, Mobile
Manufacturer: TEKQ

Delivering on the Promise of Thunderbolt 3

Despite the greatly increased adoption of Thunderbolt 3 over the previous 2 Thunderbolt standards, the market is still lacking actual devices that take advantage of the full 40Gbps bandwidth that Thunderbolt 3 offers.

External storage seems like a natural use of this PCI-E 3.0 x4 interface available with the Thunderbolt 3 standard, but storage devices that take advantage of this are few and far between. Most of the devices in the market currently are merely bridges for SATA M.2 drives to Thunderbolt 3, which would be limited by the SATA 6Gb/s interface.

DSC04654.JPG

However, this market gap seems poised to change. Today, we are taking a look at the TEKQ Rapide Thunderbolt 3 Portable SSD, which advertises sequential transfer speeds up to 2.3 GB/s Read and 1.3 GB/s Write.

DSC04662.JPG

Click here to find out more about the TEKQ Rapide Portable Thunderbolt 3 SSD!

Podcast #488 - AMD Ryzen performance, Qualcomm news, and more!

Subject: General Tech | February 22, 2018 - 08:58 AM |
Tagged: video, TrueWireless, snapdragon 845, Ryzen 5 2400G, raven ridge, qualcomm, Primochill Vue, podcast, mx master 2s, logitech, Kigen, EPYC, cherry, bitfenix, amd, 850W

PC Perspective Podcast #488 - 02/22/18

Join us this week for AMD Ryzen performance reviews, Qualcomm news, and more!

You can subscribe to us through iTunes and you can still access it directly through the RSS page HERE.

The URL for the podcast is: http://pcper.com/podcast - Share with your friends!

Hosts: Ryan Shrout, Jeremy Hellstrom, Josh Walrath, Allyn Malventano

Peanut Gallery: Alex Lustenberg, Ken Addison

Program length: 1:20:48

Podcast topics of discussion:

  1. Week in Review:
  2. News items of interest:
  3. Picks of the Week:
    1. 1:12:30 Allyn: UltraVNC
    2. 1:18:10 Josh: My poor wife
  4. Closing/outro
 
 
Source:

Qualcomm Announces Snapdragon 845 Mobile VR Reference Platform

Subject: General Tech | February 21, 2018 - 07:50 PM |
Tagged: VR, snapdragon 845, reference platform, qualcomm, mobile, headset, development

Qualcomm has another mobile-related announcement ahead of MWC, introducing a new VR reference platform based on the Snapdragon 845 in collaboration with HTC. As the new Snapdragon 845 boasts much more powerful graphics from its Adreno 630 GPU compared to the Snapdragon 835 - which was behind the previous mobile VR platform - this represents an important step forward in the mobile VR space.

SVR845.jpg

The increased graphics horsepower isn't the only aspect of the Adreno 630 that should translate into a better mobile VR/AR (now rolled together into the term "XR" for extended reality) experience, as the gains in graphics performance we saw from the SDM845 reference platform are said to come with 30% power savings as well as Adreno Foveation, which allows eye-tracking to direct resources only to the area where the user is looking. Thus Foveation allows for, literally, focused GPU resource allocation, which should translate into better performance with less hardware overhead.

Right view.jpg

The Snapdragon 845 Mobile VR Platform also boasts 6DoF, or "6 degrees of freedom", which incorporates external cameras to improve free movement compared to the previous 3DoF limitations:

"Together, 6DoF and SLAM deliver Roomscale - the ability to track the body and location within a room so you can freely walk around your XR environment without cables or separate room sensors – the first on a mobile standalone device. Much of this is processed on the new dedicated Qualcomm Hexagon Digital Signal Processor (DSP) and Adreno Graphics Processing Unit within the Snapdragon 845. Qualcomm Technologies’ reference designs have supported some of the first wave of standalone VR devices from VR ecosystem leaders like Google Daydream, Oculus and Vive."

Left view.jpg

Qualcomm's goal with the new Snapdragon 845 Mobile VR Platform is to support "the next wave of smartphone and standalone VR headsets", and it seems that mobile hardware is starting to catch up to the ambitions of what is now being called XR.

Source: Qualcomm

Ryan's Law is not the only suggestion when it comes to SSDs

Subject: Storage | February 21, 2018 - 05:59 PM |
Tagged:

The SSD Review has posted a general guide on SSDs and how to ensure you pick the right one.  There are a huge variety of SSDs on the market now, from the original 2.5" SATA drives straight through to M.2 NVMe gum sticks.  Their guide will ensure you know the importance of matching your motherboard to an SSD, to ensure compatibility and performance as well as covering software and firmware updates.  For the more experience, they also delve into the various UEFI/BIOS settings you should look at to balance performance, stability and possibly battery life.  It is a bit of a long read but worth it if you are feeling confused

121A3439.jpg

"This report will be chronological, explaining what needs to be considered in your build including motherboard, SSD selection and installation, UEFI/BIOS settings, OS installation, and finally, SSD optimizations that should be considered."

Here are some more Storage reviews from around the web:

Storage

 

Kingdom Come delivers a challenge to modern GPUs

Subject: General Tech | February 21, 2018 - 04:49 PM |
Tagged: kingdom come, deliverance, gaming

Kingdom Come: Deliverance uses CryEngine 3, which is famous for overwhelming even the highest tier GPUs at 4k resolutions.  [H]ard|OCP's testing reveals that there may be an issue with AMD's cards on this title at the moment.  This may be resolved soon as the two Vega cards performance varied greatly, sometime surpassing the mid-tier NVIDIA cards but then falling below what they should be capable of.  Keep your eye out for a driver update if you are playing this game or plan to.  As far as NVIDIA, not even the 1080Ti can manage playable framerates with all the bells and whistles turned up on 4k.  Check out the details in the full review.

1519037396h1isvaoiaq_1_6_l.jpg

"We take the new game Kingdom Come: Deliverance and test ten current video cards in it to find how each one performs, how those stack up, and what the highest playable settings are. We test 4K, 1440p, and 1080p, with multiple graphics settings, maximum distance sliders, and find out what you need to play this game and have a good experience."

Here is some more Tech News from around the web:

Tech Talk

Source: [H]ard|OCP

The Spectre of the lakes may have been appeased

Subject: General Tech | February 21, 2018 - 01:20 PM |
Tagged: spectre, Skylake, kaby lake, Intel, coffee lake

Intel has pushed out a new set of microcode patches which should mitigate Spectre on Skylake, Kaby Lake and Coffee Lake.  The new patches come with a feature which customers have been clamouring for; a lack of the spontaneous reboots which plagued systems that had taken advantage of the originally released fixes.  The Inquirer did not receive any information on the performance hit of these new fixes, though they should be comparable to the effect of the originals.  Drop by for more info and links to Intel's patch roadmap.

20491730268_3e0e5d9577_o.jpg

"The latest Spectre-mitigating updates from Intel have passed "extensive testing by customers and industry partners to ensure the updated versions are ready for production," according to Intel's Navin Shenoy. "

Here is some more Tech News from around the web:

Tech Talk

Source: The Inquirer
Author:
Manufacturer: BitFenix

Introduction and Features

Introduction

2-Banner-2.jpg

BitFenix is a relatively new player in the PC power supply market. Formed in 2014 and based in New Taipei, Taiwan, BitFenix started their PC hardware business with a focus on power supplies, cases, lighting accessories, and LED fans targeted towards enthusiasts, gamers and modders. They currently have four different power supply lines: the Formula Gold, BitFenix BPA, Whisper M, and the Fury. The Whisper M series includes five models ranging from 450W up to 850W. We will be taking a detailed look at the BitFenix Whisper M 850W power supply in this review.

3-M850-diag.jpg

The BitFenix Whisper M Series power supplies are all modular and certified to comply with the 80 Plus Gold standards for high efficiency. They feature all Japanese made capacitors, a 135mm fan with a FDB, and come backed by a 7-year warranty.

4-M850-cables.jpg

BitFenix Whisper M 850W PSU Key Features:

•    850W Continuous DC output at up to 50°C
•    80 PLUS Gold certified for high efficiency
•    Fully-modular cables
•    Dedicated quad +12V rails
•    135mm Cooling fan with FDB
•    Intelligent Fan Control for quiet operation
•    Japanese made capacitors
•    Complies with Intel ATX12V v2.4 and Haswell C6/C1
•    Active Power Factor correction with Universal AC input (100 to 240 VAC)
•    Safety protections: OCP, OVP, UVP, OPP, SCP, OTP, and SIP
•    No Load Operation (NLO)
•    2013 ErP Lot 6 ready
•    7-Year warranty
•    MSRP: $119.99 USD

Please continue reading our review of the BitFenix Whisper M 850W PSU!!!

AMD goes after $15B embedded space with two new embedded processors

Subject: Processors | February 21, 2018 - 11:22 AM |
Tagged: amd, ryzen, EPYC, embedded, ryzen v1000, epyc 3000

Continuing its expansion of bringing modern processor and graphics designs to as many of its targeted market segments as possible, AMD announced today two new families that address the embedded processor space. The company has already seen double-digital YoY sequential growth in revenue from embedded markets, but the release of the Epyc Embedded 3000 and Ryzen Embedded V1000 family create significant additional opportunity for the company.

amdembed1.png

Embedded markets are unique from traditional consumer and enterprise channels as they address areas from military and aerospace applications to networking hardware and storage devices to retail compute and even casino and arcade gaming. These markets tend to be consistent and stable without the frequent or dramatic swings in architectural preference or market share that we often witness in consumer PCs. As AMD continues to grow and look for stable sources of adjacent income, embedded processors are a critical avenue and one that I believe AMD has distinct advantages in.

amdembed2.png

Research firm IDC estimates the market size that AMD can address with this pair of chip families exceeds $14-15B annually. The largest portion of that ($11-12B) includes storage and networking infrastructure systems that the Epyc 3000 line will target. The remaining amount includes IoT gateways, medical systems, and casino gaming hardware and is the purview of the Ryzen V1000.

Competitors in this space include Intel (with its Xeon D-series and Core family of chips) and many Arm-based designs that focus on low power integration. Intel has the most potential for immediate negative impact with AMD’s expansion in the embedded markets as the shared architecture and compatibility mean customers can more easily move between platforms. AMD is positioning both parts directly against Intel with proposed advantages in value and performance, hoping to move embedded customers to the combined AMD solution.

amdembed5.png

The Ryzen V1000 family combines the company’s recent processor and graphics architectures on a single chip, similar in function to the consumer Ryzen design that was released for notebook and desktop PCs. For the embedded customers and devices being targeted, this marks a completely new class of product with two key benefits over competing solutions. First, it allows for smaller and cooler system designs (critical for the cramped working environments of the embedded space) while increasing maximum performance.

amdembed6.png

Second, the V1000 allows integrators to downscale from using a combination of an Intel processor and a separate, discrete graphics chip to a single chip design. This both raises the ASP (average selling price) for AMD, increasing revenue and potential margin, while lowering the price that customers pay in total for system components.

While AMD struggles to find ways to promote the value of higher performance graphics on its new processors, where it has a significant advantage over Intel, for the consumer and business space, in the embedded markets that additional performance value is well understood. Casino gaming often utilizes multiple high-resolution displays for a single device with demand for high-quality rendered 3D graphics, of which the V1000 can now provide in a single chip design. The same is seen with medical imaging hardware, including ultrasound machines for women’s healthcare and cardiovascular diagnostics.

amdembed3.png

The Epyc Embedded 3000 family does not include integrated graphics on-chip and instead offers higher core performance and performance per dollar compared to competing Intel solutions. AMD believes that the Epyc 3000 will double the total addressable market for the company when it comes to networking and storage infrastructure.

amdembed4.png

AMD previously has disclosed its partnership with Cisco that included AMD-built processor options for some families of switches and other networking gear. As the demand for edge computing grows (systems that will exist near the consumer or enterprise side of a network to aid in computational needs of high speed networks), AMD is offering a compelling solution to counter the Intel Xeon family of processors.

Both the Epyc 3000 and Ryzen V1000 chips represent the first time AMD has targeted embedded customers with specific features and capabilities at the hardware level. During the design phase of its Zen CPU and Vega graphics architecture, business unit leaders included capabilities like multiple 10-gigabit network integration, support of four 4K display outputs, ECC memory (error correction capability for mission-critical applications), and unique embedded-based interfaces for external connectivity.

While these were not needed for the consumer segments of the market, and weren’t exposed in those hardware launches, they provide crucial benefits for AMD customers when selecting a chip for embedded markets.

Source: AMD

Qualcomm signs major carriers and retailers for Always Connected PC launch

Subject: Mobile | February 21, 2018 - 11:10 AM |
Tagged: snapdragon, qualcomm, microsoft, always connected pc

With availability scheduled to begin next month, Qualcomm is prepping for its final push to prepare the market for what it believes is a revolutionary product category for the PC market. Just before the mobile media and analysts focus attention on Mobile World Congress in Barcelona next week, Qualcomm hopes it has completed the final step in the launch of its “Windows 10 on Snapdragon” line. Partners like Amazon, the Microsoft Stores, Verizon, and AT&T will provide the cellular LTE connections to maintain an always-connected state and the retail and online locations to purchase them.

By combining Windows 10 and the company’s Snapdragon mobile platform with efficiency and connectivity advantages other PC chip vendors can’t match, Qualcomm is hoping that its creation of this new sub-category of PC that focuses on being always connected through a smartphone-like cellular connection will pay dividends. Compared to Intel processors that target similar form factors of notebook PCs including 2-in-1s and detachable tablets, the Qualcomm chips differentiate by including the capability for LTE connectivity on every design, without having to pay an upgrade cost.

qcwos1.png

The ability for a Qualcomm-powered Windows 10 PC to have an “instant on” button to turn on the screen without a boot or wake-from-sleep process, again in the same way your smartphone works today, is another touted feature. Battery life is the other tent pole, with Qualcomm often citing disingenuous battery life estimates on Intel-powered systems but “beyond all day” battery life for its own.

Getting these Qualcomm-chip Windows notebooks into the market might seem like a trivial task but inserting a new totally new product category into retail and e-tail takes careful management. Qualcomm will have to educate consumers on how its platform is different and what advantages it can offer over other laptops. Retailers will have to undertake most of that education process, as the customer will need guidance to avoid costly returns and support calls.

The added complexity of a cellular connection will mean that some kind of registration process will have to occur before the PC is truly “always connected.” It will need to be added to a data plan on an existing carrier agreement (think adding a new phone to your cell account) or through a pre-paid arrangement.

qcwos4.jpg

A touchier subject surrounds the retail channel and how PCs are sold in today’s market. Despite the years of legal disputes and resolutions, most in the industry still view Intel as wielding incredible power in the retail and online e-tail sales channels. Through practices like rebates, education programs, and sales clerk discounts, it can be hard for a new player to battle the incumbent without a similar amount of marketing muscle and dollars behind them. Even AMD, with years of practice selling its own processors and systems, struggles at time to get the attention and retail shelf space its products deserve.

In the US market, Microsoft will be taking the helm at the retail channel, stocking and selling the three first Qualcomm Snapdragon Windows 10 PCs from HP, Lenovo, and ASUS. Though the quantity of Microsoft stores is limited, placement here is a big win for Qualcomm and its partners. The Microsoft Stores are generally considered the presentation point for the flagship Windows devices, indicating that Microsoft itself puts a lot of weight behind the category that Qualcomm is creating.

For the online markets, Amazon will be the primary location in the US for sales. In talks with Qualcomm executives, it appears that the online giant will be handling a lot of that education and cellular activation. While I am certain that Qualcomm would love to have had a nationwide brick-and-mortar retailer like Best Buy in the mix, the Minneapolis-based company did not buy in.

Qualcomm has other retailers lined up across the globe, including in Australia, Italy, France, and the UK. China will have sales through JD.com, one of the largest online retailers in the world with more than 266M active users. Qualcomm still has many regions to address with availability and wider distribution as the second wave of PCs comes to market in the holiday of 2018, but it believes it has a solid start under its belt.

carrierlogos.jpg

Graphic Source: TechSpot

Operator support is just as crucial for Qualcomm’s new PC category as retail availability. If a consumer buys a device but isn’t offered service from a mobile telecommunications provider along with it, much of the appeal of the device is lost. Carriers in the UK, Italy, China, France, Germany, Ireland, Spain, Switzerland, and US (including all four major players Verizon, Sprint, AT&T, and T-Mobile), will begin offering plans for the Windows 10 on Snapdragon PCs. Details of what the specific costs will be aren’t being shared and will vary for each carrier.

Affordability of these plans will be critical to the mass market success of the Always Connected PC. Consumers will not pay exorbitant amounts of money to add a device to their existing cell phone plan but providers may be hesitant to offer discounts for a platform that inherently will have potential for greater data consumption. Users on smartphones often get lower resolution video or web pages because of the smaller screen size. But these full capability PCs will likely stream full resolution content and could create additional strain on the networks.

Source: Qualcomm

Qualcomm Introduces TrueWireless Stereo Plus and Broadcast Audio

Subject: General Tech | February 21, 2018 - 10:26 AM |
Tagged: wireless audio, TrueWireless, stereo, qualcomm, occluded, music, Broadcast Audio, bluetooth

Just ahead of MWC, Qualcomm has a pair of announcements to make regarding new Bluetooth wireless technologies, beginning with enhancements to their TrueWireless Stereo technology; a fully wireless solution for devices such as earbuds and the 'hearables' category supported by Qualcomm's new QCC5100 Bluetooth SoC, introduced at CES 2018. This update to TrueWireless Stereo promises "an easier pairing experience with no need to pair individual earbuds" along with "the ability to autonomously role switch each earbud between primary and secondary roles in order to balance power consumption more evenly between the buds for longer playback time".

Diagram_1.jpg

The combination of the new QCC5100 SoC with the Snapdragon 845 is said to offer improved battery life thanks to enhancements lowering power consumption, and the combination of lower latency and a better pairing experience makes this very interesting as we enter a year that will see many Smartphones powered by the new SDM845 platform. Earbuds connected via TrueWireless Stereo Plus each pair with the device individually, rather than the common method of a single earbud connection - "cross-head Bluetooth transmission" - with a second Bluetooth wireless connection from one earbud to the other stereo channel. If that sounds confusing, it really is, and with standard fully wireless options you are at the mercy of the relay connection as far as compression, latency, and channel separation is concerned.

TrueWireless Occluded Earbuds Example Design.jpg

TrueWireless Occluded Earbuds Example Design

"Qualcomm TrueWireless Stereo Plus is an additional mode of the technology designed to eliminate the need for cross-head Bluetooth transmission by simultaneously connecting the mobile device to both earbuds. In this new operating mode only the relevant audio content is engineered to relay to each bud helping to improve robustness and more evenly balance power consumption. When paired with a QCC5100 series based device and the Qualcomm Snapdragon 845 Mobile Platform Qualcomm TrueWireless Stereo Plus can help to reduce power consumption by up to an additional 10 percent, typically helping to deliver an extra hour of listening time before recharge is needed. Additionally, Qualcomm TrueWireless Stereo Plus supports an even simpler pairing experience when connecting earbuds to the mobile device and helps to reduce latency because both buds are connected directly to the smartphone."

Another annoucement on the Bluetooth audio front comes as Qualcomm's Broadcast Audio technology is being made available on the Snapdragon 845 platform. What is Broadcast Audio? We aren't talking LTE or even FM radio here, as it simply allows "one Bluetooth source to stream audio to numerous headsets or speakers with near perfect synchronization".

Diagram_2.jpg

As Qualcomm explains:

"The technology is designed to support Bluetooth to be used for one-to-many sound broadcasting – helping to extend the capabilities of traditional Bluetooth. Qualcomm Broadcast Audio supports ad-hoc multi-speaker parties, sharing headphones and listening to the same music from a single smartphone, or for group audio tours."

Qualcomm's list of features for Broadcast Audio includes:

  • Simpler set-up and pairing of devices and device management helping users to more easily manage which devices can join
  • Broadcast to numerous devices within Bluetooth range
  • Built-in robustness, automatic retransmission and packet-loss concealment
  • Encrypted audio stream designed to help reduce the risk of eavesdropping

Diagram_3.jpg

This integration will not be limited to the Snapdragon 845, as devices using the new QCC5100 SoC as well as others in Qualcomm's range of Bluetooth chips will support Broadcast Audio.

Source: Qualcomm

ARM Introduces Kigen OS for Cellular IoT

Subject: General Tech | February 21, 2018 - 09:00 AM |
Tagged: modem, Kigen, iSIM, iot, cortex, cellular, arm

Last year ARM went on a bit of a buying spree thanks to the financial help of its holding company, SoftBank. One of the companies that it scooped up was that of Simulity Labs for around 12 million pounds. The company was developing IoT security products based on eSIM technology and a robust OS that provides provisioning on a cellular network.

armki_01.jpg

Many believe that the nearly ubiquitous cellular networks that surround us are the key to truly successful IoT products. There are massive cellular deployments around the world. It is a well regulated spectrum. Security through SIM cards is a well known and understood process. It is not impossible to break this security, but it is questionable if it is worth the time and effort to do so.

armki_02.jpg

ARM has gone ahead and provided the means to productize and push this technology with the aim of providing a vast, secure IoT infrastructure that would be relatively easy to rollout with current cellular networks. There are multiple parts to this technology, but ARM is hoping to offer an all-in-one solution that would provide an inexpensive platform for OEMs and Mobile Network Operators (MNOs) to roll out products on.

Click here to read the rest of our coverage of ARM Kigen and iSIM!

Source: ARM

Garnering Intel on a brand new discrete GPU company

Subject: General Tech | February 20, 2018 - 12:50 PM |
Tagged: Intel, discrete gpu

Intel discreetly released a tidbit of information on a new project they are undertaking, a GPU specifically for HPC which will compete with AMD and NVIDIA's current offerings.  We do not know much, The Inquirer was able to ferret out that this will be a two chip solution, with a GPU and FPGA for optimization.  The chips will be fabbed on a 14nm process and contain 1.542 billion transistors, significantly lower than either AMD or NVIDIA's current cards; an interesting fact which we do not know what effect it will have on performance.   Drop by to see if you can glean any more info here.

Capture.PNG

"The chip maker showcased a prototype design for an in-house graphics acceleration unit based on a 14-nanometre process at the excitingly named IEE International Solid-State Circuits Conference in San Francisco, reported PC Watch."

Here is some more Tech News from around the web:

Tech Talk

 

Source: The Inquirer
Subject: General Tech
Manufacturer: Logitech

A Different Kind of Productivity Mouse

Logitech has been a major player in the world of computer mice for years. In fact, if you’re reading this, there’s a good chance you’ve used one yourself. Never one to rest on their laurels, one of Logitech’s latest entries, the MX Master 2S, puts creatives and professionals square in its sights and aims to change the way you compute.

Hero.jpg

Through a suite of interesting control features, a high precision Darkfield sensor, three-system connectivity, and the unique functionality afforded by Logitech’s Options software, the MX Master 2S is more than a little interesting. Read on to see exactly what this mouse has to offer.

Specifications

  • MSRP: $99.99
  • Connectivity: Wireless Receiver, Bluetooth
  • Sensor technology: Darkfield high precision
  • Nominal value: 1000 dpi
  • DPI: 200 to 4000 dpi (can be set in increments of 50 dpi)
  • Battery life: up to 70 days on a single full charge
  • Battery: rechargeable Li-Po (500 mAh) battery
  • Number of buttons: 7
  • Gesture button: Yes
  • Scroll Wheel: Yes, with auto-shift
  • Standard and Special buttons: Back/Forward and middle click
  • Wireless operating distance: 10m
  • Wireless technology: Advanced 2.4 GHz wireless technology
  • Optional software: Logitech Options and Logitech Flow
  • Dimensions (HxWxD): 3.4 in (85.7 mm) x 5.0 in (126.0 mm) x 2.0 in (48.4 mm)
  • Weight: 5.1oz (145g)
  • Warranty: 1-year

1.jpg

The MX Master 2S features retail packaging common to Logitech mice, with the book-like cover and inner display bubble. Behind the tray holding the mouse, you’ll also find the micro-USB cable for charging and some brief documentation. Here you’ll also the features spotlighted, and Logitech makes a special point to showcase the software suite. Right away, it’s clear how important the software package is to the 2S.

2.jpg

Taking the mouse of its packaging, the first thing you’ll notice is how large it is. The main body is wider and suited to palm and claw grips. The left side also features a textured wing for a thumb rest and access to the gesture button. The mouse is heavier than many, coming in at 145g, so gamers will want to take note: it’s not the best for rapid response gaming. For productivity and creative work, I found this weight to be a good compromise between functionality and holding an expansive battery without negatively impacting the smooth glide of its teflon feet.

Continue reading our review of the Logitech MX Master 2S!

AMD EPYC "Rome" Rumors: 7nm, 64 Cores, 2 Designs

Subject: Processors | February 19, 2018 - 08:33 PM |
Tagged: amd, Zen, Zen 2

WCCFTech found some rumors (scroll down near the bottom of the linked article) about AMD’s upcoming EPYC “Rome” generation of EPYC server processors. The main point is that users will be able to buy up to 64 cores (128 threads) on a single packaged processor. This increase in core count will likely be due to the process node shrink, from 14nm down to GlobalFoundries’ 7nm. This is not the same as the upcoming second-generation Zen processors, which are built on 12nm and expected to ship in a few months.

Rome is probably not coming until 2019.

amd-2016-zen-video.png

But when it does… up to 128 threads. Also, if I’m understanding WCCFTech’s post correctly, AMD will produce two different dies for this product line. One design will have 12 cores per die (x4 for 48 cores per package) and the other will have 16 cores per die (x4 for 64 cores per package). The reason why this is interesting is because AMD is, apparently, expecting to sell enough volume to warrant multiple chip designs, rather than just making a flagship and filling in SKUs with bin sorting and cutting off the cores that require abnormally high voltage for a given clock rate as parts with lesser core count. (That will happen too, as usual, but from two different intended designs instead of just the flagship.)

If it works out as AMD plans, this could be an opportunity to acquire prime market share away from Intel and their Xeon processors. The second chip might let them get into second-tier servers with an even more cost-efficient part, because a 12-core die will bin better than a 16-core one and, as mentioned, yield more from a wafer anyway.

Again, this is a common practice from a technical standpoint; the interesting part is that it could work out well for AMD from a strategic perspective. The timing and market might be right for EPYC in various classes of high-end servers.

Source: WCCFTech

ZTE Axon 9 Leaks Surface

Subject: Mobile | February 19, 2018 - 07:36 PM |
Tagged: zte, axon 9, qualcomm, snapdragon 845

So there’s a lot to say about this story. The first bit is that the follow up to my current phone, which is a ZTE Axon 7, will be launching later this year. It will be called the ZTE Axon 9, and a bunch of rumored leaks have just dropped on it.

zte-2018-image-gsmarena_002.jpg

Image Credit: ZTE Weibo via GSM Arena

GSMArena cites claims that the device will come with a Qualcomm Snapdragon 845. High-end SKUs will have 6GB of RAM and 128 or 256 GB of internal storage. Low-end SKUs will have 4GB of RAM. Personally, I haven’t come close to filling up the 64GB of the original ZTE Axon 7, although that’s just me. This is the first time I checked pretty much since I got the phone, and I still have about 33 GB remaining. That said, you are not me, and you probably know how much space you’ll use.

The choice of SoC is interesting. ZTE seems to go straight for the top of Qualcomm’s product stack with their flagship device, which puts it against the performance of, for instance, Samsung’s latest-and-greatest at the time. The ZTE Axon 7 came out a few months after the Samsung Galaxy S7, had the same processor, and was hundreds of dollars cheaper. ZTE wanted market share, but it looks like they might be continuing the trend.

The new device is said to have a 6-inch screen, which makes it slightly larger than the Axon 7, which has a 5.5-inch screen. Both cameras have also been upgraded. The rear camera will be 20 megapixels, while the front-facing one will be 13 megapixels. This doesn't say much about how it will perform, such as how much light is required to get a good image, but we will find out eventually.

At around the same time, US intelligence agencies are warning against purchasing ZTE and Huawei devices because the two companies have ties with the Chinese government. ZTE and Huawei both rebuke the assertions, of course. Personally, I use the ZTE Axon 7 as my only cellphone.

It doesn’t bother me.

Source: GSMArena
Author:
Manufacturer: AMD

Memory Matters

Memory speed is not a factor that the average gamer thinks about when building their PC. For the most part, memory performance hasn't had much of an effect on modern processors running high-speed memory such as DDR3 and DDR4.

With the launch of AMD's Ryzen processors, last year emerged a platform that was more sensitive to memory speeds. By running Ryzen processors with higher frequency and lower latency memory, users should see significant performance improvements, especially in 1080p gaming scenarios.

However, the Ryzen processors are not the only ones to exhibit this behavior.

Gaming on integrated GPUs is a perfect example of a memory starved situation. Take for instance the new AMD Ryzen 5 2400G and it's Vega-based GPU cores. In a full Vega 56 or 64 situation, these Vega cores utilize blazingly fast HBM 2.0 memory. However, due to constraints such as die space and cost, this processor does not integrate HBM.

DSC04643.JPG

Instead, both the CPU portion and the graphics portion of the APU must both depend on the same pool of DDR4 system memory. DDR4 is significantly slower than memory traditionally found on graphics cards such as GDDR5 or HBM. As a result, APU performance is usually memory limited to some extent.

In the past, we've done memory speed testing with AMD's older APUs, however with the launch of the new Ryzen and Vega based R3 2200G and R5 2400G, we decided to take another look at this topic.

For our testing, we are running the Ryzen 5 2400G at three different memory speeds, 2400 MHz, 2933 MHz, and 3200 MHz. While the maximum supported JEDEC memory standard for the R5 2400G is 2933, the memory provided by AMD for our processor review will support overclocking to 3200MHz just fine.

Continue reading our look at memory speed scaling with the Ryzen 5 2400G!

Windows 10 on ARM Details

Subject: General Tech | February 19, 2018 - 01:22 PM |
Tagged: microsoft, windows 10, qualcomm, arm

Paul Thurrott found a developer documentation page, Troubleshooting x86 Desktop Apps, on the Windows Dev Center. The goal of the page is to list a few reasons why the software you develop might not be compatible with Windows 10 on ARM and the WOW translation layer. Yup, they’re reusing that name, which was the translation layer for 32-bit Win32 applications running on 64-bit Windows.

microsoft-2016-uwp-logo.png

Based on this document, we now know that Windows on ARM:

  • Will not translate x86 drivers, just x86 applications and services.
  • Does not support 64-bit applications (Thurrott.com says they’re working on it.)
  • Does not support (hardware-accelerated) OpenGL 1.1+ or DirectX 1-8
    • Vulkan is not mentioned anywhere, but I’m guessing not.

There are also a few other issues, like the application cannot modify Windows components (ex: the 7-zip entry in the Windows file explorer’s right-click menu) unless it is recompiled for ARM. Thurrott.com also says that Hyper-V is not supported in Windows 10 on ARM.

The amount of software that Windows on ARM can run is surprisingly both broader and narrower than I would have expected. The major issue for me is OpenGL – you would think that the graphics driver would dictate this, not so much the OS APIs. I certainly hope that, especially after their other pushes toward openness, Microsoft isn’t pressuring ARM manufacturers to not ship an OpenGL driver, even though the hardware vendors clearly know how to support OpenGL ES at the very least.

And yes, there could very well be a good reason, and they might even be working on OpenGL support as we speak, but it’s an odd omission (at least for now).

Lastly, this has nothing to do with UWP applications. This document is only about standard Win32 applications running on ARM processors. UWP is designed to be cross-architecture. You just need to include the ARM target when you build and package.

Source: Microsoft