FMS 2014: Silicon Motion announces new SM2256 controller driving 1xnm TLC NAND

Subject: Storage, Shows and Expos | August 7, 2014 - 05:37 PM |
Tagged: ssd, SM2256, silicon motion, sata, FMS 2014, FMS

Silicon Motion has announced their SM2256 controller. We caught a glimpse of this new controller on the Flash Memory Summit show floor:

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The big deal here is the fact that this controller is a complete drop-in solution that can drive multiple different types of flash, as seen below:

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The SM2256 can drive all variants of TLC flash.

The controller itself looks to have decent specs, considering it is meant to drive 1xnm TLC flash. Just under 100k random 4k IOPS. Writes are understandably below the max saturation of SATA 6Gb/sec at 400MB/sec (writing to TLC is tricky!). There is also mention of Silicon Motion's NANDXtend Technology, which claims to add some extra ECC and DSP tech towards the end of increasing the ability to correct for bit errors in the flash (more likely as you venture into 8 bit per cell territory).

Press blast after the break:

FMS 2014: Phison announces new quad-core PS3110 SATA 6Gb/s SSD controller

Subject: Storage, Shows and Expos | August 7, 2014 - 05:25 PM |
Tagged: ssd, sata, PS5007, PS3110, phison, pcie, FMS 2014, FMS

At the Flash Memory Summit, Phison has updated their SSD controller lineup with a new quad-core SSD controller.

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The PS3110 is capable of handling TLC as well as MLC flash, and the added horsepower lets it push as high as 100k IOPS.

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Also seen was an upcoming PS5007 controller, capable of pushing PCIe 3.0 x4 SSDs at 300k IOPS and close to 3GB/sec sequential throughputs. While there were no actual devices on display of this new controller, we did spot the full specs:

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Full press blast on the PS3110 appears after the break:

Source: Phison

FMS 2014: HGST Claims 3 Million IOPS and 1.5us Access Time SSD - updated with pics

Subject: General Tech, Storage, Shows and Expos | August 7, 2014 - 02:17 PM |
Tagged: ssd, phase change memory, PCM, hgst, FMS 2014, FMS

According to an HGST press release, the company will bring an SSD based on phase change memory to the 2014 Flash Memory Summit in Santa Clara, California. They claim that it will actually be at their booth, on the show floor, for two days (August 6th and 7th).

The device, which is not branded, connects via PCIe 2.0 x4. It is designed for speed. It is allegedly capable of 3 million IOPS, with just 1.5 microseconds required for a single access. For comparison, the 800GB Intel SSD DC P3700, recently reviewed by Allyn, had a dominating lead over the competitors that he tested. It was just shy of 250 thousand IOPS. This is, supposedly, about twelve times faster.

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While it is based on a different technology than NAND, and thus not directly comparable, the PCM chips are apparently manufactured at 45nm. Regardless, that is significantly larger lithography than competing products. Intel is manufacturing their flash at 20nm, while Samsung managed to use a 30nm process for their recent V-NAND launch.

What does concern me is the capacity per chip. According to the press release, it is 1Gb per chip. That is about two orders of magnitude smaller than what NAND is pushing. That is, also, the only reference to capacity in the entire press release. It makes me wonder how small the total drive capacity will be, especially compared to RAM drives.

Of course, because it does not seem to be a marketed product yet, nothing about pricing or availability. It will almost definitely be aimed at the enterprise market, though (especially given HGST's track record).

*** Update from Allyn ***

I'm hijacking Scott's news post with photos of the actual PCM SSD, from the FMS show floor:

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In case you all are wondering, yes, it does in fact work:

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One of the advantages of PCM is that it is addressed at smaller sections as compared to typical flash memory. This means you can see ~700k *single sector* random IOPS at QD=1. You can only pull off that sort of figure with extremely low IO latency. They only showed this output at their display, but ramping up QD > 1 should reasonably lead to the 3 million figure claimed in their release.

Source: HGST

FMS 2014: Marvell announces new 88SS1093 PCIe SSD controller

Subject: Storage, Shows and Expos | August 6, 2014 - 03:03 PM |
Tagged: ssd, pcie, NVMe, Marvell, FMS 2014, FMS, controller, 88SS1093

Marvell is notorious for being the first to bring a 6Gb/sec SATA controller to market, and they continue to do very well in that area. Their very capable 88SS9189 controller powers the Crucial MX100 and M550, as well as the ADATA SP920.

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Today they have announced a newer controller, the 88SS1093. Despite the confusing numbering, the 88SS1093 has a PCIe 3.0 x4 host interface and will support the full NVMe protocol. The provided specs are on the light side, as performance of this controller will ultimately depend on the speed and parallelism of the attached flash, but its sure to be a decent performer. I suspect it would behave like their SATA part, only no longer bottlenecked by SATA 6Gb/sec speeds.

More to follow as I hope to see this controller in person on the exhibition hall (which opens to press in a few hours). Full press blast after the break.

*** Update ***

Apologies as there was no photo to be taken - Marvell had no booth at the exibition space at FMS.

Source: Marvell

FMS 2014: Samsung announces 3D TLC VNAND, Storage Intelligence initiative

Subject: Storage, Shows and Expos | August 5, 2014 - 04:19 PM |
Tagged: FMS, vnand, tlc, ssd, Samsung, FMS 2014, Flash Memory Summit

Just minutes ago at the Flash Memory Summit, Samsung announced the production of 32-layer TLC VNAND:

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This is the key to production of a soon-to-be-released 850 EVO, which should bring the excellent performance of the 850 Pro, with the reduced cost benefit we saw with the previous generation 840 EVO. Here's what the progression to 3D VNAND looks like:

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3D TLC VNAND will look identical to the right most image in the above slide, but the difference will be that the charge stored has more variability. Given that Samsung's VNAND tech has more volume to store electrons when compared to competing 2D planar flash technology, it's a safe bet that this new TLC will come with higher endurance ratings than those other technologies. There is much more information on Samsung's VNAND technology on page 1 of our 850 Pro review. Be sure to check that out if you haven't already!

Another announcement made was more of an initiative, but a very interesting one at that. SSDs are generally dumb when it comes to coordinating with the host - in that there is virtually no coordination. An SSD has no idea which pieces of files were meant to be grouped together, etc (top half of this slide):

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Stuff comes into the SSD and it puts it where it can based on its best guess as to how it should optimize those writes. What you'd want to have, ideally, is a more intelligent method of coordination between the host system and the SSD (more like the bottom half of the above slide). Samsung has been dabbling in the possibilities here and has seen some demonstrable gains to be made. In a system where they made the host software aware of the SSD flash space, and vice versa, they were able to significantly reduce write latency during high IOPS activity.

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The key is that if the host / host software has more control over where and how data is stored on the SSD, the end result is a much more optimized write pattern, which ultimately boosts overall throughput and IOPS. We are still in the experimentation stage on Storage Intelligence, with more to follow as standards are developed and the industry pushes forward.

It might be a while before we see Storage Intelligence go mainstream, but I'm definitely eager to see 3D TLC VNAND hit the market, and now we know it's coming! More to follow in the coming days as we continue our live coverage of the Flash Memory Summit!

PC Perspective Hardware Workshop 2014 @ Quakecon 2014 in Dallas, TX

Subject: Editorial, General Tech, Shows and Expos | July 23, 2014 - 04:43 PM |
Tagged: workshop, video, streaming, quakecon, prizes, live, giveaways

UPDATE: The event is over, but the video is embeded below if you want to see the presentations! Thanks again to everyone that attended and all of our sponsors!

It is that time of year again: another installment of the PC Perspective Hardware Workshop!  Once again we will be presenting on the main stage at Quakecon 2014 being held in Dallas, TX July 17-20th.

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Main Stage - Quakecon 2014

Saturday, July 19th, 12:00pm CT

Our thanks go out to the organizers of Quakecon for allowing us and our partners to put together a show that we are proud of every year.  We love giving back to the community of enthusiasts and gamers that drive us to do what we do!  Get ready for 2 hours of prizes, games and raffles and the chances are pretty good that you'll take something out with you - really, they are pretty good!

Our primary partners at the event are those that threw in for our ability to host the workshop at Quakecon and for the hundreds of shirts we have ready to toss out!  Our thanks to NVIDIASeasonic and Logitech!!

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Live Streaming

If you can't make it to the workshop - don't worry!  You can still watch the workshop live on our live page as we stream it over one of several online services.  Just remember this URL: http://pcper.com/live and you will find your way!

 

PC Perspective LIVE Podcast and Meetup

We are planning on hosting any fans that want to watch us record our weekly PC Perspective Podcast (http://pcper.com/podcast) on Wednesday or Thursday evening in our meeting room at the Hilton Anatole.  I don't yet know exactly WHEN or WHERE the location will be, but I will update this page accordingly on Wednesday July 16th when we get the data.  You might also consider following me on Twitter for updates on that status as well.

After the recording, we'll hop over the hotel bar for a couple drinks and hang out.  We have room for at leaast 50-60 people to join us in the room but we'll still be recording if just ONE of you shows up.  :)

Prize List (will continue to grow!)

Continue reading to see the list of prizes for the workshop!!!

John Carmack's Replacement at id: Tiago Sousa (Crytek)

Subject: General Tech, Shows and Expos | July 19, 2014 - 05:13 PM |
Tagged: quakecon 2014, quakecon, id, crytek

Tiago Sousa was "Lead R&D Graphics Engineer" at Crytek, according to his now defunct Twitter account, "@CRYTEK_TIAGO". According to his new Twitter account, "@idSoftwareTiago", he will be joining id Software to help with DOOM and idTech 6.

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A little less DOOM and gloom.

I find this more interesting because idTech 5 has not exactly seen much usage, outside of RAGE. Wolfenstein: The New Order was also released on the technology, two months ago. There is one other game planned -- and that is it. Sure, RAGE is almost three years old and the engine was first revealed in 2007, making it seven-year-old technology, basically. Still, that is a significant investment to see basically no return on, especially considering that its sales figures were not too impressive (Steam and other digital delivery services excluded).

I also cannot tell if this looks positive for id, after mixed comments from current and former employees (or people who claim to be), or bad for Crytek. The latter company was rumored to be hurting for cash since 2011 and saw the departure of many employees. I expect that there will be more to this story in the coming months and years.

Source: Twitter

Win a BYOC Seat at Quakecon 2014!

Subject: Shows and Expos | July 9, 2014 - 05:27 PM |
Tagged: workshop, quakecon, contest, byoc

Are you interested in attending Quakecon 2014 next weekend in Dallas, TX but just can't swing the BYOC spot? Well, thanks to our friends at Quakecon and at PC Part Picker, we have two BYOC spots up for grabs for fans of PC Perspective!

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While we are excited to be hosting our PC Perspective Hardware Workshop with thousands of dollars in giveaways to pass out on Saturday the 19th, I know that the big draw is the chance to spend Thursday, Friday and Saturday at North America's largest LAN Party.

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The giveaway is simple. 

  1. Fill out the form below with your name and email address.
     
  2. Make sure you are able and willing to attend Quakecon from July 17th - July 20th. There is no point in winning a free BYOC spot that you cannot use!
     
  3. We'll pick a winner on Friday, July 11th so you'll have enough time to make plans.

There you have it. Get it to it guys and we'll see you in Dallas!

Google I/O 2014: Android Extension Pack Announced

Subject: General Tech, Graphics Cards, Mobile, Shows and Expos | July 7, 2014 - 04:06 AM |
Tagged: tegra k1, OpenGL ES, opengl, Khronos, google io, google, android extension pack, Android

Sure, this is a little late. Honestly, when I first heard the announcement, I did not see much news in it. The slide from the keynote (below) showed four points: Tesselation, Geometry Shaders, Computer [sic] Shaders, and ASTC Texture Compression. Honestly, I thought tesselation and geometry shaders were part of the OpenGL ES 3.1 spec, like compute shaders. This led to my immediate reaction: "Oh cool. They implemented OpenGL ES 3.1. Nice. Not worth a news post."

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Image Credit: Blogogist

Apparently, they were not part of the ES 3.1 spec (although compute shaders are). My mistake. It turns out that Google is cooking their their own vendor-specific extensions. This is quite interesting, as it adds functionality to the API without the developer needing to target a specific GPU vendor (INTEL, NV, ATI, AMD), waiting for approval from the Architecture Review Board (ARB), or using multi-vendor extensions (EXT). In other words, it sounds like developers can target Google's vendor without knowing the actual hardware.

Hiding the GPU vendor from the developer is not the only reason for Google to host their own vendor extension. The added features are mostly from full OpenGL. This makes sense, because it was announced with NVIDIA and their Tegra K1, Kepler-based SoC. Full OpenGL compatibility was NVIDIA's selling point for the K1, due to its heritage as a desktop GPU. But, instead of requiring apps to be programmed with full OpenGL in mind, Google's extension pushes it to OpenGL ES 3.1. If the developer wants to dip their toe into OpenGL, then they could add a few Android Extension Pack features to their existing ES engine.

Epic Games' Unreal Engine 4 "Rivalry" Demo from Google I/O 2014.

The last feature, ASTC Texture Compression, was an interesting one. Apparently the Khronos Group, owners of OpenGL, were looking for a new generation of texture compression technologies. NVIDIA suggested their ZIL technology. ARM and AMD also proposed "Adaptive Scalable Texture Compression". ARM and AMD won, although the Khronos Group stated that the collaboration between ARM and NVIDIA made both proposals better than either in isolation.

Android Extension Pack is set to launch with "Android L". The next release of Android is not currently associated with a snack food. If I was their marketer, I would block out the next three versions as 5.x, and name them (L)emon, then (M)eringue, and finally (P)ie.

Would I do anything with the two skipped letters before pie? (N)(O).

E3 2014: SteamBoy Project Is Not a Valve Product

Subject: General Tech, Mobile, Shows and Expos | June 15, 2014 - 01:51 AM |
Tagged: x86, SteamOS, Steam Machine, Steam Controller, steam, mobile, handheld, E3 14, E3

To be doubly clear, if the title was not explicit enough, this announcement is not made by Valve. This company is called, "SteamBoy Machine team". If not a hoax, this is one of the many Steam Machines which are expected to come out of the SteamOS initiative. Rather than taking the platform to a desktop or home theater PC (HTPC) form-factor, this company wants to target the handheld PC gaming market.

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Image Credit: SteamBoy Machine team via The Escapist

If it comes out, that is a clever use of SteamOS. I can see Big Picture Mode being just as useful on a small screen as it is on a TV, especially with its large font and controller navigation. The teasers suggest that it will use the haptic feedback-based touchpads which Valve are expected to base the Steam Controller on. It will also include a 5-inch touchscreen.

The Escapist got into contact with the team and received a few more specs:

  • Quad-Core CPU (x86)
  • 4GB RAM
  • 32GB built-in storage

Even if this company does not make good on their expectations, companies will now be considering portable SteamOS devices. This is the sort of outside-the-box thinking that Valve was pushing for when they wanted to create an open platform. Each party will struggle to win in their personal goals, yet they can also rely on the crowd (other companies or individuals) to keep up in areas where they do not want an edge.

Philosophy aside, the company is targeting 2015 with a "Standard Edition" supporting WiFi and 3G. It would make sense to have a WiFi-only model, but who knows.

Source: Escapist