Subject: General Tech, Graphics Cards, Processors | April 19, 2015 - 02:08 PM | Scott Michaud
Tagged: moores law, Intel
While he was the director of research and development at Fairchild Semiconductor, Gordon E. Moore predicted that the number of components in an integrated circuits would double every year. Later, this time-step would slow to every two years; you can occasionally hear people talk about eighteen months too, but I am not sure who derived that number. In a few years, he would go on to found Intel with Robert Noyce, where they spend tens of billions of dollars annually to keep up with the prophecy.
It works out for the most part, but we have been running into physical issues over the last few years though. One major issue is that, with our process technology dipping into the single- and low double-digit nanometers, we are running out of physical atoms to manipulate. The distance between silicon atoms in a solid at room temperature is about 0.5nm; a 14nm product has features containing about 28 atoms, give or take a few in rounding error.
It has been a good fifty years since the start of Moore's Law. Humanity has been developing plans for how to cope with the eventual end of silicon lithography process shrinks. We will probably transition to smaller atoms and molecules and later consider alternative technologies like photonic crystals, which routes light in the hundreds of terahertz through a series of waveguides that make up an integrated circuit. Another interesting thought: will these technologies fall in line with Moore's Law in some way?
Subject: Processors | April 15, 2015 - 10:04 PM | Ryan Shrout
Tagged: Intel, Skylake, skylake-s, lga1151, 100 series
Some slides have leaked out with information about Intel's forthcoming 6th Generation Core processor, code named Skylake. We have known that Skylake was coming, and coming this year, but there have been a lot of questions about enthusiast parts and what that means for DIY builders. The slides were first seen over at WCCFTech.com and show some interesting new information.
Dubbed Skylake-S, the LGA (socketed) processor will use a new derivative with 1151 pins as well as a new set of chipsets, the Intel 100-series. Skylake is built on the same 14nm process technology used with Broadwell but will feature a new microarchitecture for both the IA cores and the graphics systems. Obviously you can read the slide yourself above, but some of the highlights are worth touching on individually. Skylake will support both DDR3L and DDR4 memory systems with the enthusiast grade parts likely the only ones to attempt to push the newer, faster DDR4 speeds.
Enthusiasts will also be glad to know that there are planned 95 watt quad-core SKUs that will support unlocked features and overclocking capability. Intel lists an "enhanced" BCLK overclocking with the term "full range" which likely means there will no longer be a need for straps to 125 MHz, etc. A 95 watt TDP is higher than the 88 watt limit we saw on Haswell processors so there is a chance we might actually witness usable performance gains if Intel can get the clock speeds up and above where they sit today with current generation parts.
The use of DMI 3.0, the connection between the processor and the chipset, sees the first increase in bandwidth in many generations. Rated at 8 GT/s, twice that of the DMI 2.0 interface used on Haswell, should allow for fewer bottlenecks on storage and external PCIe connections coming from the chipset.
The new Intel 100-series chipsets will come in three variants at launch: the Z170, the H170 and the H110. The one we are most concerned with is the Z170 of course as it will be paired wit the higher end 65 watt and 95 watt enthusiast processors. Based on these specs, Skylake will continue to operate with only 16 lanes of PCI Express 3.0 capable of running at 1 x16, 2 x8 or 1 x8 and 2 x4 connections. With either DDR3L or DDR4 you will have a dual-channel memory system.
For storage, the Z170 still has six SATA 6.0 Gb/s ports, moves to 14 USB ports maximum with 10 of them capable of USB 3.0 speeds and it upgrades Intel RST to support PCIe storage drivers. Of note here is that the Intel chipset does not include USB 3.1 capability so motherboard vendors will continue to need an external controller to integrate it. Without a doubt the 100-series chipsets will be able to support booting and compatibility with the new Intel 750-series PCIe SSDs, the current king of the hill.
As for timing, the roadmap lists the Z170 chipset and the Skylake-S processor as a Q3 2015 release. I would normally expect that to line up with Computex in early June but that doesn't appear to be the case based on other information I am getting.
Subject: Processors | April 7, 2015 - 05:56 PM | Jeremy Hellstrom
Tagged: amd, FX-8320e
Over at Techgage one of the writers recently updated their system, due to budget constraints they needed to stay in the $600-700 range all told which of course indicates an AMD build. They chose the $138 FX-8320E for their processor, along with a pair of GTX 760s, the ASUS M5A99FX Pro R2.0, 8GB of DDR3-1866 and with storage, power, cooling and case they managed to keep within the ir budget. The question remain is if it is powerful enough for reasonable gaming duties such as Borderlands 2. Read on to see if the recommendation is to go with AMD or the i3-4330 and a low end H97 board.
"Released this past fall, AMD’s FX-8320E processor promises to deliver a lot of processing power for those on a budget. It sports eight cores, and as a Black Edition, its overclocking capabilities are unrestricted. But is that enough to make this the best go-to budget processor, especially for gamers?"
Here are some more Processor articles from around the web:
- A10-7800 CPU Review @ Hardware Secrets
- AMD A8-7650k Kaveri @ eTeknix
- A10-6800K vs. Core i3-4150 CPU Review @ Hardware Secrets
Subject: Processors, Mobile | March 25, 2015 - 09:51 PM | Scott Michaud
Tagged: Intel, core m, atom, surface, Surface 2, Windows 8.1, windows 10
The stack of Microsoft tablet devices had high-end Intel Core processors hovering over ARM SoCs, the two separated by a simple “Pro” label (and Windows 8.x versus Windows RT). While the Pro line has been kept reasonably up to date, the lower tier has been stagnant for a while. That is apparently going to change. WinBeta believes that a new, non-Pro Surface will be announced soon, at or before BUILD 2015. Unlike previous Surface models, it will be powered by an x86 processor from Intel, either an Atom or a Core M.
This also means it will run Windows 8.1.
The article claims, somewhat tongue-in-cheek, that Windows RT is dead. No. But still, the device should be eligible for a Windows 10 upgrade when it launches, unlike the RT-based Surfaces. Whether that is a surprise depends on the direction you view it from. I would find it silly for Microsoft to release a new Surface device, months before an OS update, but design it to be incompatible with it. On the other hand, it would be the first non-Pro Surface to do so. Either way, it was reported.
The “Surface 3”, whatever it will be called, is expected to be a fanless design. VR-Zone expects that it will be similar to the 10.6-inch, 1080p form factor of the Surface 2, but that seems to be their speculation. That is about all that we know thus far.
Subject: Processors | March 17, 2015 - 03:20 PM | Jeremy Hellstrom
Tagged: Ivy Bridge-E, Intel, i7-4970K, i7-4960X, i7-4770k, Haswell-E
TechPowerUp has put together a quick overview of the differences of Intel's current offerings for your reference when purchasing a new machine or considering an upgrade. The older i7-4770K would run you $310 as compared to $338 for the i7-4790K or $385 for an i7-5820K while the i7-4960X would set you back $1025. Is it worth upgrading your machine if you have an older Haswell, or going full hog to pick up the $1000 flagship model? The results are presented in a handy format and while perhaps not an in depth review the results are quite striking, especially the performance while gaming.
"We review the Haswell-E lineup by pitting all its processors against each other and the Ivy Bridge-E Intel Core i7-4960X, Haswell Refresh Intel Core i7-4970K, and Haswell Intel Core i7-4770K. If you are looking to build a high-end gaming PC, or are looking to upgrade, then look no further: This review will tell you which CPU you will want to get to cover your needs."
Here are some more Processor articles from around the web:
- A6-6400K vs. Pentium G3220 CPU Review @ Hardware Secrets
- Core i7-5960X CPU Review @ Hardware Secrets
- Intel Core i5 4690K - the 5GHz project @ HardwareOverclock
Subject: Editorial, Processors | March 12, 2015 - 08:29 PM | Tim Verry
Tagged: Xeon D, xeon, servers, opinion, microserver, Intel
Intel dealt a blow to AMD and ARM this week with the introduction of the Xeon Processor D Product Family of low power server SoCs. The new Xeon D chips use Intel’s latest 14nm process and top out at 45W. The chips are aimed at low power high density servers for general web hosting, storage clusters, web caches, and networking hardware.
Currently, Intel has announced two Xeon D chips, the Xeon D-1540 and Xeon D-1520. Both chips are comprised of two dies inside a single package. The main die uses a 14nm process and holds the CPU cores, L3 cache, DDR3 and DDR4 memory controllers, networking controller, PCI-E 3.0, and USB 3.0 while a secondary die using a larger (but easier to implement) manufacturing process hosts the higher latency I/O that would traditionally sit on the southbridge including SATA, PCI-E 2.0, and USB 2.0.
In all, a fairly typical SoC setup from Intel. The specifics are where things get interesting, however. At the top end, Xeon D offers eight Broadwell-based CPU cores (with Hyper-Threading for 16 total threads) clocked at 2.0 GHz base and 2.5 GHz max all-core Turbo (2.6 GHz on a single core). The cores are slightly more efficient than Haswell, especially in this low power setup. The eight cores can tap into 12MB of L3 cache as well as up to 128GB of registered ECC memory (or 64GB unbuffered and/or SODIMMs) in DDR3 1600 MHz or DDR4 2133 MHz flavors. Xeon D also features 24 PCI-E 3.0 lanes (which can be broken up to as small as six PCI-E 3.0 x4 lanes or in a x16+x8 configuration among others), eight PCI-E 2.0 lanes, two 10GbE connections, six SATA III 6.0 Gbps channels, four USB 3.0 ports, and four USB 2.0 ports.
All of this hardware is rolled into a part with a 45W TDP. Needless to say, this is a new level of efficiency for Xeons! Intel chose to compare the new chips to its Atom C2000 “Avoton” (Silvermont-based) SoCs which were also aimed at low power servers and related devices. According to the company, Xeon D offers up to 3.4-times the performance and 1.7-times the performance-per-watt of the top end Atom C2750 processor. Keeping in mind that Xeon D uses approximately twice the power as Atom C2000, it is still looking good for Intel since you are getting more than twice the performance and a more power efficient part. Further, while the TDPs are much higher,
Intel has packed Xeon D with a slew of power management technology including Integrated Voltage Regulation (IVR), an energy efficient turbo mode that will analyze whether increased frequencies actually help get work done faster (and if not will reduce turbo to allow extra power to be used elsewhere on the chip or to simply reduce wasted energy), and optional “hardware power management” that allows the processor itself to determine the appropriate power and sleep states independently from the OS.
Being server parts, Xeon D supports ECC, PCI-E Non-Transparent Bridging, memory and PCI-E Checksums, and corrected (errata-free) TSX instructions.
Ars Technica notes that Xeon D is strictly single socket and that Intel has reserved multi-socket servers for its higher end and more expensive Xeons (Haswell-EP). Where does the “high density” I mentioned come from then? Well, by cramming as many Xeon D SoCs on small motherboards with their own RAM and IO into rack mounted cases as possible, of course! It is hard to say just how many Xeon Ds will fit in a 1U, 2U, or even 4U rack mounted system without seeing associated motherboards and networking hardware needed but Xeon D should fare better than Avoton in this case since we are looking at higher bandwidth networking links and more PCI-E lanes, but AMD with SeaMicro’s Freedom Fabric and head start on low power x86 and ARM-based Opteron chip research as well as other ARM-based companies like AppliedMicro (X-Gene) will have a slight density advantage (though the Intel chips will be faster per chip).
Which brings me to my final point. Xeon D truly appears like a shot across both ARM and AMD’s bow. It seems like Intel is not content with it’s dominant position in the overall server market and is putting its weight into a move to take over the low power server market as well, a niche that ARM and AMD in particular have been actively pursuing. Intel is not quite to the low power levels that AMD and other ARM-based companies are, but bringing Xeon down to 45W (with Atom-based solutions going upwards performance wise), the Intel juggernaut is closing in and I’m interested to see how it all plays out.
Right now, ARM still has the TDP and customization advantage (where customers can create custom chips and cores to suit their exact needs) and AMD will be able to leverage its GPU expertise by including processor graphics for a leg up on highly multi-threaded GPGPU workloads. On the other hand, Intel has the better manufacturing process and engineering budget. Xeon D seems to be the first step towards going after a market that they have in the past not really focused on.
With Intel pushing its weight around, where will that leave the little guys that I have been rooting for in this low power high density server space?
Subject: Processors | March 10, 2015 - 10:20 AM | Sebastian Peak
Tagged: uefi, motherboards, lga 1150, Intel, Broadwell, bios, asus
ASUS has announced that all current Intel 9 Series motherboards will support the upcoming 5th-Generation Intel Broadwell LGA 1150 CPUs with an UEFI update.
We reported last week that Intel’s 5th-generation Broadwell CPU had been demonstrated at GDC using Intel’s Iris Pro graphics, though official details about the new LGA versions of Broadwell are not yet public. The desktop variants will no doubt use the same 14nm process technology of the current BGA parts, and it has been rumored that the new CPUs will initially launch in both Core i5 and i7 versions, with the potential for Core i3 and Pentium branded parts to follow (though any potential product information is mere speculation at this point).
It will be interesting to see if the upcoming LGA 5th-Generation CPUs will be able offer any higher perfomance for desktop users compared to existing Haswell parts (such as the i7-4790K), or if there will even be unlocked processors. Considering Broadwell is a mobile-focused part designed for efficency and lower power consumption the chips could offer a compelling solution for small form-factor computers such as HTPCs, as they will presumably provide lower heat and higher IPC than existing parts.
The UEFI updates will go live later today (some updates have already been released) and include all ASUS motherboard models with Z97 and H97 chipsets.
Subject: Processors | March 4, 2015 - 09:07 PM | Ryan Shrout
Tagged: GDC, gdc 15, Intel, Broadwell, iris pro, LGA1150, core i7
Consumer have been asking for it since the first time Intel announced it, but Iris Pro graphics is finally finding its way to the desktop, socketed market. Shown powering one of Dell's new 5K displays, this processor shipping in "mid-2015", is going to be configured with a 65 watt TDP and will be unlocked for overclockers to tweak. Intel first disclosed these plans way back in May of 2014 so we are going to be approaching the 12-month mark for availability.
It doesn't look special, but this system has the first desktop Iris Pro processor
In a new disclosure at GDC, Intel showed the first 5th Generation Core LGA-socketed CPU with Intel® Iris™ Pro graphics. This 65 watt unlocked desktop processor, available mid-2015, will bring new levels of performance and power efficiency to Mini PCs and desktop All-In-Ones. Since 2006 the 3D performance of Intel Graphics has increased nearly 100 fold (Intel 3DMark06 measurements) and powerful form factors from Acer, Medion and Intel’s own NUCs are becoming available with 5th Generation Intel Core processors with Intel Iris Graphics.
Under that little heatsink...
Details of this new CPU offering, including clock speed and graphics performance, are still unknown but Intel claims we will have this part in our hands in the near future. This isn't targeted to overtake consumers with mid-range discrete graphics systems but instead will bring users interested in a SFF or low power system with both home theater features and improved gaming capability. Our testing with Iris Pro graphics in notebooks has proven that the gaming performance gains can be substantial, but often the battery life demands have limited implementations from OEMs. With a desktop part, we might actually be able to see the full capability of an integrated GPU with embedded memory.
Subject: Graphics Cards, Processors | March 4, 2015 - 08:46 PM | Ryan Shrout
Tagged: GDC, gdc 15, API, dx12, DirectX 12, dx11, Mantle, 3dmark, Futuremark
It's probably not a surprise to most that Futuremark is working on a new version of 3DMark around the release of DirectX 12. What might be new for you is that this version will include an API overhead test, used to evaluate a hardware configuration's ability to affect performance in Mantle, DX11 and DX12 APIs.
While we don't have any results quite yet (those are pending and should be very soon), Intel was showing the feature test running at an event at GDC tonight. In what looks like a simple cityscape being rendered over and over, the goal is to see how many draw calls, or how fast the CPU can react to a game engine, the API and hardware can be.
The test was being showcased on an Intel-powered notebook using a 5th Generation Core processor, code named Broadwell. Obviously this points to the upcoming support for DX12 (though obviously not Mantle) that Intel's integrated GPUs will provide.
It should be very interesting to see how much of an advantage DX12 offers over DX11, even on Intel's wide ranges of consumer and enthusiast processors.
SoFIA, Cherry Trail Make Debuts
Mobile World Congress is traditionally dominated by Samsung, Qualcomm, HTC, and others yet Intel continues to make in-roads into the mobile market. Though the company has admittedly lost a lot of money during this growing process, Intel pushes forward with today's announcement of a trio of new processor lines that keep the Atom brand. The Atom x3, the Atom x5, and the Atom x7 will be the company's answer in 2015 for a wide range of products, starting at the sub-$75 phone market and stretching up to ~$400 tablets and all-in-ones.
There are some significant differences in these Atom processors, more than the naming scheme might indicate.
Intel Atom x3 SoFIA Processor
For years now we have questioned Intel's capability to develop a processor that could fit inside the thermal envelope that is required for a smartphone while also offering performance comparable to Qualcomm, MediaTek, and others. It seemed that the x86 architecture was a weight around Intel's ankles rather than a float lifting it up. Intel's answer was the development of SoFIA, (S)mart (o)r (F)eature phone with (I)ntel (A)rchitecture. The project started about 2 years ago leading to product announcements finally reaching us today. SoFIA parts are "designed for budget smartphones; SoFIA is set to give Qualcomm and MediaTek a run for their money in this rapidly growing part of the market."
The SoFIA processors are based on the same Silvermont architecture as the current generation of Atom processors, but they are more tuned for power efficiency. Originally planned to be a dual-core only option, Intel has actually built both dual-core and quad-core variants that will pair with varying modem options to create a combination that best fit target price points and markets. Intel has partnered with RockChip for these designs, even though the architecture is completely IA/x86 based. Production will be done on a 28nm process technology at an unnamed vendor, though you can expect that to mean TSMC. This allows RockChip access to the designs, to help accelerate development, and to release them into the key markets that Intel is targeting.