Subject: Processors | June 7, 2016 - 02:45 PM | Jeremy Hellstrom
Tagged: Zen, kaby lake, Intel, delayed, amd
Bad news upgraders, neither AMD nor Intel will be launching their new CPUs until the beginning of next year. Both AMD's Zen and Intel's Kaby Lake have now been delayed instead of launching in Q4 and Q3 of this year respectively. DigiTimes did not delve into the reasons behind the delay in AMD's 14nm GLOBALFOUNDRIES (and Samsung) sourced Zen but unfortunately the reasons beind Intel's delay are all too clear. With large stockpiles of Skylake and Haswell processors and systems based around them sitting in the channel, AMD's delay creates an opportunity for Intel and retailers to move that stock. Once Kaby Lake arrives the systems will no longer be attractive to consumers and the prices will plummet.
Here is to hoping AMD's delay does not imply anything serious, though the lack of a new product release at a time which traditionally sees sales increase is certainly going to hurt their bottom line for 2016.
"With the delays, the PC supply chain will not be able to begin mass production for the next-generation products until November or December and PC demand is also unlikely to pick up until the first quarter of 2017."
Here are some more Processor articles from around the web:
- Intel Core I7 6950X Extreme Edition Broadwell-E Overclocking Review @ OCC
- Intel Core i7 Extreme Edition @ Nitroware
Subject: Processors | June 7, 2016 - 09:39 AM | Scott Michaud
Tagged: xeon e7 v4, xeon e7, xeon, Intel, broadwell-ex, Broadwell
Yesterday, Intel launched eleven SKUs of Xeon processors that are based on Broadwell-EX. While I don't follow this product segment too closely, it's a bit surprising that Intel launched them so close to consumer-level Broadwell-E. Maybe I shouldn't be surprised, though.
These processors scale from four cores up to twenty-four of them, with HyperThreading. They are also available in cache sizes from 20MB up to 60MB. With Intel's Xeon naming scheme, the leading number immediately after the E7 in the product name denotes the number of CPUs that can be installed in a multi-socket system. The E7-8XXX line can be run in an eight-socket motherboard, while the E7-4XXX models are limited to four sockets per system. TDPs range between 115W and 165W, which is pretty high, but to be expected for a giant chip that runs at a fairly high frequency.
Intel Xeon E7 v4 launched on June 6th with listed prices between $1223 to $7174 per CPU.
Subject: Graphics Cards, Processors, Mobile | June 6, 2016 - 07:11 AM | Scott Michaud
Tagged: hsa 1.1, hsa
The HSA Foundation released version 1.1 of their specification, which focuses on “multi-vendor” compatibility. In this case, multi-vendor doesn't refer to companies that refused to join the HSA Foundation, namely Intel and NVIDIA, but rather multiple types of vendors. Rather than aligning with AMD's focus on CPU-GPU interactions, HSA 1.1 includes digital signal processors (DSPs), field-programmable gate arrays (FPGAs), and other accelerators. I can see this being useful in several places, especially on mobile, where cameras, sound processors, and CPU cores, and a GPU regularly share video buffers.
That said, the specification also mentions “more efficient interoperation with non-HSA compliant devices”. I'm not quite sure what that specifically refers to, but it could be important to keep an eye on for future details -- whether it is relevant for Intel and NVIDIA hardware (and so forth).
Charlie, down at SemiAccurate, notes that HSA 1.1 will run on all HSA 1.0-compliant hardware. This makes sense, but I can't see where this is explicitly mentioned in their press release. I'm guessing that Charlie was given some time on a conference call (or face-to-face) regarding this, but it's also possible that he may be mistaken. It's also possible that it is explicitly mentioned in the HSA Foundation's press blast and I just fail at reading comprehension.
If so, I'm sure that our comments will highlight my error.
Subject: Processors | June 3, 2016 - 04:55 PM | Jeremy Hellstrom
Tagged: X99, video, Intel, i7-6950X, core i7, Core, Broadwell-E, Broadwell
You have seen our take on the impressively powerful and extremely expensive i7-6950X but of course we were not the only ones to test out Intel's new top of the line processor. Hardware Canucks focused on the difference between the ~$1700 i7-6950X and the ~$1100 i7-6900K. From synthetic benchmarks such as AIDA through gaming at 720p and 1080p, they tested the two processors against each other to see when it would make sense to spend the extra money on the new Broadwell-E chip. Check out what they thought of the chip overall as well as the scenarios where they felt it would be full utilized.
"10 cores, 20 threads, over $1700; Intel's Broadwell-E i7-6950X delivers obscene performance at an eye-watering price. Then there's the i7-6900K which boasts all the same niceties in a more affordable package."
Here are some more Processor articles from around the web:
- Intel Core I7 6950X Extreme Edition Broadwell-E CPU Review @ OCC
- Intel i7-6900K @ Hardwareheaven
- Intel i7-6950X @ Overclockers.com
- Intel Core i7 6950X @ Kitguru
- AMD Athlon X4 845 CPU Review @ Neoseeker
- AMD A10-7860K 65W APU @ techPowerUp
- AMD A10-7890K APU Review @ Neoseeker
Subject: Processors | May 31, 2016 - 11:57 PM | Scott Michaud
Tagged: Zen, computex 2016, computex, amd
At the end of the AMD Computex 2016 keynote, Lisa Su, President and CEO of the company, announced a few details about their upcoming Zen architecture. This will mark the end of the Bulldozer line of architectures that attempted to save die area by designing cores in pairs, eliminating what AMD projected to be redundancies as the world moved toward multi-core and GPU compute. Zen “starts from scratch” and targets where they now see desktop, server, laptop, and embedded devices heading.
They didn't really show a whole lot at the keynote. They presented an animation that was created and rendered on the new architecture. I mean, okay, but that's kind-of like reviewing a keyboard by saying that you used it to type the review. It's cool that you have sample silicon available to use internally, but we understand that it physically works.
That said, Lisa Su did say some hard numbers, which should be interesting for our readers. AMD claims that Zen has 40% higher IPC from their previous generation (which we assume is Excavator). It will be available for desktop with eight cores, two threads per core, on their new AM4 platform. It also taped out earlier this year, with wide sampling in Q3.
I'm curious how it will end up. The high-end CPU market is a bit... ripe for the picking these days. If AMD gets close to Intel in performance, and offers competitive prices and features alongside it, then it would make sense for enthusiast builds. We'll need to wait for benchmarks, but there seems to be low-hanging fruit.
Bristol Ridge Takes on Mobile: E2 Through FX
It is no secret that AMD has faced an uphill battle since the release of the original Core 2 processors from Intel. While stayed mostly competitive through the Phenom II years, they hit some major performance issues when moving to the Bulldozer architecture. While on paper the idea of Chip Multi-Threading sounded fantastic, AMD was never able to get the per thread performance up to expectations. While their CPUs performed well in heavily multi-threaded applications, they just were never seen in as positive of a light as the competing Intel products.
The other part of the performance equation that has hammered AMD is the lack of a new process node that would allow it to more adequately compete with Intel. When AMD was at 32 nm PD-SOI, Intel had introduced its 22nm TriGate/FinFET. AMD then transitioned to a 28nm HKMG planar process that was more size optimized than 32nm, but did not drastically improve upon power and transistor switching performance.
So AMD had a double whammy on their hands with an underperforming architecture and limitted to no access to advanced process nodes that would actually improve their power and speed situation. They could not force their foundry partners to spend billions on a crash course in FinFET technology to bring that to market faster, so they had to iterate and innovate on their designs.
Bristol Ridge is the fruit of that particular labor. It is also the end point to the architecture that was introduced with Bulldozer way back in 2011.
It has been nearly two years since the release of the Haswell-E platform, which began with the launch of the Core i7-5960X processor. Back then, the introduction of an 8-core consumer processor was the primary selling point; along with the new X99 chipset and DDR4 memory support. At the time, I heralded the processor as “easily the fastest consumer processor we have ever had in our hands” and “nearly impossible to beat.” So what has changed over the course of 24 months?
Today Intel is launching Broadwell-E, the follow up to Haswell-E, and things look very much the same as they did before. There are definitely a couple of changes worth noting and discussing, including the move to a 10-core processor option as well as Turbo Boost Max Technology 3.0, which is significantly more interesting than its marketing name implies. Intel is sticking with the X99 platform (good for users that might want to upgrade), though the cost of these new processors is more than slightly disappointing based on trends elsewhere in the market.
This review of the new Core i7-6950X 10-core Broadwell-E processor is going to be quick, and to the point: what changes, what is the performance, how does it overclock, and what will it cost you?
Subject: Cases and Cooling, Processors | May 25, 2016 - 12:54 PM | Sebastian Peak
Tagged: Zen, socket AM3, cpu cooler, amd, AM4
Upgrading to the upcoming Zen processors won't require the purchase of a new cooler or adapter, according to a report from Computer Base (German language).
The AMD Wraith Cooler (image credit: The Tech Report)
Answering a customer question on Facebook, a Thermalright representative responded (translated):
"For all AMD fans, we have good news. As we advance AMD has assured the new AM4 processors and motherboards are put on the usual base-fixing, which is standard for AM2. To follow all the Thermalright coolers are used on the Zen processors without additional accessories!"
This news is hardly surprising considering AMD has used the same format for some time, much as Intel's current CPUs still work with coolers designed for LGA 1156.
10nm Sooner Than Expected?
It seems only yesterday that we had the first major GPU released on 16nm FF+ and now we are talking about ARM about to receive their first 10nm FF test chips! Well, in fact it was yesterday that NVIDIA formally released performance figures on the latest GeForce GTX 1080 which is based on TSMC’s 16nm FF+ process technology. Currently TSMC is going full bore on their latest process node and producing the fastest current graphics chip around. It has taken the foundry industry as a whole a lot longer to develop FinFET technology than expected, but now that they have that piece of the puzzle seemingly mastered they are moving to a new process node at an accelerated rate.
TSMC’s 10nm FF is not well understood by press and analysts yet, but we gather that it is more of a marketing term than a true drop to 10 nm features. Intel has yet to get past 14nm and does not expect 10 nm production until well into next year. TSMC is promising their version in the second half of 2016. We cannot assume that TSMC’s version will match what Intel will be doing in terms of geometries and electrical characteristics, but we do know that it is a step past TSMC’s 16nm FF products. Lithography will likely get a boost with triple patterning exposure. My guess is that the back end will also move away from the “20nm metal” stages that we see with 16nm. All in all, it should be an improved product from what we see with 16nm, but time will tell if it can match the performance and density of competing lines that bear the 10nm name from Intel, Samsung, and GLOBALFOUNDRIES.
ARM has a history of porting their architectures to new process nodes, but they are being a bit more aggressive here than we have seen in the past. It used to be that ARM would announce a new core or technology, and it would take up to two years to be introduced into the market. Now we are seeing technology announcements and actual products hitting the scenes about nine months later. With the mobile market continuing to grow we expect to see products quicker to market still.
The company designed a simplified test chip to tape out and send to TSMC for test production on the aforementioned 10nm FF process. The chip was taped out in December, 2015. The design was shipped to TSMC for mask production and wafer starts. ARM is expecting the finished wafers to arrive this month.
Subject: Processors, Mobile | May 9, 2016 - 01:42 PM | Scott Michaud
Tagged: apple, a11, 10nm, TSMC
Before I begin, the report comes from DigiTimes and they cite anonymous sources for this story. As always, a grain of salt is required when dealing with this level of alleged leak.
That out of the way, rumor has it that Apple's A11 SoC has been taped out on TSMC's 10nm process node. This is still a little way's away from production, however. From here, TSMC should be providing samples of the now finalized chip in Q1 2017, start production a few months later, and land in iOS devices somewhere in Q3/Q4. Knowing Apple, that will probably align with their usual release schedule -- around September.
DigiTimes also reports that Apple will likely make their split-production idea a recurring habit. Currently, the A9 processor is fabricated at TSMC and Samsung on two different process nodes (16nm for TSMC and 14nm for Samsung). They claim that two-thirds of A11 chips will come from TSMC.