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Past Nano History
One could argue that VIA jumped on the low power bandwagon before it was really cool. Way back in the late 90s VIA snatched up processor firms Cyrix and Centaur, and started to merge those design teams to create low powered x86 CPUs. Over the next several years VIA was still flying high on the chipset side, but due to circumstances started to retreat from that business. On the Intel side it was primarily due to the legal issues that stemmed from the front side bus license that VIA had, and how it apparently did not apply to the Pentium 4. On the AMD side it was more about the increased competition from NVIDIA and ATI/AMD, plus the lack of revenue from that smaller CPU market. Other areas have kept VIA afloat through the years, such as audio codecs, very popular Firewire controllers, and the latest USB 3.0 components that are starting to show up.
Considering all of the above, VIA thought its best way to survive was to get into the CPU business and explore a niche in the x86 market that had been widely ignored except for a handful of products from guys like Nat Semi (who had originally bought up Cyrix). In the late 90s and early 00s there just was not much of a call for low power x86 products, and furthermore the industry was still at a point where even mundane productivity software would max out the top end x86 processors at the time. This was a time where 1GHz was still not common, and all processors were single core. Fast forward to 2011 and we have four and six core processors running in excess of 3 GHz. We have also seen a dramatic shift in the x86 realm to specialized, lower power processors.
Read on for more details!
Phenom II End of Line
It was January, 2009 when AMD released their first 45 nm product to the desktop market. While the server market actually received the first 45 nm parts some months earlier, they were pretty rare until AMD finished ramping production and was able to release the next generation of Phenom parts into the wild. The Phenom II proved an able competitor to Intel’s seemingly unstoppable Core 2 architecture. While the Phenom II typically had to be clocked slightly higher than the competing products, they held up well in terms of price and performance.
AMD was finally able to overcome the stigma of the original Phenom launch, which was late, slow, and featured that wonderful revision B2 bug. The Phenom II showed none of those problems, per clock performance was enhanced, and the chips were able to run at speeds of 3.0 GHz. These chips were able to hit speeds of 4+ GHz on water cooling, and 5+ GHz using LNO2. AMD seemed finally back in the game. The Phenom II looked to propel AMD back into competitiveness with Intel, and the leaks pertaining to the 6 core versions of the architecture only made consumers all the more excited for what was to come.
Just Like Zacate Before It...
AMD let leak today that late last month the Singapore packaging facility shipped the first Llano products for revenue. This is a big event for AMD, as their Future Really is Fusion. I take a look at what all this means for the company, as well as cover how their motherboard partners are going to handle part of the transition to AM3+.Way back in early November, 2010 it was reported that AMD began their first revenue shipments of the Zacate/Ontario processors to their partners. This was big news for AMD, as they expected these processors to make quite the impact in the market. It took a while for the first processors to actually hit the market in final form, and it wasn’t until after CES in early 2011 that we actually saw products that were available to consumers. Things really did not take off until as recently as February, and the demand for these chips is still at a very high level.
So today’s announcement on the AMD Blog site that the packaging arm of AMD in Singapore has shipped the first revenue Llano based parts is very important for the company. While Llano is not based on the next generation Bulldozer CPU architecture, it does feature what could be argued as the fastest and most advanced integrated graphics processor in the world. AMD is still aiming for solid CPU performance by including a fast four core Phenom II based processor, with some IPC improvements that should help it keep competitive in most workloads. But the real star will be the graphics. While we have seen some big leaps forward over the past few years in integrated performance, this should be a significant landmark in graphics technology. AMD was one of the first to provide users with acceptable 3D performance in the original AMD 690G chipset, and improved it with the 780, 785, and 800 series of integrated graphics. The integrated part inside the Llano should be quantum leap ahead in features and performance as compared to anything else out there.
The happy group of workers with the plain, brown colored box holding the first revenue shipment of Llano based processors.
It took approximately three months before we saw initial penetration of Zacate based parts in the retail market, and we can expect about the same amount of time for Llano. This will be the first 32 nm part that AMD has released, which is around 18 months after Intel launched their first 32 nm parts. AMD and GLOBALFOUNDRIES have wanted to cut that gap, but nobody else in the world has the fabrication resources that Intel does. I would imagine that many of these first Llano parts are actually aimed at the notebook market, where they could make the biggest financial impact as well as provide some TDP/clockspeed leeway which allows GLOBALFOUNDRIES time to work on higher clocked versions to improve yields and bins.
We will see desktop parts shortly after, and can expect a fair supply by early July. This should be hitting OEMs as they are preparing for the “Back to School” launches in early August. AMD is truly offering what looks to be standalone graphics card performance on a CPU, all at around 95 watts TDP for the average desktop part. Combined with a true quad core processor and an ample amount of L2 cache per core, we should see performance that rivals that of a high end Athlon II X4 combined with a HD 6550 graphics card. All combined in one nice little package, and for a slightly lower cost (and a lower cost of goods for the manufacturer).
Earlier last week we were informed that quite a few motherboards from Asus, Gigabyte, and MSI will be compatible with the upcoming AM3+ based Bulldozer products. Because none of these current boards are built to utilize CPU graphics, they likely will not be compatible with Llano. This really wouldn’t make any sense anyway, since current AM3 processors would work just as well as the first generation of Llano processors. But the current AM3 motherboards should not have a problem with the first generation of Bulldozer processors.
Gigabyte is shipping boards with the block socket denoting AM3+ compatibility.
Asus and MSI are providing BIOS updates to their 800 series of motherboards. Asus looks to provide BIOS updates for 890FX, 890GX, and some 880G based boards. MSI is concentrating on the 890FX and 890GX series, but leaving out the 880 and 870 parts. Gigabyte is actually shipping “Black Socket” AM3+ compatible boards, and these comprise nearly their entire current lineup of 800 series of boards. Users have spotted the black socket 870 boards for sale around North America, but so far they have been a handful of boards. From all indications these are not actually AM3+ sockets, but are in fact AM3 but in a black plastic to convey Bulldozer/AM3+ compatibility. The AM3 socket actually has 941 pin holes, but AM3 CPUs feature 938 pins. AM3+ will features 942 pin holds, but the assumption is that the actual chips themselves will have a few pins less than 942. Hence the ability to fit into current AM3 boards even though AM3+ processors will have more pins. There will likely be certain tradeoffs with using an AM3 board with AM3+ processors, and these look to be related to power efficiency and maximum turbo clockspeed targets. Current AM3 boards do not look to have the vast VCore switching that AM3+ boards will have, and we could see some limitations provided the HT 3.0 bus of current AM3 boards as compared to the updated HT 3.1 revision in AM3+.
Rumor has it that the Bulldozer release will be around June 20, while Llano will be officially unveiled in the first week of July. That may or may not hold true, depending on how well AMD is able to ship these products. Computex will likely see a lot more information slip out, as well as the ubiquitous motherboard support and floor samples being freely viewed by the public. The official release of AM3+ motherboards should occur by the end of this month, and perhaps in early May. AMD has a great need to seed the market with these motherboards, and they are also backwards compatible with AM3 processors. We also may see the first integrated support of USB 3.0 in these motherboards, as AMD has received USB 3.0 certification for the Hudson FCH core logic chips. There is still confusion as to how these are going to be placed in the market, or if they are even compatible in conjunction with the AMD 900 series of northbridge chips.
These are certainly exciting times for AMD. The HD 6000 series of graphics chips are doing well in the market. They are now truly competitive at the high end again. Their CPUs have been holding their own, especially due to the help that Intel gave them with the Sandy Bridge issue. They are about to release what looks to be a very power CPU architecture in Bulldozer, and they will be rewriting the books when it comes to integrated graphics performance and capabilities. Certainly AMD will not overtake Intel, but we as consumers do need a strong and competitive AMD for the sake of our own wallets.
One of our Sandy Bridge complaints
Lucid first showed up its Virtu software virtualization for GPUs at CES in January but they are now finally ready to give us some hands on testing time. Virtu promises to marry the integrated graphics features of the Sandy Bridge Intel processor graphics to the performance of discrete solutions from NVIDIA and AMD.
AMD at the ISSCC 2011
AMD has provided further details on the Bulldozer architecture at the ISSCC 2011 conference. These include an overall view of each module and some of the physical characteristics, a redesign of the schedulers and integer execution units, and a comprehensive look at power saving features that allow the Bulldozer core to exist in moderate power and TDP ranges. We cover the highlights of the submitted papers and make some guesses at what the final product will look like.
AMD is unleashing a... marketing campaign. Ok, we were hoping that with the Sandy Bridge bug and its delay, AMD would step up and release at least some new CPUs and perhaps the new AM3+ platform. But alas, we take a look at the only official response to Intel's stumble. While this is a new trick from AMD, will it be enough to gobble up some business that Intel left on the table by pulling Sandy Bridge parts from the market?
For years NVIDIA has been hiring engineers with CPU backgrounds, and with the Tegra series of products we finally see what they have been working on. NVIDIA has foregone trying to get a x86 license, and instead is jumping with both feet into the world of ARM processors. Considering the market NVIDIA is aiming for, they have the chance to be a prominent figure in processor technology for years to come.
Sandy Bridge Architecture Overview
Intel's newest processor architecture is here, codenamed Sandy Bridge. The first mainstream monolithic CPU/GPU part on the market, the SNB processor lineup impressed us in our testing. We review the Core i7-2600K, Core i5-2500K and 2400 as well as the dual-core Core i3-2100. There are lot of questions answered: is the new processor graphics going to kill cheap discrete cards? Is performance better than Lynnfield? Is the media transcoding technology worthy of the hype?
Mobile Quad-Core Power
So you've read about the desktop version of Sandy Bridge - how will the mobile version compare? As a quad-core, 8-thread processor, the Core i7-2820QM is a powerful CPU that will make any mobile user drool. How does it, as well as the upgraded graphics, stand up against the Arrandale and older Core 2 Duo notebook platforms?
The Holiday Season Swings Around Again
December has come around again, and AMD is sprucing up their lineup with three new processors sporting a 100 MHz increase in clockspeed. The new AMD "King of the Hill" is the Phenom II X6 1100T, a Black Edition processor which incrementally increases AMD's top performer. Along for the ride are the Athlon II X3 455 and Phenom II X2 565.
A quick visit to Austin
AMD's first Fusion APU is nearly here and we are finally able to talk about performance results from our hands out time with a reference platform a couple weeks back. The new AMD E-350 with Radeon HD 6310 graphics is going to put the world of ultra-mobile computing on its head!
What brings you to Austin?
AMD invited PCPer.com down to Austin to lay hands on the higher powered version of AMD's first APU family of products. Ryan was able to work with the Brazos based platform, and was able to tell briefly about his experiences. We also put together a preview of the Bobcat architecture, and what kind of changes it brings to AMD's latest processor cores.
Some VIA History
Since the original VIA Nano was released, we have been expecting the dual core version to eventually hit the scene. Now after several years, we have our hands on the first samples of this new product. We also were able to see what the VIA VN1000 integrated graphics chipset can do in the face of the latest competition from AMD.
Speed Bumps (and more) for Everyone!
AMD again refreshes its lineup with a speed bump, but it also throws a couple new wrinkles. The Phenom II X6 1075T is not a speed bump, nor is it unlocked, but it helps to flesh out the X6 family of parts at $245 US. AMD also introduces a new barnburner with the Phenom II X4 970. The Phenom II X2 560, Athlon II X4 645, Athlon II X3 450, and Athlon II X2 265 round out the collection of parts. Each is unique in their own special way, and we test every one.
AMD has plans for 2011
AMD is always lurking right around the corner during IDF and was eagerly showing off their Zacate / Ontario APUs. The first of the CPU/GPU hybrids from AMD are proving to be incredibly impressive performers especially with the power consumption taken into consideration. We took some time this week to sit down with them present you with the results!
Turbo, only better
At IDF this week, Intel is revealing much more information about the new Sandy Bridge processor architecture and one of many interesting features is a new version of Turbo Boost and how it functions with the platform. After spending some time with a handful of engineers and asking about the next-generation Turbo Boost technology, I think we have a good grasp of what it is, how it works and how it affects many different aspects of the new Intel platform.
The First APU from AMD Could be a Good One
At this year's IFA in Berlin, AMD further took the wraps off of their first APU/Fusion processor. Two variants of the chip were further detailed by AMD, and a bit more digging has uncovered some more interesting aspects of this groundbreaking processor from AMD.
The first for AMD
AMD was on stage today at the first annual Global Technology Conference hosted by former AMD production arm GLOBALFOUNDRIES talking about their move to 32nm process technology and their partnership with the foundry. Most importantly though we saw the first public showing of the AMD Llano Fusion desktop platform APU!!
2011 Can't Get Here Fast Enough
The original Athlon architecture has been refined and reused for the past decade at AMD. Now we finally received the first glimpse of a brand new architecture from AMD, and one that they hope will again place them at the forefront of innovation. Bulldozer is AMD's best hope to relive the success of the original Athlon and Athlon 64, and it has a good chance of doing so for the company.
Intel hopes frickin' lasers will replace electrons
Today Intel held a press briefing to discuss a milestone in the development of silicon photonics reaching a reproducible 50 Gbps link between two modules. Silicon photonics is the process of creating, modulating and reading photons via lasers for communications entirely on manufactured silicon. The technology and work being done is very complex but the ideas are pretty simple: create a piece of silicon that can create a laser to transmit data and another chip that can receive and decode the data at a low cost.