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Subject: Processors | June 2, 2015 - 08:40 AM | Sebastian Peak
Tagged: rumor, nuc, leak, Intel Skylake, core i5, core i3
A report from FanlessTech shows what appears to be a leaked slide indicating an upcoming Intel 6th-generation Skylake NUC.
The site claims that these new Intel NUCs will be coming out in Q3 for a 6th-generation Core i3 model, and in Q4 for a 6th-gen Core i5 model. and this new NUC will feature 15W TDP Skylake-U processors and 1866 MHz DDR4 memory, along with fast M.2 storage and an SDXC card reader.
True to their name, FanlessTech speculates about the possibility of a passively-cooled version of the NUC: “Out of the box, the Skylake NUC is actively cooled. But fanless cases from Akasa, HDPLEX, Streacom and cirrus7 are to be expected.”
Here are the reported specs of this NUC:
- Intel 6th Generation Core i3 / i5-6xxxU (15W TDP)
- Dual-channel DDR4 SODIMMs 1.2V, 1866 MHz (32GB max)
- Intel HD Graphics 6xxx
- 1 x mini HDMI 1.4a
- 1 x mini DisplayPort 1.2
- 2 x USB 3.0 ports on the back panel
- 2 x USB 3.0 ports on the front panel (1 x charging capable)
- 2 x Internal USB 2.0 via header
- Internal support for M.2 SSD card (22x42 or 22x80)
- Internal SATA3 support for 2.5" HDD/SSD (up to 9.5mm thickness)
- SDXC slot with UHS-I support on the side
- Intel 10/100/1000Mbps Network Connection
- Intel Wireless-AC xxxx M.2 soldered-down, wireless antennas
- IEEE 802.11ac, Bluetooth 4, Intel® Wireless Display
- Up to 7.1 surround audio via Mini HDMI and Mini DisplayPort
- Headphone/Microphone jack on the front panel
- Consumer Infrared sensor on the front panel
- 19V, 65W wall-mount AC-DC power adapter
No further information has been revealed about this alleged upcoming NUC, but we will probably know more soon.
Subject: Processors | May 28, 2015 - 03:44 PM | Scott Michaud
Tagged: Intel, Skylake, skylake-s, haswell, devil's canyon
For a while, it was unclear whether we would see Broadwell on the desktop. With the recently leaked benchmarks of the Intel Core i7-6700K, it seems all-but-certain that Intel will skip it and go straight to Skylake. Compared to Devil's Canyon, the Haswell-based Core i7-4790K, the Skylake-S Core i7-6700K has the same base clock (4.0 GHz) and same full-processor Turbo clock (4.2 GHz). Pretty much every improvement that you see is pure performance per clock (IPC).
Image Credit: CPU Monkey
In multi-threaded applications, the Core i7-6700K tends to get about a 9% increase while, when a single core is being loaded, it tends to get about a 4% increase. Part of this might be the slightly lower single-core Turbo clock, which is said to be 4.2 GHz instead of 4.4 GHz. There might also be some increased efficiency with HyperThreading or cache access -- I don't know -- but it would be interesting to see.
I should note that we know nothing about the GPU. In fact, CPU Monkey fails to list a GPU at all. Intel has expressed interest in bringing Iris Pro-class graphics to the high-end mainstream desktop processors. For someone who is interested in GPU compute, especially with Explicit Unlinked MultiAdapter in DirectX 12 upcoming, it would be nice to see GPUs be ubiquitous and always enabled. It is expected to have the new GT4e graphics with 72 compute units and either 64 or 128MB of eDRAM. If clocks are equivalent, this could translate well over a teraflop (~1.2 TFLOPs) of compute performance in addition to discrete graphics. In discrete graphics, that would be nearly equivalent to an NVIDIA GTX 560 Ti.
We are expecting to see the Core i7-6700K launch in Q3 of this year. We'll see.
Subject: Processors | May 27, 2015 - 09:45 PM | Scott Michaud
Tagged: xeon, Skylake, Intel, Cannonlake, avx-512
AVX-512 is an instruction set that expands the CPU registers from 256-bit to 512-bit. It comes with a core specification, AVX-512 Foundation, and several extensions that can be added where it makes sense. For instance, AVX-512 Exponential and Reciprocal Instructions (ERI) help solve transcendental problems, which occur in geometry and are useful for GPU-style architectures. As such, it appears in Knights Landing but not anywhere else.
Image Credit: Bits and Chips
Today's rumor is that Skylake, the successor to Broadwell, will not include any AVX-512 support in its consumer parts. According to the lineup, Xeons based on Skylake will support AVX-512 Foundation, Conflict Detection Instructions, Vector Length Extensions, Byte and Word Instructions, and Double and Quadword Instructions. Fused Multiply and Add for 52-bit Integers and Vector Byte Manipulation Instructions will not arrive until Cannonlake shrinks everything down to 10nm.
The main advantage of larger registers is speed. When you can fit 512 bits of data in a memory bank and operate upon it at once, you are able to do several, linked calculations together. AVX-512 has the capability to operate on sixteen 32-bit values at the same time, which is obviously sixteen times the compute performance compared with doing just one at a time... if all sixteen undergo the same operation. This is especially useful for games, media, and other, vector-based workloads (like science).
This also makes me question whether the entire Cannonlake product stack will support AVX-512. While vectorization is a cheap way to get performance for suitable workloads, it does take up a large amount of transistors (wider memory, extra instructions, etc.). Hopefully Intel will be able to afford the cost with the next die shrink.
Subject: Graphics Cards, Processors, Displays, Systems | May 15, 2015 - 03:02 PM | Scott Michaud
Tagged: Oculus, oculus vr, nvidia, amd, geforce, radeon, Intel, core i5
Today, Oculus has published a list of what they believe should drive their VR headset. The Oculus Rift will obviously run on lower hardware. Their minimum specifications, published last month and focused on the Development Kit 2, did not even list a specific CPU or GPU -- just a DVI-D or HDMI output. They then went on to say that you really should use a graphics card that can handle your game at 1080p with at least 75 fps.
The current list is a little different:
- NVIDIA GeForce GTX 970 / AMD Radeon R9 290 (or higher)
- Intel Core i5-4590 (or higher)
- 8GB RAM (or higher)
- A compatible HDMI 1.3 output
- 2x USB 3.0 ports
- Windows 7 SP1 (or newer).
I am guessing that, unlike the previous list, Oculus has a more clear vision for a development target. They were a little unclear about whether this refers to the consumer version or the current needs of developers. In either case, it would likely serve as a guide for what they believe developers should target when the consumer version launches.
This post also coincides with the release of the Oculus PC SDK 0.6.0. This version pushes distortion rendering to the Oculus Server process, rather than the application. It also allows multiple canvases to be sent to the SDK, which means developers can render text and other noticeable content at full resolution, but scale back in places that the user is less likely to notice. They can also be updated at different frequencies, such as sleeping the HUD redraw unless a value changes.
The Oculus PC SDK (0.6.0) is now available at the Oculus Developer Center.
Subject: Processors | May 7, 2015 - 07:36 PM | Scott Michaud
Tagged: Intel, xeon, xeon e7 v3, xeon e7
On May 5th, Intel officially announced their new E7 v3 lineup of Xeon processors. This replaces the Xeon E7 v2 processors, which were based on Ivy Bridge-EX, with the newer Haswell-EX architecture. Interestingly, WCCFTech has Broadwell-EX listed next, even though the desktop is expected to mostly skip Broadwell and jump to Skylake in high-performance roles.
The largest model is the E7-8890 v3, which contains eighteen cores fed by a total of 45MB in L3 cache. Despite the high core count, the E7-8890 v3 has its base frequency set at 2.5 GHz to yield a TDP of 165W. The E7-8891 v3 (165W) and the E7-8893 v3 (140W) drop the core count to ten and four, but raise the base frequency to 2.8 GHz and 3.2 GHz, respectively. The E7-8880L v3 is a low power version, relatively speaking, which will also contains eighteen cores that are clocked at 2.0 GHz. This drops its TDP to 115W while still maintaining 45 MB of L3 cache.
Image Credit: WCCFTech
The product stack trickles down from there, but not much further. Just twelve processors are listed in the Xeon E7 segment, which Intel points out in the WCCFTech slides is a significant reduction in SKUs. This suggests that they believe their previous line was too many options for enterprise customers. When dealing with prices in the range of $1,223 - $7,174 USD for bulk orders, it makes sense to offer a little choice to slightly up-sell potential buyers, but too many choices can defeat that purpose. Also, it was a bit humorous to see such an engineering-focused company highlight a reduction of SKUs with a bubble point like it was a technological feature. Not bad, actually quite good as I mentioned above, just a bit funny.
The Xeon E7 v3 is listed as now available, with SKUs ranging from $1223 - $7174 USD.
Subject: Processors | April 27, 2015 - 06:06 PM | Josh Walrath
Tagged: Zen, Steamroller, Kaveria, k12, Excavator, carrizo, bulldozer, amd
There are some pretty breathless analysis of a single leaked block diagram that is supposedly from AMD. This is one of the first indications of what the Zen architecture looks like from a CPU core standpoint. The block diagram is very simple, but looks in the same style as what we have seen from AMD. There are some labels, but this is almost a 50,000 foot view of the architecture rather than a slightly clearer 10,000 foot view.
There are a few things we know for sure about Zen. It is a clean sheet design that moves away from what AMD was pursuing with their Bulldozer family of cores. Zen gives up CMT for SMT support for handling more threads. The design has a cluster of four cores sharing 8 MB of L3 cache, with each core having access to 512 KB of L2 cache. There is a lot of optimism that AMD can kick the trend of falling more and more behind Intel every year with this particular design. Jim Keller is viewed very positively due to his work at AMD in the K7 through K8 days, as well as what he accomplished at Apple with their ARM based offerings.
One of the first sites to pick up this diagram wrote quite a bit about what they saw. There was a lot of talk about, “right off the bat just by looking at the block diagram we can tell that Zen will have substantially higher single threaded performance compared to Excavator and the Bulldozer family.” There was the assumption that because it had two 256-bit FMACs that it could fuse them to create a single 512 bit AVX product.
These assumptions are pretty silly. This is a very simple block diagram that answers few very important questions about the architecture. Yes, it shows 6 int pipelines, but we don’t know how many are address generation vs. execution units. We don’t know how wide decode is. We don’t know latency to L2 cache, much less how L3 is connected and shared out. So just because we see more integer pipelines per core does not automatically mean, “Da, more is better, strong like tractor!” We don’t know what improvements or simplifications we will see in the schedulers. There is no mention of the front-end other than Fetch and Decode. How about Branch Prediction? What is the latency for the memory controller when addressing external memory?
Essentially, this looks like a simplified way of expressing to analysts that AMD is attempting to retain their per core integer performance while boosting floating point/AVX at a similar level. Other than that, there is very little that can be gleaned from this simple block diagram.
Other leaks that are interesting concerning Zen are the formats that we will see these products integrated into. One leak detailed a HPC aimed APU that features 16 Zen cores with 32 MB of L3 cache attached to a very large GPU. Another leak detailed a server level chip that will support 32 cores and will be seen in 2P systems. Zen certainly appears to be very flexible, and in ways it reminds me of a much beefier Jaguar type CPU. My gut feeling is that AMD will get closer to Intel than it has been in years, and perhaps they can catch Intel by surprise with a few extra features. The reality of the situation is that AMD is far behind and only now are we seeing pure-play foundries start to get even close to Intel in terms of process technology. AMD is very much at a disadvantage here.
Still, the company needs to release new, competitive products that will refill the company coffers. The previous quarter’s loss has dug into cash reserves, but AMD is still stable in terms of cash on hand and long term debt. 2015 will see new GPUs, an APU refresh, and the release of the new Carrizo parts. 2016 looks to be the make or break year with Zen and K12.
Edit 2015-04-28: Thanks to SH STON we have a new slide that has been leaked from the same deck as this one. This has some interesting info in that AMD may be going away from exclusive cache designs. Exclusive was a good idea when cache was small and expensive, as data was not replicated through each level of cache (L1 was not replicated in L2 and L2 was not replicated in L3). Intel has been using inclusive cache since forever, where data is replicated and simpler to handle. Now it looks like AMD is moving towards inclusive. This is not necessarily a bad thing as the 512 KB of L2 can easily handle what looks to be 128 KB of L1 and the shared 8 MB of L3 cache can easily handle the 2 MB of L2 data. Here is the link to that slide.
The new slide in question.
Subject: General Tech, Graphics Cards, Processors | April 19, 2015 - 02:08 PM | Scott Michaud
Tagged: moores law, Intel
While he was the director of research and development at Fairchild Semiconductor, Gordon E. Moore predicted that the number of components in an integrated circuits would double every year. Later, this time-step would slow to every two years; you can occasionally hear people talk about eighteen months too, but I am not sure who derived that number. In a few years, he would go on to found Intel with Robert Noyce, where they spend tens of billions of dollars annually to keep up with the prophecy.
It works out for the most part, but we have been running into physical issues over the last few years though. One major issue is that, with our process technology dipping into the single- and low double-digit nanometers, we are running out of physical atoms to manipulate. The distance between silicon atoms in a solid at room temperature is about 0.5nm; a 14nm product has features containing about 28 atoms, give or take a few in rounding error.
It has been a good fifty years since the start of Moore's Law. Humanity has been developing plans for how to cope with the eventual end of silicon lithography process shrinks. We will probably transition to smaller atoms and molecules and later consider alternative technologies like photonic crystals, which routes light in the hundreds of terahertz through a series of waveguides that make up an integrated circuit. Another interesting thought: will these technologies fall in line with Moore's Law in some way?
Subject: Processors | April 15, 2015 - 10:04 PM | Ryan Shrout
Tagged: Intel, Skylake, skylake-s, lga1151, 100 series
Some slides have leaked out with information about Intel's forthcoming 6th Generation Core processor, code named Skylake. We have known that Skylake was coming, and coming this year, but there have been a lot of questions about enthusiast parts and what that means for DIY builders. The slides were first seen over at WCCFTech.com and show some interesting new information.
Dubbed Skylake-S, the LGA (socketed) processor will use a new derivative with 1151 pins as well as a new set of chipsets, the Intel 100-series. Skylake is built on the same 14nm process technology used with Broadwell but will feature a new microarchitecture for both the IA cores and the graphics systems. Obviously you can read the slide yourself above, but some of the highlights are worth touching on individually. Skylake will support both DDR3L and DDR4 memory systems with the enthusiast grade parts likely the only ones to attempt to push the newer, faster DDR4 speeds.
Enthusiasts will also be glad to know that there are planned 95 watt quad-core SKUs that will support unlocked features and overclocking capability. Intel lists an "enhanced" BCLK overclocking with the term "full range" which likely means there will no longer be a need for straps to 125 MHz, etc. A 95 watt TDP is higher than the 88 watt limit we saw on Haswell processors so there is a chance we might actually witness usable performance gains if Intel can get the clock speeds up and above where they sit today with current generation parts.
The use of DMI 3.0, the connection between the processor and the chipset, sees the first increase in bandwidth in many generations. Rated at 8 GT/s, twice that of the DMI 2.0 interface used on Haswell, should allow for fewer bottlenecks on storage and external PCIe connections coming from the chipset.
The new Intel 100-series chipsets will come in three variants at launch: the Z170, the H170 and the H110. The one we are most concerned with is the Z170 of course as it will be paired wit the higher end 65 watt and 95 watt enthusiast processors. Based on these specs, Skylake will continue to operate with only 16 lanes of PCI Express 3.0 capable of running at 1 x16, 2 x8 or 1 x8 and 2 x4 connections. With either DDR3L or DDR4 you will have a dual-channel memory system.
For storage, the Z170 still has six SATA 6.0 Gb/s ports, moves to 14 USB ports maximum with 10 of them capable of USB 3.0 speeds and it upgrades Intel RST to support PCIe storage drivers. Of note here is that the Intel chipset does not include USB 3.1 capability so motherboard vendors will continue to need an external controller to integrate it. Without a doubt the 100-series chipsets will be able to support booting and compatibility with the new Intel 750-series PCIe SSDs, the current king of the hill.
As for timing, the roadmap lists the Z170 chipset and the Skylake-S processor as a Q3 2015 release. I would normally expect that to line up with Computex in early June but that doesn't appear to be the case based on other information I am getting.
Subject: Processors | April 7, 2015 - 05:56 PM | Jeremy Hellstrom
Tagged: amd, FX-8320e
Over at Techgage one of the writers recently updated their system, due to budget constraints they needed to stay in the $600-700 range all told which of course indicates an AMD build. They chose the $138 FX-8320E for their processor, along with a pair of GTX 760s, the ASUS M5A99FX Pro R2.0, 8GB of DDR3-1866 and with storage, power, cooling and case they managed to keep within the ir budget. The question remain is if it is powerful enough for reasonable gaming duties such as Borderlands 2. Read on to see if the recommendation is to go with AMD or the i3-4330 and a low end H97 board.
"Released this past fall, AMD’s FX-8320E processor promises to deliver a lot of processing power for those on a budget. It sports eight cores, and as a Black Edition, its overclocking capabilities are unrestricted. But is that enough to make this the best go-to budget processor, especially for gamers?"
Here are some more Processor articles from around the web:
- A10-7800 CPU Review @ Hardware Secrets
- AMD A8-7650k Kaveri @ eTeknix
- A10-6800K vs. Core i3-4150 CPU Review @ Hardware Secrets
Subject: Processors, Mobile | March 25, 2015 - 09:51 PM | Scott Michaud
Tagged: Intel, core m, atom, surface, Surface 2, Windows 8.1, windows 10
The stack of Microsoft tablet devices had high-end Intel Core processors hovering over ARM SoCs, the two separated by a simple “Pro” label (and Windows 8.x versus Windows RT). While the Pro line has been kept reasonably up to date, the lower tier has been stagnant for a while. That is apparently going to change. WinBeta believes that a new, non-Pro Surface will be announced soon, at or before BUILD 2015. Unlike previous Surface models, it will be powered by an x86 processor from Intel, either an Atom or a Core M.
This also means it will run Windows 8.1.
The article claims, somewhat tongue-in-cheek, that Windows RT is dead. No. But still, the device should be eligible for a Windows 10 upgrade when it launches, unlike the RT-based Surfaces. Whether that is a surprise depends on the direction you view it from. I would find it silly for Microsoft to release a new Surface device, months before an OS update, but design it to be incompatible with it. On the other hand, it would be the first non-Pro Surface to do so. Either way, it was reported.
The “Surface 3”, whatever it will be called, is expected to be a fanless design. VR-Zone expects that it will be similar to the 10.6-inch, 1080p form factor of the Surface 2, but that seems to be their speculation. That is about all that we know thus far.
Subject: Processors | March 17, 2015 - 03:20 PM | Jeremy Hellstrom
Tagged: Ivy Bridge-E, Intel, i7-4970K, i7-4960X, i7-4770k, Haswell-E
TechPowerUp has put together a quick overview of the differences of Intel's current offerings for your reference when purchasing a new machine or considering an upgrade. The older i7-4770K would run you $310 as compared to $338 for the i7-4790K or $385 for an i7-5820K while the i7-4960X would set you back $1025. Is it worth upgrading your machine if you have an older Haswell, or going full hog to pick up the $1000 flagship model? The results are presented in a handy format and while perhaps not an in depth review the results are quite striking, especially the performance while gaming.
"We review the Haswell-E lineup by pitting all its processors against each other and the Ivy Bridge-E Intel Core i7-4960X, Haswell Refresh Intel Core i7-4970K, and Haswell Intel Core i7-4770K. If you are looking to build a high-end gaming PC, or are looking to upgrade, then look no further: This review will tell you which CPU you will want to get to cover your needs."
Here are some more Processor articles from around the web:
- A6-6400K vs. Pentium G3220 CPU Review @ Hardware Secrets
- Core i7-5960X CPU Review @ Hardware Secrets
- Intel Core i5 4690K - the 5GHz project @ HardwareOverclock
Subject: Editorial, Processors | March 12, 2015 - 08:29 PM | Tim Verry
Tagged: Xeon D, xeon, servers, opinion, microserver, Intel
Intel dealt a blow to AMD and ARM this week with the introduction of the Xeon Processor D Product Family of low power server SoCs. The new Xeon D chips use Intel’s latest 14nm process and top out at 45W. The chips are aimed at low power high density servers for general web hosting, storage clusters, web caches, and networking hardware.
Currently, Intel has announced two Xeon D chips, the Xeon D-1540 and Xeon D-1520. Both chips are comprised of two dies inside a single package. The main die uses a 14nm process and holds the CPU cores, L3 cache, DDR3 and DDR4 memory controllers, networking controller, PCI-E 3.0, and USB 3.0 while a secondary die using a larger (but easier to implement) manufacturing process hosts the higher latency I/O that would traditionally sit on the southbridge including SATA, PCI-E 2.0, and USB 2.0.
In all, a fairly typical SoC setup from Intel. The specifics are where things get interesting, however. At the top end, Xeon D offers eight Broadwell-based CPU cores (with Hyper-Threading for 16 total threads) clocked at 2.0 GHz base and 2.5 GHz max all-core Turbo (2.6 GHz on a single core). The cores are slightly more efficient than Haswell, especially in this low power setup. The eight cores can tap into 12MB of L3 cache as well as up to 128GB of registered ECC memory (or 64GB unbuffered and/or SODIMMs) in DDR3 1600 MHz or DDR4 2133 MHz flavors. Xeon D also features 24 PCI-E 3.0 lanes (which can be broken up to as small as six PCI-E 3.0 x4 lanes or in a x16+x8 configuration among others), eight PCI-E 2.0 lanes, two 10GbE connections, six SATA III 6.0 Gbps channels, four USB 3.0 ports, and four USB 2.0 ports.
All of this hardware is rolled into a part with a 45W TDP. Needless to say, this is a new level of efficiency for Xeons! Intel chose to compare the new chips to its Atom C2000 “Avoton” (Silvermont-based) SoCs which were also aimed at low power servers and related devices. According to the company, Xeon D offers up to 3.4-times the performance and 1.7-times the performance-per-watt of the top end Atom C2750 processor. Keeping in mind that Xeon D uses approximately twice the power as Atom C2000, it is still looking good for Intel since you are getting more than twice the performance and a more power efficient part. Further, while the TDPs are much higher,
Intel has packed Xeon D with a slew of power management technology including Integrated Voltage Regulation (IVR), an energy efficient turbo mode that will analyze whether increased frequencies actually help get work done faster (and if not will reduce turbo to allow extra power to be used elsewhere on the chip or to simply reduce wasted energy), and optional “hardware power management” that allows the processor itself to determine the appropriate power and sleep states independently from the OS.
Being server parts, Xeon D supports ECC, PCI-E Non-Transparent Bridging, memory and PCI-E Checksums, and corrected (errata-free) TSX instructions.
Ars Technica notes that Xeon D is strictly single socket and that Intel has reserved multi-socket servers for its higher end and more expensive Xeons (Haswell-EP). Where does the “high density” I mentioned come from then? Well, by cramming as many Xeon D SoCs on small motherboards with their own RAM and IO into rack mounted cases as possible, of course! It is hard to say just how many Xeon Ds will fit in a 1U, 2U, or even 4U rack mounted system without seeing associated motherboards and networking hardware needed but Xeon D should fare better than Avoton in this case since we are looking at higher bandwidth networking links and more PCI-E lanes, but AMD with SeaMicro’s Freedom Fabric and head start on low power x86 and ARM-based Opteron chip research as well as other ARM-based companies like AppliedMicro (X-Gene) will have a slight density advantage (though the Intel chips will be faster per chip).
Which brings me to my final point. Xeon D truly appears like a shot across both ARM and AMD’s bow. It seems like Intel is not content with it’s dominant position in the overall server market and is putting its weight into a move to take over the low power server market as well, a niche that ARM and AMD in particular have been actively pursuing. Intel is not quite to the low power levels that AMD and other ARM-based companies are, but bringing Xeon down to 45W (with Atom-based solutions going upwards performance wise), the Intel juggernaut is closing in and I’m interested to see how it all plays out.
Right now, ARM still has the TDP and customization advantage (where customers can create custom chips and cores to suit their exact needs) and AMD will be able to leverage its GPU expertise by including processor graphics for a leg up on highly multi-threaded GPGPU workloads. On the other hand, Intel has the better manufacturing process and engineering budget. Xeon D seems to be the first step towards going after a market that they have in the past not really focused on.
With Intel pushing its weight around, where will that leave the little guys that I have been rooting for in this low power high density server space?
Subject: Processors | March 10, 2015 - 10:20 AM | Sebastian Peak
Tagged: uefi, motherboards, lga 1150, Intel, Broadwell, bios, asus
ASUS has announced that all current Intel 9 Series motherboards will support the upcoming 5th-Generation Intel Broadwell LGA 1150 CPUs with an UEFI update.
We reported last week that Intel’s 5th-generation Broadwell CPU had been demonstrated at GDC using Intel’s Iris Pro graphics, though official details about the new LGA versions of Broadwell are not yet public. The desktop variants will no doubt use the same 14nm process technology of the current BGA parts, and it has been rumored that the new CPUs will initially launch in both Core i5 and i7 versions, with the potential for Core i3 and Pentium branded parts to follow (though any potential product information is mere speculation at this point).
It will be interesting to see if the upcoming LGA 5th-Generation CPUs will be able offer any higher perfomance for desktop users compared to existing Haswell parts (such as the i7-4790K), or if there will even be unlocked processors. Considering Broadwell is a mobile-focused part designed for efficency and lower power consumption the chips could offer a compelling solution for small form-factor computers such as HTPCs, as they will presumably provide lower heat and higher IPC than existing parts.
The UEFI updates will go live later today (some updates have already been released) and include all ASUS motherboard models with Z97 and H97 chipsets.
Subject: Processors | March 4, 2015 - 09:07 PM | Ryan Shrout
Tagged: GDC, gdc 15, Intel, Broadwell, iris pro, LGA1150, core i7
Consumer have been asking for it since the first time Intel announced it, but Iris Pro graphics is finally finding its way to the desktop, socketed market. Shown powering one of Dell's new 5K displays, this processor shipping in "mid-2015", is going to be configured with a 65 watt TDP and will be unlocked for overclockers to tweak. Intel first disclosed these plans way back in May of 2014 so we are going to be approaching the 12-month mark for availability.
It doesn't look special, but this system has the first desktop Iris Pro processor
In a new disclosure at GDC, Intel showed the first 5th Generation Core LGA-socketed CPU with Intel® Iris™ Pro graphics. This 65 watt unlocked desktop processor, available mid-2015, will bring new levels of performance and power efficiency to Mini PCs and desktop All-In-Ones. Since 2006 the 3D performance of Intel Graphics has increased nearly 100 fold (Intel 3DMark06 measurements) and powerful form factors from Acer, Medion and Intel’s own NUCs are becoming available with 5th Generation Intel Core processors with Intel Iris Graphics.
Under that little heatsink...
Details of this new CPU offering, including clock speed and graphics performance, are still unknown but Intel claims we will have this part in our hands in the near future. This isn't targeted to overtake consumers with mid-range discrete graphics systems but instead will bring users interested in a SFF or low power system with both home theater features and improved gaming capability. Our testing with Iris Pro graphics in notebooks has proven that the gaming performance gains can be substantial, but often the battery life demands have limited implementations from OEMs. With a desktop part, we might actually be able to see the full capability of an integrated GPU with embedded memory.
Subject: Graphics Cards, Processors | March 4, 2015 - 08:46 PM | Ryan Shrout
Tagged: GDC, gdc 15, API, dx12, DirectX 12, dx11, Mantle, 3dmark, Futuremark
It's probably not a surprise to most that Futuremark is working on a new version of 3DMark around the release of DirectX 12. What might be new for you is that this version will include an API overhead test, used to evaluate a hardware configuration's ability to affect performance in Mantle, DX11 and DX12 APIs.
While we don't have any results quite yet (those are pending and should be very soon), Intel was showing the feature test running at an event at GDC tonight. In what looks like a simple cityscape being rendered over and over, the goal is to see how many draw calls, or how fast the CPU can react to a game engine, the API and hardware can be.
The test was being showcased on an Intel-powered notebook using a 5th Generation Core processor, code named Broadwell. Obviously this points to the upcoming support for DX12 (though obviously not Mantle) that Intel's integrated GPUs will provide.
It should be very interesting to see how much of an advantage DX12 offers over DX11, even on Intel's wide ranges of consumer and enthusiast processors.
Subject: Processors | February 24, 2015 - 06:18 PM | Jeremy Hellstrom
Tagged: Puma+, Puma, Kaveri, ISSCC 2015, ISSCC, GCN, Excavator, Carrizo-L, carrizo, APU, amd
While it is utterly inconceivable that Josh might have missed something in his look at Carrizo, that hasn't stopped certain Canadians from talking about Gila County, Arizona. AMD's upcoming processor launch is a little more interesting than just another Phenom II launch, especially for those worried about power consumption. With Adaptive Voltage and Frequency Scaling the new Excavator based chips will run very well at the sub-15W per core pair range which is perfect for POS, airplane entertainment and even in casinos. The GPU portion speaks to those usage scenarios though you can't expect an R9 295 at that wattage. Check out Hardware Canucks' coverage right here.
"AMD has been working hard on their mobile Carrizo architecture and they're now releasing some details about these Excavator architecture-equipped next generation APUs."
Here are some more Processor articles from around the web:
- AMD's new Carrizo: The x86 notebook processor that thinks it's a GPU @ The Register
- AMD Carrizo APU Details Revealed @ TechARP
- AMD FX-8320E Performance On Linux @ Phoronix
- Intel Broadwell HD Graphics 5500: Windows 8.1 vs. Linux @ Phoronix
- Preliminary Tests Of Intel Sandy Bridge & Ivy Bridge vs. Broadwell @ Phoronix
Subject: General Tech, Processors, Systems | February 11, 2015 - 09:07 PM | Scott Michaud
Tagged: Intel, edison, meetup
This is just a quick note for a small subset of our audience. If any of our developer-minded readers are in the Phoenix, Arizona region on February 19th, Intel will be hosting a meetup at UAT (the University of Advancing Technology). The processor vendor will perform a technical presentation about the Edison Internet-of-Things (IoT) developer kit. Shortly after the presentation, the group will move to Aunt Chilada's for a social event.
The presentation will take place in the theatre (there is only one as far as I can tell) at 6:30pm. Admission is free and there will be 10 Intel Edison kits to be raffled. Food and beverages will be provided by Intel (at Aunt Chilada's restaurant).
Subject: General Tech, Processors | February 11, 2015 - 09:00 AM | Scott Michaud
Tagged: amd, amazon
So allegedly Amazon UK sold some AMD A8-7600 APUs, but they actually shipped Athlon 64 X2 5200+ CPUs. Despite what you would think, it was actually “dispatched and sold” by Amazon UK itself, rather than a dishonest seller who has some explaining to do. For those affected, Amazon is apparently handling customer service well, as expected, and promptly replacing the parts. It does not seem to affect other regions, and the problem started just a short time ago.
Unless you're Sebastian, these processors will not even fit in the motherboard socket. PC World has an interesting side-by-side comparison of the two pin configurations. They do not look alike at all. You should not have a hard time identifying the problem if you are careful enough to look before you insert, which is obviously something that you shouldn't have to do. Also, AMD refers customers to their authenticity support page for a few extra ways to be sure that the box that you got came from AMD.
What would be the most interesting part of this story is finding out what happened. Unfortunately, we probably will never know, unless it turns into a famous legal battle of some sort.
Subject: General Tech, Processors, Mobile | February 1, 2015 - 03:17 PM | Scott Michaud
Tagged: mt6753, mediatek
We do not talk about MediaTek's higher-end products too often. Part of that is because they use stock architectures, ARM's Cortex CPU, ARM's Mali GPU, and Imagination Technologies' PowerVR GPU, rather than designing their own CPU and/or GPU portion. Likewise, their design wins are also not covered too much on this site, such as the new Amazon Fire HD tablets, for their own reasons. They still make some interesting chips, though.
Image Credit: A Weibo user via GSM-Arena
The MediaTek MT6753 is a true eight-core, 64-bit ARM SoC. Its press release makes the rest of its details... confusing. The release claims that it is clocked at 1.5 GHz and contains an ARM Mali-T720 GPU that is capable of OpenGL ES 3.0 and OpenCL 1.2. The ARM Mali-T720 is actually capable of OpenGL ES 3.1 and OpenCL 1.1. This leads some sites to report that the MT6753 actually contains a Mali-T760, which is newer and can utilize OpenGL ES 3.1 and OpenCL 1.2 (it is also used in the MT6752 that was released several months ago). Other sites report what MediaTek claims.
GSM-Arena, one site that claims the (more-sensible) Mali-T760, also claims that the Cortex CPU cores can be clocked up to 1.7 GHz. This might not be inaccurate either, because it could be intended to run at ~1.3 to 1.5 GHz with a 1.7 GHz peak for vendors that want to take it to eleven. Alternatively, they could be wrong and it could peak at 1.5 GHz. We don't know, and MediaTek should be more clear about these important details.
Everyone seems to agree on the chip's networking capability, though. It will directly support LTE protocols for both China and western markets. This is expected to make them more competitive against Qualcomm, which might lead to more interesting designs.
Devices containing the MT6753 are expected to ship next quarter.
Subject: Processors | January 29, 2015 - 10:41 AM | Sebastian Peak
Tagged: rumor, processors, Kaveri, Godavari, cpu, Athlon X4, APU, amd
VR-Zone has published a report with a detailed slide showing upcoming AMD Godavari processors, and the updated lineup includes 12 new models.
The release schedule indicates a spring availability for most of the new APUs, with the Athlon X4 850 and 870K shipping in May. The APU line gets a new flagship desktop part with the A10-8850K, and this appears to be a higher-clocked version of the A10-7850K, with a 100MHz higher boost clock (4.1 GHz vs. 4.0 GHz) and a higher GPU clock of 856 MHz (vs. 720 MHz).
Of particular interest for the potential budget quad-core buyer is the Athlon X4 870K, a new 95W part which would presumably replace the X4 860K - a processor that has seen inconsistent availability (and is currently unavailable on Newegg). With more games being released that require a quad-core to run, these sub-$100 Athlon CPUs present a great value in constructing a low-cost gaming system these days.
The slide does not indicate a change in the 28nm process from Kaveri, and it should be safe to assume these will not represent a significant architectural change. The modest clock increases from Kaveri will result in some performance gains, and this is good for consumers assuming these will sell at the same price points as the outgoing models.