Thin, Fanless & Strong, VIA Demos First Em-ITX Board with VIA Nano Processor at ESC Silicon Vall
Subject: Systems | March 27, 2009 - 08:14 AM | Jeremy Hellstrom
Taipei, Taiwan, March 27, 2009 - VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms will showcase the VIA EITX-3000 Em-ITX board at ESC Silicon Valley 2009. Designed for ultra-thin, high-performance, fanless embedded systems at temperatures ranging from -10o to 70o Celsius, the VIA EITX-3000 uses unique processor placement to deliver leading performance in remarkably hot and cold environments.
The VIA EITX-3000 places the energy-efficient VIA Nano processor and VIA VX800 media system processor on the reverse side of the board, making greater real-estate available for passive cooling apparatus and thus negating the need for system fans. This makes the VIA EITX-3000 an exceptional choice for high performance systems in always-on applications such as high-end POS, Kiosk, ATM, HMI, factory automation, POI and digital signage.
Designed to facilitate hassle-free ultra-thin design of high performance, fanless systems, the VIA EITX-3000 is the first VIA product to use the recently announced Em-ITX form factor specification. Using a choice of either 1.3GHz or 1.0GHz VIA Nano Ultra Low Voltage processor, the VIA EITX-3000 couples industry leading performance-per-watt with a thin, fanless design courtesy of its extensive I/O coastline.
The added horsepower of the VIA Nano processor is supplemented by a full array of features including dual gigabit networking, multi-configurable dual on-board LVDS and a VGA port. Four on-board serial ports can be configured through BIOS selection while an on-board DC-DC power converterwith variable power input (DC 7V ~ 36V) supports both AT and ATX modes, configured via onboard switch. For further I/O options, the VIA EITX-3000 can also take advantage of a range of VIA developed EM-IO expansion
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