Gelsinger Speaks To Intel And High-Tech Industry's Rapid Technology Cadenc
Subject: Shows and Expos | September 19, 2007 - 11:42 AM | Jeremy Hellstrom
INTEL DEVELOPER FORUM, San Francisco, Sept. 18, 2007 - Intel Corporation executive Patrick Gelsinger today gave a variety of updates on Intel's work with the industry on the company's processors, surrounding technologies and "tick-tock" design cadence, including new details on Intel's upcoming 45 nanometer (nm) products. He also discussed the industry's recent moves in energy efficient computing, virtualization, broad range of software enabling, as well as recent system architecture initiatives spanning the popular USB interconnect to upcoming lead-free products for the company's Intel® vPro desktop PCs.
"Intel's development model and cadence is a predictive, efficient and effective way to deliver products and provide the industry with an exciting computing roadmap in our relentless pursuit of Moore's Law," said Patrick Gelsinger, senior vice president and general manager of Intel's Digital Enterprise Group, at the Intel Developer Forum in San Francisco. "In addition to our processors, we're focused on delivering energy efficiency via design of better, Hafnium-based High-k transistors as well as enhancements in overall system level architecture to minimize the computer's energy usage."
During his speech, Gelsinger showed the first-ever Intel 45nm High-k metal gate next-generation microarchitecture (Nehalem) dual processor server that uses the element Hafnium instead of silicon in portions of the 700 million-plus transistors inside the processor die, which is about the size of a postage stamp. Nehalem is the codename of a new processor microarchitecture arriving in 2008 that will provide up to three times the peak memory bandwidth of current competing processors. He also showed broad industry support for the Intel® QuickPath Architecture. The QuickPath Interconnect provides high-speed data paths to Nehalem's processor cores.