Intel Demonstrates Its First Mobile Wimax Baseband Chip

Subject: Mobile | December 6, 2006 - 10:40 AM |
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SANTA CLARA, Calif. and HONG KONG,
Dec. 6, 2006 — Intel Corporation today announced design completion of
its first mobile WiMAX baseband chip. Combined with the company's
previously announced single-chip, multi-band WiMAX/Wi-Fi radio, the
pair creates a complete chipset called the Intel® WiMAX Connection
2300. This development marks another major step in Intel's efforts to
deliver an 'always best connected' mobile Internet experience for
future laptops and mobile devices.

The Intel WiMAX Connection 2300 chipset
design was demonstrated during Executive Vice President and Chief Sales
and Marketing Officer Sean Maloney's keynote at the 3G World Congress
and Mobility Marketplace in Hong Kong.


Maloney showed an Intel®
Centrino® Duo mobile technology-based laptop with mobile WiMAX (IEEE
802.16e-2005), Wi-Fi (IEEE 802.11n), and high-speed downlink packet
access (HSDPA) 3G capabilities
successfully accessing the Internet at
broadband speeds over a mobile WiMAX network. The demonstration
illustrates the high-speed and quality of service capability of WiMAX
for handling content-rich applications that can be extremely responsive
without interference from other wireless technologies residing on the
same system.

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