OCZ Technology Answers Enthusiast Demands for a Complete High-End Memory Solution
Subject: Memory | October 11, 2007 - 03:56 PM | Jeremy Hellstrom
Sunnyvale, CA - October 10, 2007 - OCZ Technology Group, a worldwide leader in innovative, ultra-high performance and high reliability memory, today announced the 4GB PC2-6400 CL4 series, the latest edition to the highly-awarded OCZ Reaper HPC (Heat Pipe Conduit) product family. With a proven performance design coupled with the blazing latencies and memory capacity enthusiasts crave, the 4GB PC2-6400 Reaper CL4 series provides rock-solid stability and performance on the latest AMD and Intel platforms.
The Reaper CL4 4GB kit is designed to offer consumers a high end, high density kit that is optimized for gamers who require both faster and more memory to power through the latest graphic-intensive applications and games. The Reaper series makes use of the HPC heatspreader, an innovative patent-pending cooling solution developed by OCZ to effectively minimize heat produced by high-speed memory. As heat rises into the thermo-conductive copper heat pipe conduit, it is dissipated through the strategically-placed compact aluminum fin array. By guiding performance-robbing heat away from key memory components, the unique Reaper HPC design helps facilitate improved overclocking performance, while improving longevity and stability of the modules.
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