VIA's Press Release on CEO's keynote today
Subject: General Tech | June 7, 2006 - 11:46 AM | Jeremy Hellstrom
Centered around the key theme of how
miniaturization and integration on the PC platform is accelerating the
extension of the PC platform into new form factors, new usage models
and new markets, thereby prompting the proliferation of digital
intelligence, Mr Chen outlined VIA's comprehensive strategy covering
silicon, platform and system level innovation in driving the transition
of the PC to devices with consumer electronics appeal.
'These days, the industry is talking about performance per watt,
which is important on a silicon level; however, we believe that the
industry should be thinking of new metrics, such as features per square
inch at the platform level, and functionality per pound at the mobile
system level, or per litre for desktop systems,' said Wenchi Chen,
President and CEO, VIA Technologies, Inc.
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