TSMC's ultraviolet lithography was a little too extreme
Subject: General Tech | February 27, 2014 - 11:37 AM | Jeremy Hellstrom
Tagged: euv, photolithography, Intel, TSMC, DSA
A recent test at TSMC proved their experimental extreme UV lithography process is a little too extreme after a misaligned laser caused serious internal damage to their prototype. This is rather sad news for TSMC as EUV has been touted as the best way to reduce the chip making process below 10nm. Intel has been hedging their bets about EUV, they have invested heavily in the development of the technology but recently have teamed up with ASML Holdings and Arkema to work on directed self assembly, where the chips are convinced to form out of solution on a molecular basis. We are not quite talking Von Neumann machines but it is certainly within the same realm of thought. Other researchers are working on electron etching; forsaking light and its comparatively large wavelength for much smaller etching tools. You can read more about how companies such as Intel are trying to keep Moore's law alive at The Register.
"A recent test of the next-generation chip-etching technology known as extreme ultraviolet lithography (EUV) has come a cropper at chip-baking giant Taiwan Semiconductor Manufacturing Company (TSMC)."
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