Intel is stacking memory on top of the new Xeons
Subject: General Tech | November 22, 2013 - 12:29 PM | Jeremy Hellstrom
Tagged: Supercomputing Conference, Intel, SoC, Near Memory, knights landing
Intel spilled more beans about the new Near Memory architecture that will be accompanying their new Xeon release. The memory will be stacked directly onto the CPU giving much quicker access than you would normally see from DDR3 which has to travel over the motherboard. They have not disclosed expected speeds, which could be up to what we see in current CPU caches only in much larger sizes. This is not quite a Xeon SoC but in the presentation The Register heard of Intel's plans to incorporate optical fabrics and switches onto the CPUs as well with size being the only limit. Perhaps they do have a leg to stand on when they claim the return to power of homogeneous computing.
"According to an EE Times report, Intel's Rajeeb Hazra, a VP and general manager of its data centre group, said Intel would customise high-end Xeon processors and Xeon Phi co-processors by closely integrating memory, both by adding memory dies to a processor package and, at a later date, integrating layers of memory dies into the processor along with optical fabrics and switches."
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