Intel and Corning Enter Joint Development Agreement
Subject: General Tech | July 6, 2005 - 05:21 PM | Joe White
CORNING, N.Y., July 6, 2005 — Intel Corporation and Corning Incorporated (NYSE:GLW) have entered into an agreement to develop ultra low thermal expansion ULEÂ® glass photomask substrates required for Extreme Ultraviolet (EUV) lithography technology. These substrates are needed to develop low defect EUV photomasks to enable 32nm node high-volume production using EUV lithography.
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