Good things come in interesting packages; IBM's new chip substrate
Subject: General Tech | March 21, 2012 - 01:14 PM | Jeremy Hellstrom
Tagged: IBM, power 7+, interposer, packaging
In the typically bass ackwards way of technology, an interposer actually acts as an interface for electrical signals to be routed or spread as opposed to something which acts as a barrier between two objects. Today SemiAccurate's camera caught a picture of an engineering sample of IBM's Power 7+ chip which, according to them, represents a huge step forward in a direction only IBM is going in. That interposer allows a huge amount of bandwidth between the four cores on the larger chip below, without specifications it is hard to say how much but it is quite possibly be more effective than either Intel or AMD's current solutions. As SemiAccurate points out, the interposer is just begging to be filled with cache memory.
"Every once in a while, a company will do something really unexpected, like IBM’s laying down the law in packaging last week. Yes, they showed off a chip, two actually, that does things no one else is even talking about doing."
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