Changes afoot for AMD's CPU process

Subject: General Tech | June 18, 2012 - 06:21 PM |
Tagged: amd, TSMC, 28nm

It looks like AMD is going to move its CPU process from the current Silicon on Insulator to the same 28nm bulk CMOS process at TSMC that they currently are using for their Southern Islands GPUs.  This should see the same changes to thermals as with the HD7xxx series of cards when compared to their predecessors and it is possible that this move could help future APUs as both GPU and CPU portions will be using the same improved process.  The article on DigiTimes also carries a bit of speculation on Sea Island, the next GPU architecture as well as the HSA and ARM on AMD.

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"AMD is set to make a major change in its manufacturing process in 2013 and will fully switch from the existing SOI manufacturing processor to 28nm Bulk CMOS process, according to Mark Papermaster, senior vice president and chief technology officer of AMD."

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Source: DigiTimes
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