A challenger for Arctic Silver?
Subject: Cases and Cooling | January 16, 2006 - 06:41 PM | Jeremy Hellstrom
OCMODSHOP reviews a new Thermal Compound with a big name, TherMax Tech XFlux-GA Thermal Compound. Head over to see if this newcomer can replace Arctic Silver and AS Ceramique as the paste of choice for overclockers.
"Thermal compound is used to fill these microscopic gaps with a material that conducts heat, but
is pliable enough to fit in all the nooks-and-crannies, creating a complete physical surface that
heat can pass through. Over the past few years there have been several different thermal paste
technologies, each of them trying to efficiently transfer heat away from the processor. One of the
best electrically conductive metals is silver followed slightly by copper.
Because silver is the highest electrical and thermal conductor, manufacturers have used it as the
magic ingredient in high-performance thermal compounds. Silver, as we all know, is expensive, and
so are compounds based on silver. More advanced forumulas exist, as the current King of Thermal
Compounds (Arctic Silver Ceramique) contains no silver at all. There is still room for inovation
and competition on the thermal battlefield, and one of the newest heirs to the Throne is TherMax
Tech's XFlux-GA Thermal Compound."
Here are some more Cases & Cooling reviews from around the web:
Feet @ GideonTech.com
TT-15 GehÃ¤use Case Review @ Technic3D
Case Review @ ClubOC
TARGET="_blank">An Introduction to Cooler Master's BTX Form Factor Cases @ BTXFormFactor.com
Tower Case Review @ MODTHEBOX.COM
Case Review @ Ap0calypse.com
TARGET="_blank">Cooler Master Stacker CM 830 Review @ Extreme Overclocking
Remote Multifunction Panel @ Pro-Clockers
TARGET="_blank">Zalman Fatal1ty CPU Cooler w/ X2 Overclocking @ BCCHardware
TARGET="_blank">Arctic Cooling Freezer 64 Pro @ VelocityReviews.com
Negative 146 @ PimpRig
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