Spire tries to tame Prescott's heat

Subject: Cases and Cooling | December 5, 2005 - 11:59 AM |
Tagged:

Any LGA-775 processor does a great impression of a hotplate, and air-cooling them can be a challenge.  Hi-tech Reviews examines Spires latest, the SP507B7-U DiamondCool.  See if it can beat the heat.

"Spire has introduced a heatsink specifically for the LGA 775 motherboard that essentially should

be a very fine cooler since it makes use of two of the most popular cooling techniques. Those

techniques are the use of four heatpipes, which are actually soldered to the fins; the second is

the use of a skivved base. So come on along as we test the DiamondCool and see if performs the way

we think it should."


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