Subject: Processors, Mobile | February 21, 2014 - 10:47 AM | Ryan Shrout
Tagged: wearables, wearable computing, quark, Intel, arm
On a post from the official ARM blogs, the guns are blazing in the battle for the wearable market mind share. Pretty much all the currently available wearable computing devices are using ARM-based processors but that hasn't prevented Intel from touting its Quark platform as the best platform for wearables. There are still lots of questions about Quark when it comes to performance and power consumption but ARM decided to pit its focus on heat.
For a blog post on ARM's website:
Intel’s Quark is an example that has a relatively low level of integration, but has still been positioned as a solution for wearables. Fine you may think, there are plenty of ARM powered communication chipsets it could be paired with, but a quick examination of the development board brings the applicability further into question. Quark runs at a rather surprising, and sizzling to the touch, 57°C. The one attribute it does offer is a cognitive awareness, not through any hardware integration suitable for the wearable market, but from the inbuilt thermal management hardware (complete with example code), which in the attached video you can see is being used to toggle a light switch once touched by a finger which, acting as a heat sync, drops the temperature below 50°C.
Along with this post is a YouTube video that shows this temperature testing taking place.
Of course, when looking at competitive analysis between companies you should always take the results as tentative at best. There is likely to be some change between the Quark Adruino board (Galileo) integration of the X1000 and what would make it into a final production wearable device. Obviously this is something Intel is award of as well and they are also aware of what temperature means for devices that users will have such direct contact with.
The proof will be easy to see, either way, as we progress through 2014. Will device manufacturers integrated Quark in any final design wins and what will the user experience of those units be like?
Still, it's always interesting to see marketing battles heat up between these types of computing giants.
Subject: General Tech | April 27, 2013 - 08:42 AM | Tim Verry
Tagged: wearable computing, ti omap, omap 4430, google glasses, android 4.0.4, Android
Earlier this month, Google announced some of the key specifications of its Google Glass project. However, the company left out just how much RAM the device would have or what the exact System on a Chip (SoC) would power the Android device.
Now that the Google Glass glasses are making their way to developers, those as-yet-unknown details are fairly-certain. Google Glass developer Jay Lee managed to access the device using ADB and discovered that the device offered up 682MB of RAM (accessible to developers) and a Texas Instruments OMAP 4430 SoC. Google Glass likely has 1GB of total RAM, but the operating system and other necessary device-level processes are likely responsible for reserving the remaining 342MB chunk of RAM. The TI OMAP 4430 is the same SoC that is powering the Amazon Kindle Fire and a number of other mobile devices released last year. Because of battery life constraints, Google is most likely not running the chip at its maximum 1GHz clock speed. In the Google+ discussion, developer Kevin Fitch speculated that it is likely clocked at 600MHz due to the cores’ BogoMIPS scores.
The remaining Google Glass specifications include Android 4.0.4 (Ice Cream sandwich), 16GB of internal storage, a 5MP camera, and support for both 802.11g Wi-Fi and Bluetooth. It is essentially a mid-range smartphone hidden away inside a pair of glasses. At $1500, the first round of Google Glass was solely for developers, but once Google rolls it into production next year, judging by the internals, it should be much cheaper.
Are you excited for Google Glass? If you are curious about the software or hardware, Jay Lee is taking questions on his Google + thread.
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