Subject: General Tech | February 11, 2016 - 05:27 PM | Ken Addison
Tagged: vr edition, video, UMC, ue4, podcast, phanteks, nvidia, logitech, GTX 980 Ti, g810, evga, enthoo evolv itx, asrtock, arm, amd, 28HPCU
PC Perspective Podcast #386 - 02/10/2016
Join us this week as we discuss the Logitech G810, Phanteks Enthoo EVOLV ITX, GTX 980 Ti VR Edition and more!
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Hosts: Ryan Shrout, Jeremy Hellstrom, Josh Walrath, and Allyn Malventano
Program length: 1:30:34
Week in Review:
0:26:20 EVGA 750W GQ Power Supply Review
0:36:45 This week’s podcast is brought to you by Casper. Use code PCPER at checkout for $50 towards your order!
News items of interest:
Hardware/Software Picks of the Week
28HPCU: Cost Effective and Power Efficient
Have you ever been approached about something and upon first hearing about it, the opportunity just did not seem very exciting? Then upon digging into things, it became much more interesting? This happened to me with this announcement. At first blush, who really cares that ARM is partnering with UMC at 28 nm? Well, once I was able to chat with the people at ARM, it is much more interesting than initially expected.
The new hotness in fabrication is the latest 14 nm and 16 nm processes from Samsung/GF and TSMC respectively. It has been a good 4+ years since we last had a new process node that actually performed as expected. The planar 22/20 nm products just were not entirely suitable for mass production. Apple was one of the few to actually develop a part for TSMC’s 20 nm process that actually sold in the millions. The main problem was a lack of power and speed scaling as compared to 28 nm processes. Planar was a bad choice, but the development of FinFET technologies hadn’t been implemented in time for it to show up at this time by 3rd party manufacturers.
There is a problem with the latest process generations, though. They are new, expensive, and are production constrained. Also, they may not be entirely appropriate for the applications that are being developed. There are several strengths with 28 nm as compared. These are mature processes with an excess of line space. The major fabs are offering very competitive pricing structures for 28 nm as they see space being cleared up on the lines with higher end SOCs, GPUs, and assorted ASICs migrating to the new process nodes.
TSMC has typically been on the forefront of R&D with advanced nodes. UMC is not as aggressive with their development, but they tend to let others do some of the heavy lifting and then integrate the new nodes when it fits their pricing and business models. TSMC is on their third generation of 28 nm. UMC is on their second, but that generation encompasses many of the advanced features of TSMC’s 3rd generation so it is actually quite competitive.
Subject: General Tech | January 10, 2014 - 05:18 PM | Jeremy Hellstrom
Tagged: UMC, SoFIA, Intel, GLOBALFOUNDRIES, atom, 28nm
GLOBALFOUNDRIES will be the primary supplier of Intel's 28nm baseband chips according to this unconfirmed report at DigiTimes. It seems that Intel really is moving towards a new business model and will be outsourcing some of their upcoming chips to both GLOFO and UMC. Their 28nm PolySiON process will be used to make the next generation of baseband transmitter chips and the new Atom SoC for cellphones and phablets will use TSMC's 28nm HKMG process. The higher end Broxton SoCs will remain at Intel and use their FinFET process. This is a big win for GLOFO and could mean the beginning of a lasting partnership with what was once an AMD asset.
"Intel has contracted Taiwan Semiconductor Manufacturing Company (TSMC) to manufacture its forthcoming Atom mobile processor series codenamed SoFIA, and also placed orders for entry-level baseband chips with Globalfoundries and United Microelectronics (UMC), according to industry sources."
Here is some more Tech News from around the web:
- Worldwide PC shipments decline 6.9% in 4Q13, says Gartner @ DigiTimes
- Microsoft is expected to put the Nvidia Tegra K1 in Surface tablets @ The Inquirer
- 7 Great New Open Source Projects @ Linux.com
- Intel launches 22nm Xeon E5-2400 v2 chips for servers @ The Inquirer
- Fairfax shovels another $250m into buying BlackBerry debt @ The Register
- Rogue Android: We show you how BlackBerry's pain can be your gain @ The Register
- Ford Exec: 'We Know Everyone Who Breaks the Law' Thanks To Our GPS In Your Car @ Slashdot
The Really Good Times are Over
We really do not realize how good we had it. Sure, we could apply that to budget surpluses and the time before the rise of global terrorism, but in this case I am talking about the predictable advancement of graphics due to both design expertise and improvements in process technology. Moore’s law has been exceptionally kind to graphics. We can look back and when we plot the course of these graphics companies, they have actually outstripped Moore in terms of transistor density from generation to generation. Most of this is due to better tools and the expertise gained in what is still a fairly new endeavor as compared to CPUs (the first true 3D accelerators were released in the 1993/94 timeframe).
The complexity of a modern 3D chip is truly mind-boggling. To get a good idea of where we came from, we must look back at the first generations of products that we could actually purchase. The original 3Dfx Voodoo Graphics was comprised of a raster chip and a texture chip, each contained approximately 1 million transistors (give or take) and were made on a then available .5 micron process (we shall call it 500 nm from here on out to give a sense of perspective with modern process technology). The chips were clocked between 47 and 50 MHz (though often could be clocked up to 57 MHz by going into the init file and putting in “SET SST_GRXCLK=57”… btw, SST stood for Sellers/Smith/Tarolli, the founders of 3Dfx). This revolutionary graphics card at the time could push out 47 to 50 megapixels and had 4 MB of VRAM and was released in the beginning of 1996.
My first 3D graphics card was the Orchid Righteous 3D. Voodoo Graphics was really the first successful consumer 3D graphics card. Yes, there were others before it, but Voodoo Graphics had the largest impact of them all.
In 1998 3Dfx released the Voodoo 2, and it was a significant jump in complexity from the original. These chips were fabricated on a 350 nm process. There were three chips to each card, one of which was the raster chip and the other two were texture chips. At the top end of the product stack was the 12 MB cards. The raster chip had 4 MB of VRAM available to it while each texture chip had 4 MB of VRAM for texture storage. Not only did this product double performance from the Voodoo Graphics, it was able to run in single card configurations at 800x600 (as compared to the max 640x480 of the Voodoo Graphics). This is the same time as when NVIDIA started to become a very aggressive competitor with the Riva TnT and ATI was about to ship the Rage 128.