Intel Devil's Canyon Offers Haswell with Improved TIM, 9-series Chipsets

Subject: Processors | March 19, 2014 - 05:00 PM |
Tagged: tim, Intel, hawell, gdc 14, GDC, 9-series

An update to the existing Haswell 4th Generation Core processors will be hitting retail sometime in mid-2014 according to what Intel has just told us. This new version of the existing processors will include new CPU packaging and the oft-requested improved thermal interface material (TIM).  Overclockers have frequently claimed that the changes Intel made to the TIM was limiting performance; it seems Intel has listened to the community and will be updating some parts accordingly.

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Recent leaks have indicated we'll see modest frequency increases in some of the K-series parts; in the 100 MHz range.  All Intel is saying today though is what you see on that slide. Overclocks should improve with the new thermal interface material but by how much isn't yet known.

These new processors, under the platform code name of Devil's Canyon, will target the upcoming 9-series chipsets.  When I asked about support for 8-series chipset users, Intel would only say that those motherboards "are not targeted" for the refreshed Haswell CPUs.  I would not be surprised though to see some motherboard manufacturers attempt to find ways to integrate board support through BIOS/UEFI changes.

Though only slight refreshes, when we combine the Haswell Devil's Canyon release with the news about the X99 + Haswell-E, it appears that 2014 is shaping up to be pretty interesting for the enthusiast community!

Sony is trying to get into your machine again ... in a good way

Subject: General Tech | July 17, 2012 - 01:31 PM |
Tagged: sony, tim, thermal paste, thermal sheet

Say goodbye to messy thermal paste and the time you spent cleaning up the goop that ended up somewhere it shouldn't thanks to Sony's new thermal sheet.  In fact it looks like this new thermal interface material is so easy to use you could do it blindfolded!  The demonstrated performance is equal to that of traditional thermal paste, with Sony claiming a much longer effective lifespan.  At 0.3mm thick it will also provide a thinner layer of TIM than even the most practised of us cannot match by hand.  Check out more at Slashdot and try to avoid the rootkit jokes.

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"Sony has demonstrated a thermal sheet that it claims matches thermal paste in terms of cooling ability while beating it on life span. The key to the sheet is a combination of silicon and carbon fibers, to produce a thermal conductive layer that's between 0.3 and 2mm thick. In the demonstration, the same CPU was cooled by thermal paste and the thermal sheet side-by-side, with the paste keeping the processor at a steady 53 degrees Celsius. The sheet achieved a slightly better 50 degrees Celsius. The actual CPU used in the demonstration wasn't identified. Sony wants to get the thermal sheet used in servers and for projection units, but I can definitely see this being an option for typical PC builds, too. It's certainly going to be less messy and probably a lot cheaper than buying a tube of thermal paste."

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Source: Slashdot