Subject: General Tech | April 30, 2016 - 12:33 AM | Scott Michaud
Tagged: SoC, nfme, gpu, cpu, amd
Nantong Fujitsu Microelectronics Co., Ltd. (NFME) is a Chinese company that packages and tests integrated circuits. Recently, AMD has been working with China to reach that large market, especially given their ongoing cash concerns. This time, AMD sold 85% of its stake in two locations, AMD Penang, Malaysia and AMD Suzhou, Jiangsu, China, to NFME and formed a joint venture with them, called TF-AMD Microelectronics Sdn Bhd.
I see two interesting aspects to this story.
First, AMD gets about $320 million USD in this transaction, after taxes and fees, and it also retains 15% of this venture. I am curious whether this will lead to a long-term source of income for AMD, even though the press release claims that this structure will be “cost neutral”. Either way, clearing a third of a billion dollars should help AMD to some extent. That equates to about two-to-three quarters of net-loss for the company, so it gives them about six-to-nine extra months of life on its own. That's not too bad if the transaction doesn't have any lasting consequences.
Second, NFME now has access to some interesting packaging and testing technologies. NFME's website claims that this allows them to handle dies up to 800mm2, substrates with up to 18 layers, and package sizes up to 75mm. These specifications sound like it pulls from their GPU experience, which could bring all of that effort and knowledge to completely different fields.
The press release states that 1,700 employees will be moved from AMD to this venture. They do not state whether any jobs are affected over and above this amount, though.
Subject: General Tech | March 30, 2016 - 06:16 PM | Tim Verry
Tagged: ubuntu, linux, mediatek, SoC, arm, tablet
Canonical, the company behind the Ubuntu Linux operating system, is now offering up its first Ubuntu tablet with Spanish manufacturing partner BQ. The Aquaris M10 Ubuntu Edition is a 10-inch tablet powered by ARM and loaded with Ubuntu 15.04.
The tablet features an all black (or white) case with rounded edges and a matte back. Mobilegeeks managed to get hands on with the Android version of the Aquaris M10 which you can check out here. The internals are a bit different on the Ubuntu Edition, but the chassis and design remains the same. It measures 8.2mm thick and weighs in at 470 grams (1.03 pounds). The front is dominated by a 10.1” AHVA touchscreen display that comes in either 1280 x 800 or Full HD 1920 x 1080 resolution depending on the model. A capacitive home button sits below along with two 0.7W speakers while a 5MP webcam is positioned above the display. There is an 8MP rear camera, and the sides hold Micro HDMI, Micro USB, Micro SD, and 3.5mm audio ports.
The Aquaris M10 Ubuntu Edition is powered by a quad core MediaTek SoC with Mali-T720MP2 graphics, 2GB of RAM, and 16GB of eMMC storage (with approximately 10GB usable by end users) that can be expanded via Micro SD cards up to 64GB. The Full HD model uses the MediaTek MT8163A clocked at 1.5 GHz while the HD Aquaris M10 uses the slightly lower clocked MT8163B running at 1.3 GHz.
Wireless capabilities include 802.11n (dual band) Wi-Fi, Bluetooth 4.0, and GPS. It is powered by a 7,280 mAh Li-Po battery. BQ has pre-loaded the tablet with Ubuntu 15.04 which users will likely want to update once drivers are ready as it is End-of-Life.
The Aquaris M10 is available for pre-order now, with expected ship dates in early April. The HD Ubuntu Edition tablet is listed at €259.90 ($295) while the Full HD version will run you €299.90 ($340). Currently, the Full HD tablet comes in black and the HD tablet is all white. Both models come with a screen protector and case as a pre-order bonus.
It is interesting to see an official Ubuntu tablet, but I wonder if this is too little, too late for the open source OS. Canonical is positioning this as a daily driver that can be a tablet when you want to be mobile, a PC when propped up with a case and paired with wireless keyboard and mouse, and a media streamer when connecting it to the big screen with HDMI. I would expect performance to improve over time once the community gets a hold of it and starts tweaking it though the hardware is going to be a limiting factor. I want a Linux tablet to succeed, and hopefully this will open the door for higher end models. I don’t see myself jumping on this particular one though at this price.
Are you excited for the Ubuntu Edition M10?
Subject: Processors | March 15, 2016 - 12:52 PM | Sebastian Peak
Tagged: TSMC, SoC, servers, process technology, low power, FinFET, datacenter, cpu, arm, 7nm, 7 nm FinFET
ARM and TSMC have announced their collaboration on 7 nm FinFET process technology for future SoCs. A multi-year agreement between the companies, products produces on this 7 nm FinFET process are intended to expand ARM’s reach “beyond mobile and into next-generation networks and data centers”.
TSMC Headquarters (Image credit: AndroidHeadlines)
So when can we expect to see 7nm SoCs on the market? The report from The Inquirer offers this quote from TSMC:
“A TSMC spokesperson told the INQUIRER in a statement: ‘Our 7nm technology development progress is on schedule. TSMC's 7nm technology development leverages our 10nm development very effectively. At the same time, 7nm offers a substantial density improvement, performance improvement and power reduction from 10nm’.”
Full press release after the break.
Subject: Graphics Cards, Processors | February 29, 2016 - 06:48 PM | Scott Michaud
Tagged: tesla motors, tesla, SoC, Peter Bannon, Jim Keller
When we found out that Jim Keller has joined Tesla, we were a bit confused. He is highly skilled in processor design, and he moved to a company that does not design processors. Kind of weird, right? There are two possibilities that leap to mind: either he wanted to try something new in life, and Elon Musk hired him for his general management skills, or Tesla wants to get more involved in the production of their SoCs, possibly even designing their own.
Now Peter Bannon, who was a colleague of Jim Keller at Apple, has been hired by Tesla Motors. Chances are, the both of them were not independently interested in an abrupt career change that led them to the same company. That seems highly unlikely, to say the least. So it appears that Tesla Motors wants experienced chip designers in house. What for? We don't know. This is a lot of talent to just look over the shoulders of NVIDIA and other SoC partners, to make sure they have an upper hand in negotiation. Jim Keller is at Tesla as their “Vice-President of Autopilot Hardware Engineering.” We don't know what Peter Bannon's title will be.
And then, if Tesla Motors does get into creating their own hardware, we wonder what they will do with it. The company has a history of open development and releasing patents (etc.) into the public. That said, SoC design is a highly encumbered field, depending on what they're specifically doing, which we have no idea about.
Subject: Processors, Mobile | February 22, 2016 - 11:11 AM | Sebastian Peak
Tagged: TSMC, SoC, octa-core, MWC 2016, MWC, mediatek, Mali-T880, LPDDR4X, Cortex-A53, big.little, arm
MediaTek might not be well-known in the United States, but the company has been working to expand from China, where it had a 40% market share as of June 2015, into the global market. While 2015 saw the introduction of the 8-core Helio P10 and the 10-core helio X20 SoCs, the company continues to expand their lineup, today announcing the Helio P20 SoC.
There are a number of differences between the recent SoCs from MediaTek, beginning with the CPU core configuration. This new Helio P20 is a “True Octa-Core” design, but rather than a big.LITTLE configuration it’s using 8 identically-clocked ARM Cortex-A53 cores at 2.3 GHz. The previous Helio P10 used a similar CPU configuration, though clocks were limited to 2.0 GHz with that SoC. Conversely, the 10-core Helio X20 uses a tri-cluster configuration, with 2x ARM Cortex-A72 cores running at 2.5 GHz, along with a typical big.LITTLE arrangement (4x Cortex-A53 cores at 2.0 Ghz and 4x Cortex-A53 cores at 1.4 GHz).
Another change affecting MediaTek’s new SoC and he industry at large is the move to smaller process nodes. The Helio P10 was built on 28 nm HPM, and this new P20 moves to 16 nm FinFET. Just as with the Helio P10 and Helio X20 (a 20 nm part) this SoC is produced at TSMC using their 16FF+ (FinFET Plus) technology. This should provide up to “40% higher speed and 60% power saving” compared to the company’s previous 20 nm process found in the Helio X20, though of course real-world results will have to wait until handsets are available to test.
The Helio P20 also takes advantage of LPDDR4X, and is “the world’s first SoC to support low power double data rate random access memory” according to MediaTek. The company says this new memory provides “70 percent more bandwidth than the LPDDR3 and 50 percent power savings by lowering supply voltage to 0.6v”. Graphics are powered by ARM’s high-end Mali T880 GPU, clocked at an impressive 900 MHz. And all-important modem connectivity includes CAT6 LTE with 2x carrier aggregation for speeds of up to 300 Mbps down, 50 Mbps up. The Helio P20 also supports up to 4k/30 video decode with H.264/265 support, and the 12-bit dual camera ISP supports up to 24 MP sensors.
Specs from MediaTek:
- Process: 16nm
- Apps CPU: 8x Cortex-A53, up to 2.3GHz
- Memory: Up to 2 x LPDDR4X 1600MHz (up to 6GB) + 1x LPDDR3 933Mhz (up to 4GB) + eMMC 5.1
- Camera: Up to 24MP at 24FPS w/ZSD, 12bit Dual ISP, 3A HW engine, Bayer & Mono sensor support
- Video Decode: Up to 4Kx2K 30fps H.264/265
- Video Encode: Up to 4Kx2K 30fps H.264
- Graphics: Mali T-880 MP2 900MHz
- Display: FHD 1920x1080 60fps. 2x DSI for dual display
- Modem: LTE FDD TDD R.11 Cat.6 with 2x20 CA. C2K SRLTE. L+W DSDS support
- Connectivity: WiFiac/abgn (with MT6630). GPS/Glonass/Beidou/BT/FM.
- Audio: 110db SNR & -95db THD
It’s interesting to see SoC makers experiment with less complex CPU designs after a generation of multi-cluster (big.LITTLE) SoCs, as even the current flagship Qualcomm SoC, the Snapdragon 820, has reverted to a straight quad-core design. The P20 is expected to be in shipping devices by the second half of 2016, and we will see how this configuration performs once some devices using this new P20 SoC are in the wild.
Full press release after the break:
Subject: General Tech | December 7, 2015 - 01:12 PM | Jeremy Hellstrom
Tagged: SoC, raspberry pi zero
It can't play Crysis but if you want to know if the new Raspberry Pi Zero has what it takes to power your latest projects then look no further than this article at Phoronix in which they benchmark the new low cost SoC. The $5 Zero is powered by a 1GHz single-core ARM processor with 512MB of RAM and a Broadcom BCM2708, outputs include mini HDMI and USB OTG ports, and a 40-pin header which you are going to be populating if you want networking. As you would expect the Zero does sit at the bottom of the benchmark tables, however at this price point you are shopping for "just good enough", not top of the pack performance. Check it out here.
"For those curious about the performance of the $5 Raspberry Pi Zero, here are some benchmarks I've just finished up for this low-end, low-power ARM development board compared to other ARM, MIPS, and x86 hardware."
Here is some more Tech News from around the web:
- Pi Zero Ethernet The Hard Way @ Hack a Day
- The best Christmas gift ideas for tech lovers @ The Inquirer
- IBM looks to entice women into tech by alienating and patronising them @ The Inquirer
- Microsoft encrypts explanation of borked Windows 10 encryption @ The Register
- GalliumOS: The Ideal Linux Distribution for Chromebook Hardware @ Linux.com
- Per-core licences coming to Windows Server and System Center 2016 @ The Register
- 4 Upcoming 3D Printers We Can’t Wait to Get Our Hands On @ MAKE:Blog
- Lock up your top-of-racks, says Cisco, there's a bug in the USB code @ The Register
- Spread The Christmas Spirit Mega Global Giveaway @ NikKTech
Subject: Processors, Mobile | December 1, 2015 - 07:30 AM | Scott Michaud
Tagged: TSMC, SoC, LG, Intel, arm
So this story came out of nowhere. Whether the rumors are true or false, I am stuck on how everyone seems to be talking about it with a casual deadpan. I spent a couple hours Googling whether I missed some big announcement that made Intel potentially fabricating ARM chips a mundane non-story. Pretty much all that I found was Intel allowing Altera to make FPGAs with embedded ARM processors in a supporting role, which is old news.
Image Credit: Internet Memes...
The rumor is that Intel and TSMC were both vying to produce LG's Nuclon 2 SoC. This part is said to house two quad-core ARM modules in a typical big.LITTLE formation. Samples were allegedly produced, with Intel's part (2.4 GHx) being able to clock around 300 MHz faster than TSMC's offering (2.1 GHz). Clock rate is highly dependent upon the “silicon lottery,” so this is an area that production maturity can help with. Intel's sample would also be manufactured at 14nm (versus 16nm from TSMC although these numbers mean less than they used to). LG was also, again allegedly, interesting in Intel's LTE modem. According to the rumors, LG went with TSMC because they felt Intel couldn't keep up with demand.
Now that the rumor has been reported... let's step back a bit.
I talked with Josh a couple of days ago about this post. He's quite skeptical (as I am) about the whole situation. First and foremost, it takes quite a bit of effort to port a design to a different manufacturing process. LG could do it, but it is questionable, especially for a second chip ever sort of thing. Moreover, I still believe that Intel doesn't want to manufacture chips that directly compete with them. x86 in phones is still not a viable business, but Intel hasn't given up and you would think that's a prerequisite.
So this whole thing doesn't seem right.
Subject: Processors, Mobile | November 12, 2015 - 09:30 AM | Sebastian Peak
Tagged: SoC, smartphone, Samsung Galaxy, Samsung, mobile, Exynos 8890, Exynos 8 Octa, Exynos 7420, Application Processor
Coming just a day after Qualcomm officially launched their Snapdragon 820 SoC, Samsung is today unveiling their latest flagship mobile part, the Exynos 8 Octa 8890.
The Exynos 8 Octa 8890 is built on Samsung’s 14 nm FinFET process like the previous Exynos 7 Octa 7420, and again is based on the a big.LITTLE configuration; though the big processing cores are a custom design this time around. The Exynos 7420 was comprised of four ARM Cortex A57 cores and four small Cortex A53 cores, and while the small cores in the 8890 are again ARM Cortex A53, the big cores feature Samsung’s “first custom designed CPU based on 64-bit ARMv8 architecture”.
“With Samsung’s own SCI (Samsung Coherent Interconnect) technology, which provides cache-coherency between big and small cores, the Exynos 8 Octa fully utilizes benefits of big.LITTLE structure for efficient usage of the eight cores. Additionally, Exynos 8 Octa is built on highly praised 14nm FinFET process. These all efforts for Exynos 8 Octa provide 30% more superb performance and 10% more power efficiency.”
Another big advancement for the Exynos 8 Octa is the integrated modem, which provides Category 12/13 LTE with download speeds (with carrier aggregation) of up to 600 Mbps, and uploads up to 150 Mbps. This might sound familiar, as it mirrors the LTE Release 12 specs of the new modem in the Snapdragon 820.
Video processing is handled by the Mali-T880 GPU, moving up from the Mali-T760 found in the Exynos 7 Octa. The T880 is “the highest performance and the most energy-efficient mobile GPU in the Mali family”, with up to 1.8x the performance of the T760 while being 40% more energy-efficient.
Samsung will be taking this new SoC into mass production later this year, and the chip is expected to be featured in the company’s upcoming flagship Galaxy phone.
Full PR after the break.
Subject: Processors | November 5, 2015 - 09:30 PM | Sebastian Peak
Tagged: SoC, report, processor, mobile apu, leak, FX-9830PP, cpu, Bristol Ridge, APU, amd
A new report points to an entry from the USB implementors forum, which shows an unreleased AMD Bristol Ridge SoC.
(AMD via VideoCardz.com)
Bristol Ridge itself is not news, as the report at Computer Base observes (translation):
"A leaked roadmap had previously noted that Bristol Ridge is in the coming year soldered on motherboards for notebooks and desktop computers in special BGA package FP4."
(USB.org via Computer Base)
But there is something different about this chip as the report point out the model name FX-9830P pictured in the USB.org screen grab is consistent with the naming scheme for notebook parts, with the highest current model being FX-8800P (Carrizo), a 35W 4-thread Excavator part with 512 stream processors from the R7 GPU core.
(BenchLife via Computer Base)
No details are available other than information from a leaked roadmap (above), which points to Bristol Ridge as an FP4 BGA part for mobile, with a desktop variant for socket FM3 that would replace Kaveri/Godavari (and possibly still an Excavator part). New cores are coming in 2016, and we'll have to wait and see for additional details (or until more information inevitably leaks out).
Update, 11/06/15: WCCFtech expounds on the leak:
“Bristol Ridge isn’t just limited to mobility platforms but will also be featured on AM4 desktop platform as Bristol Ridge will be the APU generation available on desktops in 2016 while Zen would be integrated on the performance focused FX processors.”
WCCFtech’s report also included a link to this SiSoftware database entry for an engineering sample of a dual-core Stoney Ridge processor, a low-power mobile part with a 2.7 GHz clock speed. Stoney Ridge will reportedly succeed Carrizo-L for low-power platforms.
The report also provided this chart to reference the new products:
Subject: Processors | October 23, 2015 - 02:21 PM | Sebastian Peak
Tagged: Xeon D, SoC, rumor, report, processor, Pentium D, Intel, cpu
Intel's Xeon D SoC lineup will soon expand to include 12-core and 16-core options, after the platform launched earlier this year with the option of 4 or 8 cores for the 14 nm chips.
The report yesterday from CPU World offers new details on the refreshed lineup which includes both Xeon D and Pentium D SoCs:
"According to our sources, Intel have made some changes to the lineup, which is now comprised of 13 Xeon D and Pentium D SKUs. Even more interesting is that Intel managed to double the maximum number of cores, and consequentially combined cache size, of Xeon D design, and the nearing Xeon D launch may include a few 12-core and 16-core models with 18 MB and 24 MB cache."
The move is not unexpected as Intel initially hinted at an expanded offering by the end of the year (emphasis added):
"...the Intel Xeon processor D-1500 product family is the first offering of a line of processors that will address a broad range of low-power, high-density infrastructure needs. Currently available with 4 or 8 cores and 128 GB of addressable memory..."
Current Xeon D Processors
The new flagship Xeon D model will be the D-1577, a 16-core processor with between 18 and 24 MB of L3 cache (exact specifications are not yet known). These SoCs feature integrated platform controller hub (PCH), I/O, and dual 10 Gigabit Ethernet, and the initial offerings had up to a 45W TDP. It would seem likely that a model with double the core count would either necessitate a higher TDP or simply target a lower clock speed. We should know more before too long.
For futher information on Xeon D, please check out our previous coverage:
- New Intel Xeon D Broadwell Processors Aimed at Low Power, High Density Servers @ PC Perspective.
- Xeon D Podcast Discussion at 0:40:35 (YouTube or downloadable audio).