Subject: Processors, Mobile | November 12, 2015 - 09:30 AM | Sebastian Peak
Tagged: SoC, smartphone, Samsung Galaxy, Samsung, mobile, Exynos 8890, Exynos 8 Octa, Exynos 7420, Application Processor
Coming just a day after Qualcomm officially launched their Snapdragon 820 SoC, Samsung is today unveiling their latest flagship mobile part, the Exynos 8 Octa 8890.
The Exynos 8 Octa 8890 is built on Samsung’s 14 nm FinFET process like the previous Exynos 7 Octa 7420, and again is based on the a big.LITTLE configuration; though the big processing cores are a custom design this time around. The Exynos 7420 was comprised of four ARM Cortex A57 cores and four small Cortex A53 cores, and while the small cores in the 8890 are again ARM Cortex A53, the big cores feature Samsung’s “first custom designed CPU based on 64-bit ARMv8 architecture”.
“With Samsung’s own SCI (Samsung Coherent Interconnect) technology, which provides cache-coherency between big and small cores, the Exynos 8 Octa fully utilizes benefits of big.LITTLE structure for efficient usage of the eight cores. Additionally, Exynos 8 Octa is built on highly praised 14nm FinFET process. These all efforts for Exynos 8 Octa provide 30% more superb performance and 10% more power efficiency.”
Another big advancement for the Exynos 8 Octa is the integrated modem, which provides Category 12/13 LTE with download speeds (with carrier aggregation) of up to 600 Mbps, and uploads up to 150 Mbps. This might sound familiar, as it mirrors the LTE Release 12 specs of the new modem in the Snapdragon 820.
Video processing is handled by the Mali-T880 GPU, moving up from the Mali-T760 found in the Exynos 7 Octa. The T880 is “the highest performance and the most energy-efficient mobile GPU in the Mali family”, with up to 1.8x the performance of the T760 while being 40% more energy-efficient.
Samsung will be taking this new SoC into mass production later this year, and the chip is expected to be featured in the company’s upcoming flagship Galaxy phone.
Full PR after the break.
Subject: Processors | November 5, 2015 - 09:30 PM | Sebastian Peak
Tagged: SoC, report, processor, mobile apu, leak, FX-9830PP, cpu, Bristol Ridge, APU, amd
A new report points to an entry from the USB implementors forum, which shows an unreleased AMD Bristol Ridge SoC.
(AMD via VideoCardz.com)
Bristol Ridge itself is not news, as the report at Computer Base observes (translation):
"A leaked roadmap had previously noted that Bristol Ridge is in the coming year soldered on motherboards for notebooks and desktop computers in special BGA package FP4."
(USB.org via Computer Base)
But there is something different about this chip as the report point out the model name FX-9830P pictured in the USB.org screen grab is consistent with the naming scheme for notebook parts, with the highest current model being FX-8800P (Carrizo), a 35W 4-thread Excavator part with 512 stream processors from the R7 GPU core.
(BenchLife via Computer Base)
No details are available other than information from a leaked roadmap (above), which points to Bristol Ridge as an FP4 BGA part for mobile, with a desktop variant for socket FM3 that would replace Kaveri/Godavari (and possibly still an Excavator part). New cores are coming in 2016, and we'll have to wait and see for additional details (or until more information inevitably leaks out).
Update, 11/06/15: WCCFtech expounds on the leak:
“Bristol Ridge isn’t just limited to mobility platforms but will also be featured on AM4 desktop platform as Bristol Ridge will be the APU generation available on desktops in 2016 while Zen would be integrated on the performance focused FX processors.”
WCCFtech’s report also included a link to this SiSoftware database entry for an engineering sample of a dual-core Stoney Ridge processor, a low-power mobile part with a 2.7 GHz clock speed. Stoney Ridge will reportedly succeed Carrizo-L for low-power platforms.
The report also provided this chart to reference the new products:
Subject: Processors | October 23, 2015 - 02:21 PM | Sebastian Peak
Tagged: Xeon D, SoC, rumor, report, processor, Pentium D, Intel, cpu
Intel's Xeon D SoC lineup will soon expand to include 12-core and 16-core options, after the platform launched earlier this year with the option of 4 or 8 cores for the 14 nm chips.
The report yesterday from CPU World offers new details on the refreshed lineup which includes both Xeon D and Pentium D SoCs:
"According to our sources, Intel have made some changes to the lineup, which is now comprised of 13 Xeon D and Pentium D SKUs. Even more interesting is that Intel managed to double the maximum number of cores, and consequentially combined cache size, of Xeon D design, and the nearing Xeon D launch may include a few 12-core and 16-core models with 18 MB and 24 MB cache."
The move is not unexpected as Intel initially hinted at an expanded offering by the end of the year (emphasis added):
"...the Intel Xeon processor D-1500 product family is the first offering of a line of processors that will address a broad range of low-power, high-density infrastructure needs. Currently available with 4 or 8 cores and 128 GB of addressable memory..."
Current Xeon D Processors
The new flagship Xeon D model will be the D-1577, a 16-core processor with between 18 and 24 MB of L3 cache (exact specifications are not yet known). These SoCs feature integrated platform controller hub (PCH), I/O, and dual 10 Gigabit Ethernet, and the initial offerings had up to a 45W TDP. It would seem likely that a model with double the core count would either necessitate a higher TDP or simply target a lower clock speed. We should know more before too long.
For futher information on Xeon D, please check out our previous coverage:
- New Intel Xeon D Broadwell Processors Aimed at Low Power, High Density Servers @ PC Perspective.
- Xeon D Podcast Discussion at 0:40:35 (YouTube or downloadable audio).
Subject: Processors | October 19, 2015 - 11:28 AM | Sebastian Peak
Tagged: Zen, SoC, processor, imac, APU, apple, amd
Rumor: Apple to Use AMD SoC for Next-Gen iMac News about AMD has been largely depressing of late, with the introduction of the R9 Fury/Fury X and Nano graphics cards a bright spot in the otherwise tumultuous year that was recently capped by a $65 million APU write down. But one area where AMD has managed to earn a big win has been the console market, where their APUs power the latest machines from Microsoft and Sony. The combination of CPU and a powerful GPU on a single chip is ideal for those small form-factor designs, and likewise it would be ideal for a slim all-in-one PC. But an iMac?
Image credit: Apple
A report from WCCFtech today points to the upcoming Zen architecture from AMD as a likely power source for a potential custom SoC:
"A Semi-custom SOC x86 for the iMac would have to include a high performance x86 component, namely Zen, in addition to a graphics engine to drive the visual experience of the device. Such a design would be very similar to the current semi-custom Playstation 4 and XBOX ONE Accelerated Processing Units, combining x86 CPU cores with a highly capable integrated graphics solution."
Those who don't follow Apple probably don't know the company switched over almost exclusively to AMD graphics a short time ago, with NVIDIA solutions phased out of all discrete GPU models. Whether politically motivated or simply the result of AMD providing what Apple wanted from a hardware/driver standpoint I can't say, but it's still a big win for AMD considering Apple's position as one of the largest computer manufacturers - even though its market share is very low in the highly fragmented PC market overall. And while Apple has exclusively used Intel processors in its systems since transitioning away from IBM's PowerPC beginning in 2006, the idea of an AMD custom APU makes a lot of sense for the company, especially for their size and heat constrained iMac designs.
Image credit: WCCFtech
Whether or not you'd ever consider buying an iMac - or any other computer from Apple, for that matter - it's still important for the PC industry as a whole that AMD continues to find success and provide competition for Intel. Consumers can only benefit from the potential for improved performance and reduced cost if competition heats up between Intel and AMD, something we really haven't seen on the CPU front in a few years now. With CEO Lisa Su stating that AMD "had secured two new semi-custom design wins" In their recent earnings call it could very well be that we will see Zen in future iMacs, or in other PC all-in-one solutions for that matter.
Regardless, it will be exciting to see some good competition from AMD, even if we will have to wait quite a while for it. Zen isn't ready yet and we have no indication that any such product would be introduced until later next year. It will be interesting to see what Intel might do to compete given their resources. 2016 could be interesting.
Subject: Mobile | September 30, 2015 - 02:33 PM | Sebastian Peak
Tagged: X12 Modem, SoC, snapdragon 820, qualcomm, phones, mu-mimo, mobile, LTE, cell phones
The upcoming Snapdragon 820 is shaping up to be a formidable SoC after the disappointing response to the previous flagship, the Snapdragon 810, which was in far fewer devices than expected for reasons still shrouded in mystery and speculation. One of the biggest aspects of the upcoming 820 is Qualcomm’s new X12 modem, which will provide the most advanced LTE connectivity seen to date when the SoC launches. The X12 features CAT 12 LTE downlink speeds for up to 600 Mbps, and CAT 13 on the uplink for up to 150 Mbps.
LTE connectivity isn’t the only new thing here, as we see from this slide there is also tri-band Wi-Fi supporting 2x2 MU-MIMO.
“This is the first publicly announced processor for use in mobile devices to support LTE Category 12 in the downlink and Category 13 in the uplink, providing up to 33 percent and 200 percent improvement over its predecessor’s download and upload speeds, respectively.”
The specifications for this new modem are densely packed:
- Cat 12 (up to 600 Mbps) in the downlink
- Cat 13 (up to 150 Mbps) in the uplink
- Up to 4x4 MIMO on one downlink LTE carrier
- 2x2 MU-MIMO (802.11ac)
- Multi-gigabit 802.11ad
- LTE-U and LTE+Wi-Fi Link Aggregation (LWA)
- Next Gen HD Voice and Video calling over LTE and Wi-Fi
- Call Continuity across Wi-Fi, LTE, 3G, and 2G
- RF front end innovations
- Advanced Closed Loop Antenna Tuner
- Qualcomm RF360™ front end solution with CA
- Wi-Fi/LTE antenna sharing
Rumored phones that could end up running the Snapdragon 820 with this X12 modem include the Samsung Galaxy S7 and around 30 other devices, though final word is of course pending on shipping hardware.
Business Model Based on Partnerships
|Alexandru Voica works for Imagination Technologies. His background includes research in computer graphics at the School of Advanced Studies Sant'Anna in Pisa and a brief stint as a CPU engineer, working on several high-profile 32-bit processors used in many mobile and embedded devices today. You can follow Alex on Twitter @alexvoica.|
Some months ago my colleague Rys Sommefeldt wrote an article offering his (deeply) technical perspective on how a chip gets made, from R&D to manufacturing. While his bildungsroman production covers a lot of the engineering details behind silicon production, it is light on the business side of things; and that is a good thing because it gives me opportunity to steal some of his spotlight!
This article will give you a breakdown of the IP licensing model, describing the major players and the relationships between them. It is not designed to be a complete guide by any means and some parts might already sound familiar, but I hope it is a comprehensive overview that can be used by anyone who is new to product manufacturing in general.
The diagram below offers an analysis of the main categories of companies involved in the semiconductor food chain. Although I’m going to attempt to paint a broad picture, I will mainly offer examples based on the ecosystem formed around Imagination (since that is what I know best).
A simplified view of the manufacturing chain
Let’s work our way from left to right.
Traditionally, these are the companies that design and sell silicon IP. ARM and Imagination Technologies are perhaps the most renowned for their sub-brands: Cortex CPU + Mali GPU and MIPS CPU + PowerVR GPU, respectively.
Given the rapid evolution of the semiconductor market, such companies continue to evolve their business models beyond point solutions to become one-stop shops that offer more than for a wide variety of IP cores and platforms, comprising CPUs, graphics, video, connectivity, cloud software and more.
Qualcomm’s GPU History
Despite its market dominance, Qualcomm may be one of the least known contenders in the battle for the mobile space. While players like Apple, Samsung, and even NVIDIA are often cited as the most exciting and most revolutionary, none come close to the sheer sales, breadth of technology, and market share that Qualcomm occupies. Brands like Krait and Snapdragon have helped push the company into the top 3 semiconductor companies in the world, following only Intel and Samsung.
Founded in July 1985, seven industry veterans came together in the den of Dr. Irwin Jacobs’ San Diego home to discuss an idea. They wanted to build “Quality Communications” (thus the name Qualcomm) and outlined a plan that evolved into one of the telecommunications industry’s great start-up success stories.
Though Qualcomm sold its own handset business to Kyocera in 1999, many of today’s most popular mobile devices are powered by Qualcomm’s Snapdragon mobile chipsets with integrated CPU, GPU, DSP, multimedia CODECs, power management, baseband logic and more. In fact the typical “chipset” from Qualcomm encompasses up to 20 different chips of different functions besides just the main application processor. If you are an owner of a Galaxy Note 4, Motorola Droid Turbo, Nexus 6, or Samsung Galaxy S5, then you are most likely a user of one of Qualcomm’s Snapdragon chipsets.
Qualcomm’s GPU History
Before 2006, the mobile GPU as we know it today was largely unnecessary. Feature phones and “dumb” phones were still the large majority of the market with smartphones and mobile tablets still in the early stages of development. At this point all the visual data being presented on the screen, whether on a small monochrome screen or with the color of a PDA, was being drawn through a software renderer running on traditional CPU cores.
But by 2007, the first fixed-function, OpenGL ES 1.0 class of GPUs started shipping in mobile devices. These dedicated graphics processors were originally focused on drawing and updating the user interface on smartphones and personal data devices. Eventually these graphics units were used for what would be considered the most basic gaming tasks.
Subject: Systems | April 20, 2015 - 06:00 PM | Jeremy Hellstrom
Tagged: windows, SoC, mini-pc, Intel, ECS, Bay Trail-M
When Sebastian reviewed the LIVA X he focused on the performance of the device as an HTPC running Ubuntu ... before attempting to determine its effectiveness in creating a peanut butter and banana omelette, but that is a different story.
Overclocker's Club took a different tack, examining how it would perform for light gaming duties. On default settings the LIVA X managed 517 in Sky Diver, 1198 in Cloud Gate, 14200 in Ice Storm, and 9598 in Ice Storm Extreme. This would make it effective at playing mobile games or even playing through legacy games available through GoG or the Internet Archive; they tested CivV as a more modern title and while playable it wasn't great. Check out the full review for the other benchmark results.
"The ECS LIVA X surprised me with its small size and completely silent operation. I was able to surf the internet and do work on it very quickly. I enjoyed using it and experienced no problems with browsing the internet, using Office applications, or watching streaming videos on Netflix. Amazon Prime would occasionally lag a little – usually when the HUD would pop up."
Here are some more Systems articles from around the web:
- Get Your Old Rig Gaming Ready on a Tight Budget @ eTeknix
- Intel NUC 5I3RYH (DinoPC) @ Kitguru
- OcUK Ultima Finesse Blackhole Gaming PC @ Kitguru
Subject: General Tech | March 21, 2015 - 12:09 AM | Sebastian Peak
Tagged: TSMC, SoC, Semiconductor, Samsung, process node, nvidia, gpu, fab
Want to liven up your weekend? Forget college basketball, we all know that few things are more exciting than SEC filings - and oh boy do we have a great read for you! (OK, this one is actually interesting!)
Ah, legal documents...
NVIDIA has disclosed in their latest 10-K filing that none other than Samsung is manufacturing some of the company’s chips. TSMC has been the source of GPUs for both AMD and NVIDIA for some time, but this filing (the full document is available from the SEC website) has a very interesting mention of the suppliers of their silicon under the “Manufacturing” section:
"We utilize industry-leading suppliers, such as Taiwan Semiconductor Manufacturing Company Limited and Samsung Electronics Co. Ltd, to produce our semiconductor wafers."
Back in December NVIDIA commented on its lawsuit against Samsung for alleged IP theft, which only makes this partnership seem more unlikely. However even Apple (which has their own famous legal history with Samsung, of course) has relied on Samsung for some of the production of their A-series SoCs, including the current crop of A8 chips. Business is business, and Samsung Foundry has been a reliable source of silicon for multiple manufacturers - particularly during times when TSMC has struggled to meet demand at smaller process nodes.
Samsung's Current Semiconductor Offering
It is unclear at this point whether the wafers produced by Samsung Semiconductor are for NVIDIA’s mobile parts exclusively, or if any of the desktop GPUs were produced there rather than at TSMC. The partnership could also be attributed simply to scale, just as Apple has augmented A8 SoC supply with their rival’s fab while primarily relying on TSMC. It will be interesting to see just how pervasive the chips produced by Samsung are within the NVIDIA lineup, and what future products might be manufactured with their newest 14nm FinFET process technology.
Subject: Mobile | March 1, 2015 - 02:01 PM | Sebastian Peak
Tagged: SoC, smartphones, Samsung, MWC 2015, MWC, Galaxy S6 Edge, galaxy s6, Exynos 7420, 14nm
Samsung has announced the new Galaxy S phones at MWC, and the new S6 and S6 Edge should be in line with what you were expecting if you’ve followed recent rumors.
The new Samsung Galaxy S6 and S6 Edge (Image credit: Android Central)
As expected we no longer see a Qualcomm SoC powering the new phones, and as the rumors had indicated Samsung opted instead for their own Exynos 7 Octa mobile AP. The Exynos SoC’s have previously been in international versions of Samsung’s mobile devices, but they have apparently ramped up production to meet the demands of the US market as well. There is an interesting twist here, however.
The Exynos 7420 powering both the Galaxy S6 and S6 Edge is an 8-core SoC with ARM’s big.LITTLE design, combining four ARM Cortex-A57 cores and four Cortex-A53 cores. Having announced 14nm FinFET mobile AP production earlier in February the possibility of the S6 launching with this new part was interesting, as the current process tech is 20nm HKMG for the Exynos 7. However a switch to this new process so soon before the official announcement seemed unlikely as large-scale 14nm FinFET production was just unveiled on February 16. Regardless, AnandTech is reporting that the new part will indeed be produced using this new 14nm process technology, and this gives Samsung an industry-first for a mobile SoC with the launch of the S6/S6 Edge.
GSM Arena has specs of the Galaxy S6 posted, and here’s a brief overview:
- Display: 5.1” Super AMOLED, QHD resolution (1440 x 2560, ~577 ppi), Gorilla Glass 4
- OS: Android OS, v5.0 (Lollipop) - TouchWiz UI
- Chipset: Exynos 7420
- CPU: Quad-core 1.5 GHz Cortex-A53 & Quad-core 2.1 GHz Cortex-A57
- GPU: Mali-T760
- Storage/RAM: 32/64/128 GB, 3 GB RAM
- Camera: (Primary) 16 MP, 3456 x 4608, optical image stabilization, autofocus, LED flash
- Battery: 2550 mAh (non-removable)
The new phones both feature attractive styling with metal and glass construction and Gorilla Glass 4 sandwiching the frame, giving each phone a glass back.
The back of the new Galaxy S6 (Image credit: Android Central)
The guys at Android Central (source) had some pre-release time with the phones and have a full preview and hands-on video up on their site. The new phones will be released worldwide on April 10, and no specifics on pricing have been announced.