Podcast #369 - Fable Legends DX12 Benchmark, Apple A9 SoC, Intel P3608 SSD, and more!

Subject: General Tech | October 1, 2015 - 02:17 PM |
Tagged: podcast, video, fable legends, dx12, apple, A9, TSMC, Samsung, 14nm, 16nm, Intel, P3608, NVMe, logitech, g410, TKL, nvidia, geforce now, qualcomm, snapdragon 820

PC Perspective Podcast #369 - 10/01/2015

Join us this week as we discuss the Fable Legends DX12 Benchmark, Apple A9 SoC, Intel P3608 SSD, and more!

You can subscribe to us through iTunes and you can still access it directly through the RSS page HERE.

The URL for the podcast is: http://pcper.com/podcast - Share with your friends!

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Hosts: Ryan Shrout, Josh Walrath, Jeremy Hellstrom, and Allyn Malventano

Program length: 1:42:35

  1. Week in Review:
  2. 0:54:10 This episode of PC Perspective is brought to you by…Zumper, the quick and easy way to find your next apartment or home rental. To get started and to find your new home go to http://zumper.com/PCP
  3. News item of interest:
  4. Hardware/Software Picks of the Week:
  5. Closing/outro

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Apple Dual Sources A9 SOCs with TSMC and Samsung: Some Extra Thoughts

Subject: Processors | September 30, 2015 - 09:55 PM |
Tagged: TSMC, Samsung, FinFET, apple, A9, 16 nm, 14 nm

So the other day the nice folks over at Chipworks got word that Apple was in fact sourcing their A9 SOC at both TSMC and Samsung.  This is really interesting news on multiple fronts.  From the information gleaned the two parts are the APL0898 (Samsung fabbed) and the APL1022 (TSMC).

These process technologies have been in the news quite a bit.  As we well know, it has been a hard time for any foundry to go under 28 nm in an effective way if your name is not Intel.  Even Intel has had some pretty hefty issues with their march to sub 32 nm parts, but they have the resources and financial ability to push through a lot of these hurdles.  One of the bigger problems that affected the foundries was the idea that they could push back FinFETs beyond what they were initially planning.  The idea was to hit 22/20 nm and use planar transistors and push development back to 16/14 nm for FinFET technology.

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The Chipworks graphic that explains the differences between Samsung's and TSMC's A9 products.

There were many reasons why this did not work in an effective way for the majority of products that the foundries were looking to service with a 22/20 nm planar process.  Yes, there were many parts that were fabricated using these nodes, but none of them were higher power/higher performance parts that typically garner headlines.  No CPUs, no GPUs, and only a handful of lower power SOCs (most notably Apple's A8, which was around 89 mm squared and consumed up to 5 to 10 watts at maximum).  The node just did not scale power very effectively.  It provided a smaller die size, but it did not increase power efficiency and switching performance significantly as compared to 28 nm high performance nodes.

The information Chipworks has provided also verifies that Samsung's 14 nm FF process is more size optimized than TSMC's 16 nm FF.  There was originally some talk about both nodes being very similar in overall transistor size and density, but Samsung has a slightly tighter design.  Neither of them are smaller than Intel's latest 14 nm which is going into its second generation form.  Intel still has a significant performance and size advantage over everyone else in the field.  Going back to size we see the Samsung chip is around 96 mm square while the TSMC chip is 104.5 mm square.  This is not huge, but it does show that the Samsung process is a little tighter and can squeeze more transistors per square mm than TSMC.

In terms of actual power consumption and clock scaling we have nothing to go on here.  The chips are both represented in the 6S and 6S+.  Testing so far has not shown there to be significant differences between the two SOCs so far.  In theory one could be performing better than the other, but in reality we have not tested these chips at a low enough level to discern any major performance or power issue.  My gut feeling here is that Samsung's process is more mature and running slightly better than TSMC's, but the differences are going to be minimal at best.

The next piece of info that we can glean from this is that there just isn't enough line space for all of the chip companies who want to fabricate their parts with either Samsung or TSMC.  From a chip standpoint a lot of work has to be done to port a design to two different process nodes.  While 14 and 16 are similar in overall size and the usage of FinFETS, the standard cells and design libraries for both Samsung and TSMC are going to be very different.  It is not a simple thing to port over a design.  A lot of work has to be done in the design stage to make a chip work with both nodes.  I can tell you that there is no way that both chips are identical in layout.  It is not going to be a "dumb port" where they just adjust the optics with the same masks and magically make these chips work right off the bat.  Different mask sets for each fab, verification of both designs, and troubleshooting the yields by metal layer changes will be different for each manufacturer.

In the end this means that there just simply was not enough space at either TSMC or Samsung to handle the demand that Apple was expecting.  Because Apple has deep pockets they contracted out both TSMC and Samsung to produce two very similar, but still different parts.  Apple also likely outbid and locked down what availability to process wafers that Samsung and TSMC have, much to the dismay of other major chip firms.  I have no idea what is going on in the background with people like NVIDIA and AMD when it comes to line space for manufacturing their next generation parts.  At least for AMD it seems that their partnership with GLOBALFOUNDRIES and their version of 14 nm FF is having a hard time taking off.  Eventually more space will be made in production and yields and bins will improve.  Apple will stop taking up so much space and we can get other products rolling off the line.  In the meantime, enjoy that cutting edge iPhone 6S/+ with the latest 14/16 nm FF chips.

Source: Chipworks

Samsung Announces New Gear VR at Oculus Connect

Subject: Mobile | September 26, 2015 - 10:00 PM |
Tagged: Samsung, oculus vr, Oculus, gear vr

Oculus Connect was last week, including a lengthy keynote on Thursday that featured Tim Sweeney, John Carmack, Michael Abrash, and others (even Mark Zuckerberg made an appearance). Within the first dozen minutes, they brought Peter Koo, Senior Vice President of Samsung Mobile, to the stage, who announced the new Samsung Gear VR. Its main advantage is that is supports more of their flagship phones than their previous model did, and, more interesting, for half the price of the previous version.

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The Gear VR is the first consumer version as they consider the previous one to be a developer kit -- err -- "Innovator Edition". It will support the Samsung Galaxy S6, S6 edge, S6 edge+, and the Galaxy Note 5. The device is lighter and “much more comfortable to wear” than its predecessor. It will cost $99, plus the cost of one of the aforementioned phones unless you were getting one for a different reason, and it will be available in November.

Source: Samsung

Podcast #368 - full GTX 980s in notebooks, Samsung's NVMe 950 Pro, Jim Keller leaving AMD and more!

Subject: General Tech | September 24, 2015 - 03:22 PM |
Tagged: podcast, video, amd, Jim Keller, Zen, Samsung, 950 PRO, NVMe, M.2, vnand, Thrustmaster, tx f458, Lenovo, Thinkpad, x1 carbon, x250, t450s, helix

PC Perspective Podcast #368 - 09/24/2015

Join us this week as we discuss full GTX 980s in notebooks, Samsung's NVMe 950 Pro, Jim Keller leaving AMD and more!

You can subscribe to us through iTunes and you can still access it directly through the RSS page HERE.

The URL for the podcast is: http://pcper.com/podcast - Share with your friends!

  • iTunes - Subscribe to the podcast directly through the iTunes Store
  • RSS - Subscribe through your regular RSS reader
  • MP3 - Direct download link to the MP3 file

Hosts: Ryan Shrout, Josh Walrath, Jeremy Hellstrom, and Morry Teitelman

Subscribe to the PC Perspective YouTube Channel for more videos, reviews and podcasts!!

 

Samsung Launches 950 PRO - 300,000 IOPS and 2.5 GB/sec from a M.2 V-NAND SSD!

Subject: Storage | September 22, 2015 - 02:39 AM |
Tagged: vnand, V-NAND, ssd, Samsung, pcie, NVMe, M.2 2280, M.2, 950 PRO, 512GB, 256GB

I’ve been waiting a long time for Samsung to put their V-NAND flash memory into a PCIe connected SSD, and such a product has just been officially announced at the Samsung SSD Global Summit.

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Samsung’s new product launching will be called the 950 PRO. This will be an M.2 2280 form factor product running at PCIe 3.0 x4. Equipped with Samsung’s 32-layer V-NAND and using the NVMe protocol enabled by a new UBX controller, the 950 PRO will be capable of up to an impressive 300,000 random read IOPS. Random writes come in at 110,000 IOPS and sequential throughputs are expected to be 2.5 GB/sec reads and 1.5 GB/sec for writes. Available capacities will be 256GB and 512GB.

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Pricing:

The 950 PRO will be shipping with a 5-year warranty rated at 200 terabytes written for the 256GB model and 400 TBW for the 512GB. That works out to just over 100GB per day for both capacities.

These hit retail in October and we currently have samples in hand for testing.

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(for those curious, both capacities only have components on the front side of the PCB)

Full press blast after the break.

Source: Samsung

Good Morning (Night) From Seoul! New Samsung SSDs Are Coming!

Subject: Storage | September 21, 2015 - 11:32 AM |
Tagged: vnand, Summit, ssd, Seoul, Samsung, M.2, Korea, Global, 2015

As I hinted during last week's podcast, I am in Seoul, Korea to cover an upcoming press conference.

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To those keen readers who have followed my previous trips here, it can only mean one thing -

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..and with a Samsung SSD Global Summit comes product announcements. Those don't happen until tomorrow (late tonight for you folks back in the states), but I did notice a clue on the cover of our itinerary folder:

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See it? Here, let me help:

DSC05946.jpg

DSC05952.jpg

A VNAND powered M.2 (presumably NVMe) SSD is *exactly* the thing I have been waiting for Samsung to unleash into the wild ever since we reviewed their NVMe SM951. Given that Samsung's prior M.2 offerings gave the Intel SSD 750 a run for its money all while consuming half the power, and did so with Samsung's older 2D Planar NAND, you can bet a VNAND version will be something to behold. Let's hope this new model is released as a consumer product and doesn't end up as OEM-channel unobtanium like the NVMe SM951 was!

Keep an eye out for additional posts from our coverage of the 2015 Samsung SSD Global Summit!

Report: TSMC To Produce NVIDIA Pascal On 16 nm FinFET

Subject: Graphics Cards | September 16, 2015 - 09:16 AM |
Tagged: TSMC, Samsung, pascal, nvidia, hbm, graphics card, gpu

According to a report by BusinessKorea TSMC has been selected to produce the upcoming Pascal GPU after initially competing with Samsung for the contract.

PascalBoard.jpg

Though some had considered the possibility of both Samsung and TSMC sharing production (albeit on two different process nodes, as Samsung is on 14 nm FinFET), in the end the duties fall on TSMC's 16 nm FinFET alone if this report is accurate. The move is not too surprising considering the longstanding position TSMC has maintained as a fab for GPU makers and Samsung's lack of experience in this area.

The report didn't make the release date for Pascal any more clear, naming it "next year" for the new HBM-powered GPU, which will also reportedly feature 16 GB of HBM 2 memory for the flagship version of the card. This would potentially be the first GPU released at 16 nm (unless AMD has something in the works before Pascal's release), as all current AMD and NVIDIA GPUs are manufactured at 28 nm.

Meet the Galaxy S6 Edge+

Subject: General Tech | August 13, 2015 - 01:37 PM |
Tagged: Samsung, Galaxy S6 Edge+

We all knew it was coming and now we have the official information on the Galaxy S6 Edge+ from Samsung.  It is as Edge-y as the non-plus model and sports the same 5.7in 1440x2560 QHD Super AMOLED dual screen.  As you would expect there is a 64-bit octa-core Exynos 7420 inside, using the same 14nm process but the RAM has been upped to 4GB from the previous 3GB.  The metal and glass housing is similar to the Edge but discerning eyes should still be able to tell you forked over money to upgrade to the newest model.  The Inquirer has some of the press release here but don't watch the full release video as it is only slightly less terrible than last years horror show from Blackberry.

galaxy-s6-edge-plus-and-galaxy-note-5-540x334.png

"SAMSUNG HAS SURPRISED NOBODY with the unveiling of the Galaxy S6 Edge+, the firm's latest smartphone for big-handed folk."

Here is some more Tech News from around the web:

Tech Talk

Source: The Inquirer

Podcast #362 - Benchmarking a Voodoo 3, Flash Media Summit 2015, Skylake Delidding and more!

Subject: General Tech | August 13, 2015 - 01:14 PM |
Tagged: podcast, video, amd, nvidia, GTX 970, Zotac GTX 970 AMP! Extreme Core Edition, dx12, 3dfx, voodoo 3, Intel, SSD 750, NVMe, Samsung, R9 Fury, Fiji, gtx 950

PC Perspective Podcast #362 - 08/13/2015

Join us this week as we discuss Benchmarking a Voodoo 3, Flash Media Summit 2015, Skylake Delidding and more!

You can subscribe to us through iTunes and you can still access it directly through the RSS page HERE.

The URL for the podcast is: http://pcper.com/podcast - Share with your friends!

  • iTunes - Subscribe to the podcast directly through the iTunes Store
  • RSS - Subscribe through your regular RSS reader
  • MP3 - Direct download link to the MP3 file

Hosts: Ryan Shrout, Jeremy Hellstrom, Josh Walrath, and Sebastian Peak

Subscribe to the PC Perspective YouTube Channel for more videos, reviews and podcasts!!

FMS 2015: Samsung's New 256Gbit VNAND Enables 16TB PM1633a Datacenter SSD

Subject: Storage | August 11, 2015 - 04:59 PM |
Tagged: Samsung, vnand, 48-layer, tlc, 16TB, FMS 2015

I get these emails and comments all the time - "I want a larger capacity SSD". Ok, here ya go:

DSC04114_DxO.jpg

Samsung's earlier 48-layer VNAND announcement was exciting, but we already knew about it going into the keynote. What we did not know was that Samsung was going to blew the doors off of their keynote when they dropped this little gem. It's not just the largest capacity SSD, as this thing is more dense than any HDD's available today as well. That's 16TB of 48-layer TLC VNAND packed into a 2.5" form factor SAS-connected SSD.

...now what do you do once you have such a high density device? Well, you figure out how many you can cram into a 2U chassis of course!

DSC04155_DxO.jpg

Yup, that's 48 of those new SSDs, making for a capacity of 768TB in a 2U chassis. Samsung described this as a "JBOF" (Just a Bunch Of Flash), so processing the 2 million IOPS this array is capable of will have to be left to the connected system.

No word on pricing, but I'd think we are in 'mortgage the house' territory if you want to put this into your home PC.

There is more to follow from Flash Memory Summit, but for now I've got to run to another meeting!