Subject: Graphics Cards | October 5, 2015 - 02:33 AM | Sebastian Peak
Tagged: rumor, report, radeon, graphics cards, Gemini, fury x, fiji xt, dual-GPU, amd
The AMD R9 Fury X, Fury, and Nano have all been released, but a dual-GPU Fiji XT card could be on the way soon according to a new report.
Back in June at AMD's E3 event we were shown Project Quantum, AMD's concept for a powerful dual-GPU system in a very small form-factor. It was speculated that the system was actually housing an unreleased dual-GPU graphic card, which would have made sense given the very small size of the system (and mini-ITX motherboard therein). Now a report from WCCFtech is pointing to a manifest that just might be a shipment of this new dual-GPU card, and the code-name is Gemini.
"Gemini is the code-name AMD has previously used in the past for dual GPU variants and surprisingly, the manifest also contains another phrase: ‘Tobermory’. Now this could simply be a reference to the port that the card shipped from...or it could be the actual codename of the card, with Gemini just being the class itself."
The manifest also indicates a Cooler Master cooler for the card, the maker of the liquid cooling solution for the Fury X. As the Fury X has had its share of criticism for pump whine issues it would be interesting to see how a dual-GPU cooling solution would fare in that department, though we could be seeing an entirely new generation of the pump as well. Of course speculation on an unreleased product like this could be incorrect, and verifiable hard details aren't available yet. Still, of the dual-GPU card is based on a pair of full Fiji XT cores the specs could be very impressive to say the least:
- Core: Fiji XT x2
- Stream Processors: 8192
- GCN Compute Units: 128
- ROPs: 128
- TMUs: 512
- Memory: 8 GB (4GB per GPU)
- Memory Interface: 4096-bit x2
- Memory Bandwidth: 1024 GB/s
In addition to the specifics above the report also discussed the possibility of 17.2 TFLOPS of performance based on 2x the performance of Fury X, which would make the Gemini product one of the most powerful single-card GPU solutions in the world. The card seems close enough to the final stage that we should expect to hear something official soon, but for now it's fun to speculate - unless of course the speculation concerns a high initial retail price, and unfortunately something at or above $1000 is quite likely. We shall see.
Subject: Graphics Cards | August 24, 2015 - 02:37 PM | Sebastian Peak
Tagged: rumor, report, Radeon R9 Nano, R9 290X, leak, hot chips, hbm, amd
A report from German-language tech site Golem contains what appears to be a slide leaked from AMD's GPU presentation at Hot Chips in Cupertino, and the results paint a very efficient picture of the upcoming Radeon R9 Nano GPU.
The spelling of "performance" doesn't mean this is fake, does it?
While only managing 3 FPS better than the Radeon R9 290X in this particular benchmark, this result was achieved with 1.9x the performance per watt of the baseline 290X in the test. The article speculates on the possible clock speed of the R9 Nano based on the relative performance, and estimates 850 MHz (which is of course up for debate as no official specs are known).
The most compelling part of the result has to be the ability of the Nano to match or exceed the R9 290X in performance, while only requiring a single 8-pin PCIe connector and needing an average of only 175 watts. With a mini-ITX friendly 15 cm board (5.9 inches) this could be one of the more compelling options for a mini gaming rig going forward.
We have a lot of questions that have yet to be answered of course, including the actual speed of both core and HBM, and just how quiet this air-cooled card might be under load. We shouldn't have to wait much longer!
Subject: Graphics Cards | July 24, 2015 - 12:16 PM | Sebastian Peak
Tagged: rumor, pascal, nvidia, HBM2, hbm, graphics card, gpu
An exclusive report from Fudzilla claims some outlandish numbers for the upcoming NVIDIA Pascal GPU, including 17 billion transistors and a massive amount of second-gen HBM memory.
According to the report:
"Pascal is the successor to the Maxwell Titan X GM200 and we have been tipped off by some reliable sources that it will have more than a double the number of transistors. The huge increase comes from Pascal's 16 nm FinFET process and its transistor size is close to two times smaller."
The NVIDIA Pascal board (Image credit: Legit Reviews)
Pascal's 16nm FinFET production will be a major change from the existing 28nm process found on all current NVIDIA GPUs. And if this report is accurate they are taking full advantage considering that transistor count is more than double the 8 billion found in the TITAN X.
(Image credit: Fudzilla)
And what about memory? We have long known that Pascal will be NVIDIA's first forray into HBM, and Fudzilla is reporting that up to 32GB of second-gen HBM (HBM2) will be present on the highest model, which is a rather outrageous number even compared to the 12GB TITAN X.
"HBM2 enables cards with 4 HBM 2.0 cards with 4GB per chip, or four HBM 2.0 cards with 8GB per chips results with 16GB and 32GB respectively. Pascal has power to do both, depending on the SKU."
Pascal is expected in 2016, so we'll have plenty of time to speculate on these and doubtless other rumors to come.
Subject: Graphics Cards | July 3, 2015 - 08:45 PM | Sebastian Peak
Tagged: strix, rumor, report, Radeon Fury, asus, amd
A report from VideoCardz.com shows three listings for an unreleased ASUS STRIX version of the AMD Radeon Fury (non-X).
Image credit: VideoCardz
The listings are from European sites, and all three list the same model name: ASUS-STRIX R9FURY-DC3-4G-GAMING. You can find the listing from the above photo here at the German site Computer-PC-Shop.
Image credit: VideoCardz
We can probably safely assume that this upcoming air-cooled card will make use of the new DirectCU III cooler introduced with the new STRIX GTX 980 Ti and STRIX R9 390X, and this massive triple-fan cooler should provide an interesting look at what Fury can do without the AIO liquid cooler from the Fury X. Air cooling will of course negate the issue of pump whine that many have complained about with certain Fury X units.
The ASUS STRIX R9 390X Gaming card with DirectCU III cooler
We await offical word on this new GPU, and what price we might expect this particular version to sell for here in the U.S.A.
Subject: Mobile | June 22, 2015 - 11:43 PM | Sebastian Peak
Tagged: snapdragon 410, smartphone, rumor, Moto G, LTE, lollipop, Android
9to5google is reporting specs of the upcoming Moto G refresh, and it looks like the phone will carry over the internals of the current Moto E with a Snapdragon 410 SoC, and add an improved 13MP camera.
The current Moto G has been a favorite for many as a low-cost unlocked option (and one that runs mostly stock Android), and the adoption of the faster SoC with integrated (Cat 4) LTE baseband is a necessary move to update a device that in its current iteration is limited to 3G data speeds. It is interesting that the SoC would only match that of the $149 2015 Moto E (reviewed here), but it makes sense from a financial standpoint if the rumored Moto G is to be sold at or below its current $179 price point.
There is certainly stiff competition in the midrange smartphone market, bolstered considerably by the recently released ASUS Zenfone 2 (reviewed here as well) which starts at $199 unlocked; and with devices like the new Zenfone offering full 1080p screens the rumored choice of the Moto G’s existing 5-inch 720p screen returning in 2015 might be another indication that this new phone will feature a very aggressive price.
The alleged 2015 Moto G photo (image credit: 9to5google)
The phone is also rumored to ship with Android 5.1.1, which would carry on the recent tradition of Motorola phones running the latest versions of Android. All of this is unconfirmed information based on leaks or course, but regardless of its final form more options are always welcome in the $200-and-under unlocked phone space - and this year is shaping up to be a good one for consumers.
Subject: Graphics Cards | June 10, 2015 - 02:34 AM | Sebastian Peak
Tagged: rumor, Radeon 390X, radeon 390, radeon, leak, Hawaii XT, hawaii, amd
Here we go again...
Image credit: WCCFtech
Even more information has allegedly leaked out ahead of AMD’s official announcement of new 300-series Radeon GPUs, this time from rumor site WCCFtech. This information is totally unverified at least from any public source, but it is very specific regarding both price and GPU.
Here is the list published by WCCFtech in their report:
|R9 390X 8GB||Enhanced Hawaii XT||$389|
|R9 390 8GB||Enhanced Hawaii Pro||$329|
|R9 380X 3GB/6GB||Tonga XT (NOT CONFIRMED)|
|R9 380 4GB||Tonga Pro||$235|
|R9 380 2GB||Tonga Pro||$195|
|R7 370 4GB||Pitcairn||$175|
|R7 370 2GB||Pitcairn||$135|
|R7 360 2GB||Bonaire||$107|
As to whether this comes via leaked slides or is complete guesswork, we’ll likely have no answer until the official unveiling. Such an announcement is likely the purpose of the AMD gaming event at E3 which is now just days away. We can only hope that Fiji will in fact be making an appearance at the show as it does not appear on this list (again, if accurate).
Subject: Processors | June 2, 2015 - 08:40 AM | Sebastian Peak
Tagged: rumor, nuc, leak, Intel Skylake, core i5, core i3
A report from FanlessTech shows what appears to be a leaked slide indicating an upcoming Intel 6th-generation Skylake NUC.
The site claims that these new Intel NUCs will be coming out in Q3 for a 6th-generation Core i3 model, and in Q4 for a 6th-gen Core i5 model. and this new NUC will feature 15W TDP Skylake-U processors and 1866 MHz DDR4 memory, along with fast M.2 storage and an SDXC card reader.
True to their name, FanlessTech speculates about the possibility of a passively-cooled version of the NUC: “Out of the box, the Skylake NUC is actively cooled. But fanless cases from Akasa, HDPLEX, Streacom and cirrus7 are to be expected.”
Here are the reported specs of this NUC:
- Intel 6th Generation Core i3 / i5-6xxxU (15W TDP)
- Dual-channel DDR4 SODIMMs 1.2V, 1866 MHz (32GB max)
- Intel HD Graphics 6xxx
- 1 x mini HDMI 1.4a
- 1 x mini DisplayPort 1.2
- 2 x USB 3.0 ports on the back panel
- 2 x USB 3.0 ports on the front panel (1 x charging capable)
- 2 x Internal USB 2.0 via header
- Internal support for M.2 SSD card (22x42 or 22x80)
- Internal SATA3 support for 2.5" HDD/SSD (up to 9.5mm thickness)
- SDXC slot with UHS-I support on the side
- Intel 10/100/1000Mbps Network Connection
- Intel Wireless-AC xxxx M.2 soldered-down, wireless antennas
- IEEE 802.11ac, Bluetooth 4, Intel® Wireless Display
- Up to 7.1 surround audio via Mini HDMI and Mini DisplayPort
- Headphone/Microphone jack on the front panel
- Consumer Infrared sensor on the front panel
- 19V, 65W wall-mount AC-DC power adapter
No further information has been revealed about this alleged upcoming NUC, but we will probably know more soon.
Subject: Processors | January 29, 2015 - 10:41 AM | Sebastian Peak
Tagged: rumor, processors, Kaveri, Godavari, cpu, Athlon X4, APU, amd
VR-Zone has published a report with a detailed slide showing upcoming AMD Godavari processors, and the updated lineup includes 12 new models.
The release schedule indicates a spring availability for most of the new APUs, with the Athlon X4 850 and 870K shipping in May. The APU line gets a new flagship desktop part with the A10-8850K, and this appears to be a higher-clocked version of the A10-7850K, with a 100MHz higher boost clock (4.1 GHz vs. 4.0 GHz) and a higher GPU clock of 856 MHz (vs. 720 MHz).
Of particular interest for the potential budget quad-core buyer is the Athlon X4 870K, a new 95W part which would presumably replace the X4 860K - a processor that has seen inconsistent availability (and is currently unavailable on Newegg). With more games being released that require a quad-core to run, these sub-$100 Athlon CPUs present a great value in constructing a low-cost gaming system these days.
The slide does not indicate a change in the 28nm process from Kaveri, and it should be safe to assume these will not represent a significant architectural change. The modest clock increases from Kaveri will result in some performance gains, and this is good for consumers assuming these will sell at the same price points as the outgoing models.
Subject: Processors | January 18, 2015 - 05:16 PM | Sebastian Peak
Tagged: SoC, rumor, processor, leak, iris pro, Intel, graphics, cpu, carrizo, APU, amd
A new report of leaked benchmarks paints a very interesting picture of the upcoming AMD Carrizo mobile APU.
Image credit: SiSoftware
Announced as strictly mobile parts, Carrizo is based on the next generation Excavator core and features what AMD is calling one of their biggest ever jumps in efficiency. Now alleged leaked benchmarks are showing significant performance gains as well, with numbers that should elevate the IGP dominance of AMD's APUs.
Image credit: WCCFtech
"The A10 7850K scores around 270 Mpix/s while Intel’s HD5200 Iris Pro scores a more modest 200 Mpix/s. Carriso scores here over 600 Mpix/s which suggests that Carrizo is more than twice as fast as Kaveri and three times faster than Iris Pro. To put this into perspective this is what an R7 265 graphics card scores, a card that offers the same graphics performance inside the Playstation 4."
While the idea of desktop APUs with greatly improved graphics and higher efficency is tantalizing, AMD has made it clear that these will be mobile-only parts at launch. When asked by Anandtech, AMD had this to say about the possibility of a desktop variant:
“With regards to your specific question, we expect Carrizo will be seen in BGA form factor desktops designs from our OEM partners. The Carrizo project was focused on thermally constrained form factors, which is where you'll see the big differences in performance and other experiences that consumers value.”
The new mobile APU will be manufactured with the same 28nm process as Kaveri, with power consumption up to 35W for the Carrizo down to a maximum of 15W for the ultra-mobile Carrizo-L parts.
Subject: Graphics Cards | January 13, 2015 - 12:22 PM | Ryan Shrout
Tagged: rumor, radeon, r9 380x, 380x
Spotted over at TechReport.com this morning and sourced from a post at 3dcenter.org, it appears that some additional information about the future Radeon R9 380X is starting to leak out through AMD employee LinkedIn pages.
Ilana Shternshain is a ASIC physical design engineer at AMD with more than 18 years of experience, 7-8 years of that with AMD. Under the background section is the line "Backend engineer and team leader at Intel and AMD, responsible for taping out state of the art products like Intel Pentium Processor with MMX technology and AMD R9 290X and 380X GPUs." A bit further down is an experience listing of the Playstation 4 APU as well as "AMD R9 380X GPUs (largest in “King of the hill” line of products)."
Interesting - though not entirely enlightening. More interesting were the details found on Linglan Zhang's LinkedIn page (since removed):
Developed the world’s first 300W 2.5D discrete GPU SOC using stacked die High Bandwidth Memory and silicon interposer.
Now we have something to work with! A 300 watt TDP would make the R9 380X more power hungry than the current R9 290X Hawaii GPU. High bandwidth memory likely implies memory located on the substrate of the GPU itself, similar to what exists on the Xbox One APU, though configurations could differ in considerable ways. A bit of research on the silicon interposer reveals it as an implementation method for 2.5D chips:
There are two classes of true 3D chips which are being developed today. The first is known as 2½D where a so-called silicon interposer is created. The interposer does not contain any active transistors, only interconnect (and perhaps decoupling capacitors), thus avoiding the issue of threshold shift mentioned above. The chips are attached to the interposer by flipping them so that the active chips do not require any TSVs to be created. True 3D chips have TSVs going through active chips and, in the future, have potential to be stacked several die high (first for low-power memories where the heat and power distribution issues are less critical).
An interposer would allow the GPU and stacked die memory to be built on different process technology, for example, but could also make the chips more fragile during final assembly. Obviously there a lot more questions than answers based on these rumors sourced from LinkedIn, but it's interesting to attempt to gauge where AMD is headed in its continued quest to take back market share from NVIDIA.