Subject: General Tech, Mobile | January 5, 2015 - 08:00 PM | Tim Verry
Tagged: vibe x2 pro, vibe x, vibe band, smartphone, qualcomm 600, Lenovo, ces 2015, CES, android l
Alongside the onslaught of new notebooks and tablets, Lenovo is launching a limited edition Vibe X2 Pro smartphone and a new wearable accessory called the Vibe Band VB10. As an added bonus, Lenovo is also showing off a new "Selfie Flash" VIBE Xtension that will work with the Vibe X2.
The Lenovo VIBE X2 Pro is an amped up, limited edition, version of the VIBE X2 that debuted a few months ago. The X2 Pro takes the layered aesthetic further by moving to a larger (but thinner) full metal body with unique color options. It features a 5.3" 1920 x 1080 resolution display, dual 13MP cameras (with support for the Selfie Flash accessory), Android Lollipop support, and tweaked internals. The phone measures 146.3 x 71 x 6.95mm and weighs 140g. The Pro version features champagne gold, electric blue and rock pink color options compared to the white, champagne gold, and red colors of the non-pro Vibe X2.
Internally, Lenovo has opted for the Qualcomm Snapdragon 615 SoC which is a 64-bit octo core processor clocked at 1.5 GHz and a Adreno 405 GPU. Qualcomm specs the CPU portion as being two ARM Cortex A53 quad cores clocked at up to 1.7 GHz and 1.0 GHz respectively. The SoC is paired with 2GB of internal memory and 32GB flash storage (no microSD expansion). The phone is powered by a embedded 2,410 mAh Li-Polymer battery. Connectivity includes 802.11ac Wi-Fi, Bluetooth 4.1 LE, LTE cellular radio, analog audio output, micro USB, and dual nano SIM slots. Sensors include A-GPS, gravitation, proximity, light, and e-compass.
The phone will run the company's VIBE UI 2.0 on top of Google's Android Lollipop operating system.
In all, the Vibe X2 Pro has a larger display, better camera, bigger battery, new colors, a metal body, and different CPU/GPU.
The limited edition VIBE X2 Pro will be available in China and Europe (specific countries will be announced at a later date) for $499 starting in April 2015. Notably, this smartphone will not be available in the US.
The VIBE Band VB10 is a wearable watchband accessory that pairs with the Vibe X2 (and also supports iOS devices). A metal bond and rubberized strap host a curved E-Ink display (230ppi) along with a battery that can reportedly power the Bluetooth radio and constantly powered-on display for seven days. The Vibe Band can display messages and notifications, be used to accept or reject phone calls, act as a warning if go out of range of your phone, and collect data (steps, calories, distance, and sleep) for a fitness app that can graph your performance and set personalized goals.
The wearable weighs about 30 grams and runs Android 4.4. Further, the VB10 is IPX7 rated as being waterproof up to 1 meter for 30 minutes.
The Vibe Band VB10 will be available in April (China and Europe) for $89.
Finally, Lenovo showed off a new Vibe Xtension called the Selfie Flash. The Selfie Flash plugs into the audio out of the Vibe X2 and X2 Pro to illuminate self portraits in low light environments. The circular add-on is synchronized to the Vibe X2's shutter and a ring of eight LEDs cast diffused light over a one meter distance according to Lenovo. It is rated at 100 selfies per charge.
The new selfie-enhancing Vibe Xtension will be available in April for $29 in markets where X2 and X2 Pro smartphones are sold.
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Subject: Mobile | January 11, 2013 - 02:05 PM | Tim Verry
Tagged: SoC, qualcomm 800, qualcomm 600, qualcomm, krait, ces 2013, CES, arm, adreno 330, adreno 320
Qualcomm introduced two new high end mobile processors at CES earlier this week. Known as the Snapdragon 600 and Snapdragon 800, the new SoCs take the company’s Krait CPU cores to the next level. Both of the new chips are based on a 28nm HPm manufacturing process and feature faster (and more efficienct) CPU and GPU portions.
The Qualcomm Snapdragon 600 is SoC with four Krait 300 CPU cores clocked at 1.9GHz along with an Adreno 320 GPU, and 4G LTE modem. The Snapdragon 600 also supports LPDDR3 RAM. The Adreno 320 GPU features suport fro OpenGL ES 3.0, OpenCL, and Renderscript Compute technologies. According to Qualcomm, the Snapdragon 600 is 40% faster than the Snapdragon S4 Pro processor used in devices like the Google Nexus 4 smartphone. Also, the Adreno 320 GPU is up to 3-times faster than the previous-generation A225.
The Snapdragon 600 SoC is inteded for smartphones, and we should start to see the new processor shipping with new devices by Q2 2013.
Meanwhile, the Snapdragon 800 processor takes performance up yet another notch over the company’s existing chips. The new SoC includes four Krait 400 CPU cores clocked at 2.3GHz, an Adreno 330 GPU, support for 2x32-bit LPDDR3 at 800MHz (12.8Gbps), and a 4G LTE modem. The chip also features two image signal processors (ISP) that can handle up to four cameras and 55MP (total) resolution. Devices with the Snapdragon 800 processor will be able to record 1080p30 video as well as encode and decode stored videos with up to 4K resolutions. As far as wireless, the Snapdragon 800 includes a 4G LTE modem and 802.11ac Wi-Fi. The upcoming SoC can handle 4K video output and HD audio in the form of DTS-HD, Dolby Digital+, and 7.1 Surround Sound.
The Adreno 330 GPU in the Snapdragon 800 chip also supports OpenGL ES 3.0, OpenCL, and Rednderscript Computer technologies. It can output 4K video and reportedly offers up to twice the compute performance versus the Adreno 320 GPU in the Snapdragon 600 processor.
According to Qualcomm, the Snapdragon 800 processor as a whole is up to 75% faster than the Snapdragon S4 Pro SoC. Qualcomm is aiming this processor at “premium” high end devices including Smart TVs, tablets, consumer electronics devices (ie: blu ray players with apps), and smartphones. Qualcomm expects to see devices powered by the new SoC become available sometime around the middle of 2013 (1H’13).
The new chips appear to offer up some noticeable performance and efficiency improvements over the current generation of Snapdragon processors. The Snapdragon 800 in particular is an impressive-sounding design. I am interested to see how it stacks up against competing chips such as NVIDIA’s Tegra 4, Samsung’s next-gen Exynos lineup, and whatever chip Apple has up its sleeve for the next iPad/iPhone refresh. This year is shaping up to be an exciting year for ARM-based SoCs!
If you are interested in the new silicon, Qualcomm has teased a few more details on its blog.
PC Perspective's CES 2013 coverage is sponsored by AMD.
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