CES Storage Roundup Part 3 - Intel Cherryville and IMFT 20nm flash die spotted!

Subject: Storage, Shows and Expos | January 16, 2012 - 02:33 PM |
Tagged: ssd, micron, Intel, imft, flash, cherryville, CES, 20nm

CES is sort of like a Where's Waldo book. There are thousands of places to look, with new technology spread around all over the place. Some of that unreleased tech shows up right in front of you and you don't even realize what you were looking at until later on. It's how we caught a look at prototype Light Peak (now Thunderbolt) two years ago, and this year we saw some more goodies not previously seen in the wild. I tend to be a bit of a shutterbug, and I take seemingly random pics of things as the PCPer gang runs around the various vendor booths and hotel suites. While going through the pics from my phone, I ran across this shot of what I thought was an Intel 320 Series SSD:

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Definitely not a 320, that's an Intel 520 Series (Cherryville) SSD. While Intel had their 520 Series locked up tight at their Storage Visions booth, this one was powering another motherboard makers product elsewhere in Vegas. Unfortunately this system was only to demo the motherboard itself, without a connected display, so it would not have been possible to run our own benches.

At storage visions, we also saw this display at the Micron booth. It's interesting to see how 16GB of flash memory has shrunk over the past few years. We've certainly come a long way from the good old X25-M:

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Some of you may know that I'm a sucker for a good die shot, so I snuck back out to Micron's suite later on to get my own macro shot of the 20nm IMFT flash die:

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Micron is, like many other vendors, working on their own SSD solution specifically for SSD caching applications. It's currently unreleased, so more to follow on this.

PC Perspective's CES 2012 coverage is sponsored by MSI Computer.

Follow all of our coverage of the show at http://pcper.com/ces!

A look at CES 2012 through other peoples eyes

Subject: Shows and Expos | January 11, 2012 - 12:33 PM |
Tagged: yoga, ultrabook, tablet, ocz, micron, Lenovo, kilimanjaro, CES

By now you should have hit our CES 2012 page, where all of our news coming out of CES is aggregated for you.   The sad truth is that PC Perspective has yet to conquer time and space, so we can only be in one place at a time which leads to missed appointments with vendors.  However, we are not the only tech site represented at CES 2012; for instance The Tech Report is running around Las Vegas as you read this.  So far they've seen a Lenovo laptop/netbook which knows Yoga, seen the heights that the combined team of OCZ and Micron can climb to and tablets with better than 1080p resolution.  They also weigh in on the similarities between Ultrabooks and a certain Apple product, as they are one of Intel's main focuses at this CES.

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Here is some more Tech News from around the web:

Tech Talk

 

PC Perspective's CES 2012 coverage is sponsored by MSI Computer.

Follow all of our coverage of the show at http://pcper.com/ces!

Samsung and Micron Developing Hybrid Memory Cube Technology

Subject: Memory | October 7, 2011 - 05:52 AM |
Tagged: memory, hybrid memory cube, HMC, micron, Intel, Samsung, ram, DDR, DRAM

Micron Technology and Samsung Electronics, in cooperation with Intel, Altera Corporation, Open Silicon, and Xilinx among others have formed the “Hybrid Memory Cube Consortium” to develop and encourage adoption of a new storage interface specification. This new storage technology is based on Hybrid Memory Cube (HMC) technology, which is comprised of PCB, a thin logic layer, and stacks of DRAM chips. These memory chips are stacked vertically on top of one another and connected via TSV.

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A mock up of a HMC (Source: CNET)

According to Tech Connect Magazine, Micron’s Vice President for DRAM Marketing is quoted in stating “HMC brings a new level of capability to memory that provides exponential performance and efficiency gains.” Hybrid Memory Cube technology is claimed to be capable of using 70% less power than current DDR3 memory modules (DIMMs) while being up to 15 times faster.

Reinforcing Micron’s position is Intel’s CTO Justin Rattner who talked very highly of the technology and it’s massive bandwidth and I/O improvements versus traditional DDR style memory designs. The Hybrid Memory Cube is capable of sustained transfer rates of 1 terabit per second, and is “the most energy efficient DRAM ever built” by a bits transferred per amount of energy consumed.

Both Intel and Micron have expressed that the HMC technology will be a boon for data centers and high performance computing that demands low power and high bandwidth memory storage. Assuming the numbers pan out, the Hybrid Memory Cube will be quite a leap in memory efficiency and will further accelerate adoption rates of so called “cloud” applications as well as more efficient high performance servers used in scientific research endeavors. All in all, the idea of the Hybrid Memory Cube is cool stuff, and it will be interesting to see if the actual memory will live up to its grandeur name.