Intel Loves Exponential Trends: Shrinking Mini-PCs

Subject: General Tech, Cases and Cooling, Systems, Shows and Expos | September 12, 2014 - 11:20 AM |
Tagged: idf, idf 2014, nuc, Intel, SFF, small form factor

A few years ago, Intel introduced the NUC line of small form factor PCs. At this year's IDF, they have announced plans to make even smaller, and cheaper, specifications that are intended for OEMs to install Windows, Linux, Android, and Chrome OS on. This initiative is not yet named, but will consist of mostly soldered components, leaving basically just the wireless adapters user-replaceable, rather than the more user-serviceable NUC.

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Image Credit: Liliputing

Being the owner of Moore's Law, they just couldn't help but fit it to some type of exponential curve. While it is with respect to generation, not time, Intel expects the new, currently unnamed form factor to halve both the volume (size) and bill of material (BOM) cost of the NUC. They then said that another generation after ("Future SFF") will halve the BOM cost again, to a quarter of the NUC.

What do our readers think? Would you be willing to give up socketed components for smaller and cheaper devices in this category or does this just become indistinguishable from mobile devices (which we already know can be cheap and packed into small spaces)?

Source: Liliputing
Manufacturer: ECS

Introduction

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ECS hosted a press event in the third week of August to unveil its new product lineup and corporate direction. The press event, named "Live, Liva, Lead, L337", lays out the important aspects of the "new ECS" and its intended market direction. They introduced the LIVA mini computer with integrated 32GB and 64GB integrated SSDs, their Z97-based product line-up, and the North America LIVA design contest.

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Their naming of the event was apropos to their renewed corporate vision with the first two terms, Live and LIVA, referencing their LIVA mini-PC platform. ECS developed the name LIVA by combining the words Live and Viva (Life in Spanish), signifying the LIVA line's aim at integrating itself into your daily routine and providing the ability to live a better life. Lead signifies ECS' desire to become a market leader in the Mini-PC space with their LIVA platform as well as become a more dominant player in the PC space. The last term, L337, is a reference to their L337 Gaming line of motherboards, a clear reminder of their Z97 offerings to be unveiled.

ECS seeks to consolidate its product lines, re-focusing its energy on what it excels at - offering quality products at reasonable prices. ECS seeks to leverage its corporate partnerships and design experience to build products equivalent to competitor lines at a much reduced cost to the end user. This renewed focus on quality and the end user led to a much revised Z97 board lineup in comparison to its Z87-based offerings. Additionally, their newly introduced mini-PC line, branded LIVA, seeks to offer a cheaper all-in-one alternative to the Intel NUC and GIGABYTE BRIX systems.

Contine reading our overview of the ECS press event!!

Podcast #317 - ASUS X99 Deluxe Review, Core M Performance, 18 Core Xeons and much more news from IDF!

Subject: General Tech | September 11, 2014 - 11:30 AM |
Tagged: podcast, video, asus, X99, X99 Deluxe, Intel, core m, xeon e5-2600 v3, idf, idf 2014, fortville, 40GigE, dell, 5k, nvidia, GM204, maxwell

PC Perspective Podcast #317 - 09/11/2014

Join us this week as we discuss our ASUS X99 Deluxe Review, Core M Performance, 18 Core Xeons and much more news from IDF!

You can subscribe to us through iTunes and you can still access it directly through the RSS page HERE.

The URL for the podcast is: http://pcper.com/podcast - Share with your friends!

  • iTunes - Subscribe to the podcast directly through the iTunes Store
  • RSS - Subscribe through your regular RSS reader
  • MP3 - Direct download link to the MP3 file

Hosts: Josh Walrath, Allyn Malventano, and Morry Tietelman

Program length: 1:33:48

  1. Week in Review:
  2. IDF News:
  3. News items of interest:
  4. Hardware/Software Picks of the Week:
    1. Allyn: Read our IDF news!
  5. Closing/outro

Subscribe to the PC Perspective YouTube Channel for more videos, reviews and podcasts!!

 

A brisk tour of IDF 2014

Subject: General Tech | September 11, 2014 - 10:04 AM |
Tagged: idf 2014, western digital, hgst, Intel, dell

The Tech Report have been busy scribing up the various announcements and product releases that Intel and others are revealing at this years IDF.  The HDD is staying alive by offering larger capacities than were available previously, from Western Digital's  6.3 TB archival model to HGST's 10TB helium filled monster with a 3.2TB SSD also available for frequently accessed data.  From Intel comes information on Skylake systems and their wireless charging to the first benchmarks we've seen for Core M ultraportables.  Also present were Dell, which allowed TR some hands on time with their Venue 8 7000 and of course a small announcement from that other company.

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"Somewhat surprisingly, the initial model's capacity is listed as 6.x TB. The Ae is based on an "innovative Progressive Capacity model" that allows WD to increase the capacity of shipping drives as yields improve and the company gets better at squeezing more data onto the platters. The gains will be small—capacities of 6.1, 6.2, and 6.3 TB are listed as examples—but WD says the folks who need drives like these are hungry for even incremental improvements."

Here is some more Tech News from around the web:

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Manufacturer: Intel

Core M 5Y70 Early Testing

During a press session today with Intel, I was able to get some early performance results on Broadwell-Y in the form of the upcoming Core M 5Y70 processor.

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Testing was done on a reference design platform code named Llama Mountain and at the heart of the system is the Broadwell-Y designed dual-core CPU, the Core M 5Y70, which is due out later this year. Power consumption of this system is low enough that Intel has built it with a fanless design. As we posted last week, this processor has a base frequency of just 1.10 GHz but it can boost as high as 2.6 GHz for extra performance when it's needed.

Before we dive into the actual result, you should keep in mind a couple of things. First, we didn't have to analyze the systems to check driver revisions, etc., so we are going on Intel's word that these are setup as you would expect to see them in the real world. Next, because of the disjointed nature of test were were able to run, the comparisons in our graphs aren't as great as I would like. Still, the results for the Core M 5Y70 are here should you want to compare them to any other scores you like.

First, let's take a look at old faithful: CineBench 11.5.

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UPDATE: A previous version of this graph showed the TDP for the Intel Core M 5Y70 as 15 watts, not the 4.5 watt listed here now. The reasons are complicated. Even though the Intel Ark website lists the TDP of the Core M 5Y70, Intel has publicly stated the processor will make very short "spikes" at 15 watts when in its highest Turbo Boost modes. It comes to a discussion of semantics really. The cooling capability of the tablet is only targeted to 4.5-6.0 watts and those very short 15 watt spikes can be dissipated without the need for extra heatsink surface...because they are so short. SDP anyone? END UPDATE

With a score of 2.77, the Core M 5Y70 processor puts up an impressive fight against CPUs with much higher TDP settings. For example, Intel's own Pentium G3258 gets a score of 2.71 in CB11, and did so with a considerably higher thermal envelope. The Core i3-4330 scores 38% higher than the Core M 5Y70 but it requires a TDP 3.6-times larger to do so. Both of AMD's APUs in the 45 watt envelope fail to keep up with Core M.

Continue reading our preview of Intel Core M 5Y70 Performance!!

IDF 2014: Skylake Silicon Up and Running for 2H 2015 Release

Subject: Shows and Expos | September 9, 2014 - 02:27 PM |
Tagged: Skylake, Intel, idf 2014, idf, 14nm

2015 is shaping up to be an interesting year for Intel's consumer processor product lines. We are still expected to see Broadwell make some kind of debut in a socketed form in addition to the mobile releases trickling out beginning this holiday, but it looks like we will also get our first taste of Skylake late next year.

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Skylake is Intel's next microarchitecture and will be built on the same 14nm process technology currently shipping with Broadwell-Y. Intel stated that it expects to see dramatic improvements in all areas of measurement including performance, power consumption and silicon efficiency.

On stage the company demoed Skylake running the 3DMark Fire Strike benchmark though without providing any kind of performance result (obviously). That graphics demo was running on an engineering development board and platform and though it looked incredibly good from where we were sitting, we can't make any guess as to the performance quite yet.

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Intel then surprised us by bringing a notebook out from behind the monitor showing Skylake up and running in a mobile form factor decoding and playing back 4K video. Once again, the demo was smooth and impressive though you expect no more from an overly rehearsed keynote.

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Intel concluded that it was "excited about the health of Skylake" and that they should be in mass production in the first quarter of 2015 with samples going out to customers. Looking even further down the rabbit hole the company believes they have a "great line of sight to 10nm and beyond." 

Even though details were sparse, it is good news for Intel that they would be willing to show Skylake so early and yet I can't help but worry about a potentially shorter-than-expected life span for Broadwell in the desktop space. Mobile users will find the increased emphasis on power efficiency a big win for thin and light notebooks but enthusiast are still on the look out for a new product to really drive performance up in the mainstream.

IDF 2014: Intel and Google Announce Reference Design Program, Guaranteed 2 Week AOSP Updates

Subject: Mobile | September 9, 2014 - 10:00 AM |
Tagged: tablet, reference design program, Intel, idf 2014, idf, google, aosp, Android

During today's keynote of the Intel Developer Forum, Google and Intel jointly announced a new program aimed to ease the burden of Android deployment and speed up the operating system update adoption rates that have often plagued the ecosystem.

In today's Android market, whether we are talking about x86 or ARM-based SoC designs, the process to release a point update to the operating system is quite complicated. ODMs have to build unique operating system images for each build and each individual SKU has to pass Google Media Services (GMS). This can be cumbersome and time consuming, slowing down or preventing operating system updates from ever making it to the consumer.

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With the Intel Reference Design Program, the company will provide it's partners with a single binary that allows them to choose from a pre-qualified set of components or a complete bill of materials specification. Obviously this BOM will include Intel x86 processors like Bay Trail but it should help speed up the development time of new hardware platforms. Even better, OEMs and ODMs won't have to worry about dealing with the process of passing GMS certification leaving the hardware vendor to simply release the hardware to the market.

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But, an even bigger step forward, is Intel's commitment on the software side. Everyone knows how fragmented the Android OS market with just 20% of the hardware on the Play Store running Android KitKat. For devices built on the Reference Design Program, Intel is going to guarantee software updates within 2 weeks of AOSP (Android Open Source Project) updates. And, that update support will be given for two years after the release of the launch of the device.

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This combination of hardware and software support from Intel to its hardware ODMs should help ignite some innovation and sales in the x86 Android market. There aren't any partners to announce support for this Reference Design Program but hopefully we'll hear about some before the end of IDF. It will be very interesting to see what ARM (and its partners) respond with. There are plenty of roadblocks holding back the quick uptake of x86 Android tablets but those companies would be blind to ignore the weight that Intel can shift when the want to.

Intel Developer Forum (IDF) 2014 Keynote Live Blog

Subject: Processors, Shows and Expos | September 9, 2014 - 08:02 AM |
Tagged: idf, idf 2014, Intel, keynote, live blog

Today is the beginning of the 2014 Intel Developer Forum in San Francisco!  Join me at 9am PT for the first of our live blogs of the main Intel keynote where we will learn what direction Intel is taking on many fronts!

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ASUS ZenBook UX305 Will Be Based on Core M (Broadwell)

Subject: General Tech, Systems, Mobile | September 8, 2014 - 10:49 PM |
Tagged: Intel, asus, core m, broadwell-y, Broadwell, 14nm, ultrabook

This will probably be the first of many notebooks announced that are based on Core M. These processors, which would otherwise be called Broadwell-Y, are the "flagship" CPUs to be created on Intel's 14nm, tri-gate fabrication process. The ASUS ZenBook UX305 is a 13-inch clamshell notebook with one of three displays: 1920x1200 IPS, 1920x1200 multi-touch IPS, or 3200x1800 multi-touch IPS. That is a lot of pixels to pack into such a small display.

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While the specific processor(s) are not listed, it will use Intel HD Graphics 5300 for its GPU. This is new with Broadwell, albeit their lowest tier. Then again, last generation's 5000 and 5100 were up in the 700-800 GFLOP range, which is fairly high (around medium quality settings for Battlefield 4 at 720p). Discrete graphics will not be an option. It will come with a choice between 4GB and 8GB of RAM. Customers can also choose between a 128GB SSD, or a 256GB SSD. It has a 45Wh battery.

Numerous connectivity options are available: 802.11 a, g, n, or ac; Bluetooth 4.0; three USB 3.0 ports; Micro HDMI (out); a 3.5mm headphone/mic combo jack; and a microSD card slot. It has a single, front-facing, 720p webcam.

In short, it is an Ultrabook. Pricing and availability are currently unannounced.

Source: ASUS

Intel's security on the silicon is starting to pay dividends

Subject: General Tech | September 8, 2014 - 09:52 AM |
Tagged: IBM, Intel, txt, mcafee

Intel have been diligently working on their Trusted Execution Technology to provide security on the actual silicon and with their purchaser of McAfee this technology has quickly improved over the past year.  IBM subsidiary Softlayer, who offer cloud storage, have announced that the will be implementing TXT along with the Intel Trusted Platform module to offer enhanced security on their servers.  This should make them attractive to government and law enforcement agencies which utilize clouds storage as well as businesses that need to keep their customers data secure.  They are not the first to consider TXT but are among the largest of vendors who are currently deploying servers that take advantage of the new security.  Check out more at The Register.

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"BIG BLUE IBM has announced that its Softlayer subsidiary will be the first cloud service to offer bare metal servers powered by Intel technology that provides monitoring and security down to the microchip level."

Here is some more Tech News from around the web:

Tech Talk

Source: The Register