Subject: Processors | September 22, 2011 - 02:35 PM | Jeremy Hellstrom
Tagged: Intel, Ivy Bridge, tick, 22nm, tri-gate
Over at AnandTech you can read about the first processor to be designed using Intel's new Tri-Gate transistors, Ivy Bridge. As well this new take on Sandy Bridge will natively support USB 3.0 thanks to the improved Z77, Z75 and H77 chipsets. There will also be Q77, Q75 and B75 to make sure you get a more alphabet soup to deal with. The new GPU inside is something Intel is rather proud of, a claimed 33% improvement is impressive and signals that Intel really is taking the iGPU portion of their chips seriously. That focus is confirmed if you read through the minimal improvements to the CPU side, not a bad thing at all, simply confirmation that Intel is concerned more with power efficiency and graphics performance instead of just pumping up the megahertz.
"Five years ago Intel announced its ambitious tick-tock release cadence. We were doubtful that Intel could pull off such an aggressive schedule but with the exception of missing a few months here or there tick-tock has been a success. On years marked by a tick Intel introduces a new manufacturing process, while tock years keep manufacturing process the same and introduce a new microprocessor architecture. To date we've had three tocks (Conroe, Nehalem, Sandy Bridge) and two ticks (Penryn, Westmere). Sampling by the end of this year and shipping in the first half of next year will be Intel's third tick: Ivy Bridge."
Here are some more Processor articles from around the web:
- Intel Core i5 2400S @ Phoronix
- All Core i7 Models @ Hardware Secrets
- All Core i5 Models @ Hardware Secrets
- All Core i3 Models @ Hardware Secrets
- Mobile CPU Comparison Guide @ TechARP
- Workstation & Server CPU Comparison Guide @ TechARP
- Interactive AMD Phenom product ID guide @ OC Inside
Subject: Processors | September 22, 2011 - 11:39 AM | Tim Verry
Tagged: sandy bridge, Intel, core i7, 2700K, 2600K
Intel’s 2600K processor has sat at the top of the company’s lineup for almost a year now. As the company has had time to work out production issues and streamline the binning on their silicon, the Core i7 2700K that was revealed recently through a materials declaration data sheet (MDDS) would be identical to the 2600K except for a 100MHz bump in clock speed. Launching in October 2011, the new processors are said to be great overclockers due to Intel cherry picking the silicon used in the 2700K.
Interestingly, the 2700K may not replace the current Core i7 2600K processor in the lineup. According to a source by VR-Zone, the 2700K will debut at a higher price point than the 2600K which suggests that Intel has no plans to phase out the processor. Specifically, the new 2700K will not result in cheaper 2600K parts as it debuts at the current list price (for the 2600K) of $317 USD. Rather, VR-Zone suspects that the new Sandy Bridge CPU will launch at a higher price point in the range of $340 to $350 USD.
What are your thoughts on the new Core i7 2700K? Do you think Intel will keep both the 2600K and 2700K around, and (more importantly) will the 2700K be worth the extra money as a pseudo cherry picked 2600K with a 100MHz higher stock clock? Let us know your thoughts in the comments.
Subject: Processors | September 20, 2011 - 01:00 PM | Tim Verry
Tagged: sandy bridge, quad core, Intel, core i7 2700k
The Intel Core i7 2600K is the company’s top tier Sandy Bridge processor; or at least it was until now. CPU World discovered interesting part numbers on the company’s Material Declaration Data Sheet (MDDS) that suggests that there may be a new contender for the top spot. Specifically, the new part numbers are BX80623172700K and BXC80623172700K, which suggests that the new processor will be launched as the Intel Core i7 2700K.
CPU World's discovery of new part numbers.
The site suggests that the new 2700K will be a higher clocked version of the 2600K processor, including a 95 watt TDP, four cores, hyperthreading technology, and 8 MB of cache. Unfortunately, it is not clear just how much higher the 2700K will be clocked at; however, as an unlocked processor with relatively good binning, enthusiasts should be able to get some great overclocks out of them.
Have you upgraded to Sandy Bridge, or are you planning on skipping over it for another upgrade instead? Either way, I think it is a good thing to see Intel updating its current lineup while also pursuing Ivy Bridge and Sandy Bridge-E.
Subject: Editorial, General Tech, Processors, Chipsets, Systems, Storage, Mobile, Shows and Expos | September 15, 2011 - 12:15 PM | Ryan Shrout
Tagged: live blog, Intel, idf 2011, idf
PC Perspective is all over the 2011 Intel Developer Forum and we'll be covering it LIVE here all week. Expect to hear news about Ivy Bridge, Sandy Bridge-E, SSDs, X79 chipsets, 22nm tri-gate transistors and more! We will have specific news posts about the major topics but if you want to keep up with our information to the minute, then you'll want to migrate to this page throughout Tuesday, Wednesay and Thursday morning.
You can also hit up http://www.pcper.com/category/tags/idf to see all of the posts relating to and coming from IDF this week!
Feel free to leave comments for me on what exactly you want to know and I will do my best to address your questions as the day progresses.
Subject: General Tech | September 14, 2011 - 01:36 PM | Jeremy Hellstrom
Tagged: Intel, idf, idf 2011
Ryan wasn't the only one madly recording the Intel Developers Forum keynote address by Mooly Eden, The Tech Report was also there. Drop by their record of the live blog that they created here, complete with pictures from a different angle than Ryan's and with different content in some cases. There is even a hacker ninja!
"Our own Scott Wasson and Geoff Gasior live blogged Mooly Eden's keynote (complete with pictures) at the Intel Developer Forum this morning. The keynote centered on Intel's mobile endeavors, including Windows 8 tablets and Ivy Bridge-powered ultrabooks. Eden also gave a sneak preview of Intel's next-gen Haswell processors, which will succeed Ivy Bridge in 2013."
Here is some more Tech News from around the web:
- Cloudy with a chance of backups @ The Tech Report
- Hands On with Windows 8 Developer Preview @ TechReviewSource
- Microsoft BUILD: Windows 8, A Pre-Beta Preview @ AnandTech
- Hands-on with Windows 8: it's good stuff on the PC, too @ Ars Technica
- Intel, Google 'optimize' chips for Android @ The Register
- Bittorrent.com's software download hacked to serve malware @ The Register
- Intel RTS2011LC CPU Water Cooler Shown at IDF 2011 @ Legit Reviews
- Intel DX79SI Motherboard Revealed - X79 Express Chipset @ Legit Reviews
- TP-Link TL-PA211KIT @ Rbmods
- Bigfoot Networks Killer 1102 Wireless-N Network Card Comparison Review @ ThinkComputers
Subject: General Tech | September 13, 2011 - 05:05 PM | Scott Michaud
Tagged: mcafee, Intel, idf 2011, idf
As the Intel Developer Forum commences we finally learn a little bit about what Intel is attempting to do with the acquisition of McAfee among other tidbits. Malware is one of the banes of computing existence. Information is valuable, security is hard, and most people do not know either. Antimalware software remains a line of defense between you and infections in the event that your first three lines of defense (patching known security vulnerabilities in software; limiting inbound connections and permissions; and common sense) fail to help. While no antimalware software is anywhere near perfect Intel believes that getting protection a little deeper in the hardware will do a little more to prevent previously unknown exploits.
Great Norton’s Ghost!
According to McAfee’s website, DeepSAFE is a platform for security software to see more of what is going on in the hardware around the Operating System itself. They are being very cagey about what technology is being utilized both on their site as well as their FAQ (pdf) which causes two problems: firstly, we do not know exactly what processors support or will support DeepSAFE; secondly, we do not know exactly what is being done. While this is more details than we knew previously there are still more than enough holes to fill before we know what this technology truly is capable of.
Subject: Editorial, General Tech, Motherboards, Processors, Chipsets | September 12, 2011 - 10:22 AM | Ryan Shrout
Tagged: Intel, idf 2011, idf
It is once again time for our annual pilgrimage to the land of the Golden Gate to spend a few days with our friends at Intel and the Intel Developer Forum. IDF is one of the most informative events that I attend and I am always impressed by the openness and detail with which Intel showcases its upcoming products and future roadmap. This year looks to be no different.
What do we have on the agenda? First and foremost, we expect to hear all about Ivy Bridge and the architecture changes it brings to the Sandy Bridge CPUs currently in the market. Will we see increased x86 performance or maybe increases in the likelihood of us recommending the integrated graphics? More information is set to be revealed on the 22nm tri-gate transistor as well as the X79 chipset and the Sandy Bridge-E enthusiast platform. SSDs and Ultrabooks are also set on the docket. It's going to be busy.
But what would a week in downtown San Francisco be without visits from other companies as well? We are set to meet with Lucid, MSI, ASUS, Gigabyte, Corsair, HP and of course, AMD. I expect we will have just as much to say about what each of these companies has on display as we do Intel's event.
I am planning on live blogging many of the sessions I will be attending so stay tuned to PC Perspective all week for the latest!!
Subject: General Tech | September 8, 2011 - 08:09 PM | Tim Verry
Tagged: sandybridge, Intel, htpc, asrock
ASRock, a company most well known for its motherboards, has built a sleek little HTPC (home theater PC) whose specifications recently leaked to the web. Powered by a choice of Intel’s latest Sandy Bridge Core i3, i5, or i7 processors, and a discrete Nvidia GT540M graphics card with 1 GB RAM the small black or silver chassis has enough power to deliver 2D or 3D video with ease. Further, the computer features a Blu-ray drive, the aforementioned Nvidia 3D Vision technology, a media center remoter, and a media card reader.
Connectivity includes headphone and microphone inputs, two USB 3.0 ports, SD card reader, and power button on the front. The rear of the HTPC contains a host of connectivity options including a power jack, S/PDIF, 7.1 channel analog audio jacks, Ethernet, two USB 3.0 ports, DVI, E-SATA, HDMI 1.4a, and four USB 2.0 ports. Air ventilation slots and a Kensington lock slot.
Needless to say, this little PC is loaded with options, and would even be capable of some light gaming in addition to its role as a movie and multimedia playback device. The aesthetics are pretty good as well. Do you have a dedicated HTPC box in your entertainment center or do you use extender devices like the Xbox 360 to play your media on the TV? You can see more photos and details on the HTPC over at Engadget.
Subject: General Tech | September 8, 2011 - 12:03 PM | Jeremy Hellstrom
Tagged: ultrabook, plastic and fibreglass, MiTAC Technology, Intel
A metal chassis, such as the magnesium- aluminium alloy we have seen on various Ultrabooks, is not actually in the specifications Intel set for manufacturers. It has been used because the incredible thinness that is specified would make a plastic chassis far too flexible and could cause the internal components to deform to the point they become damaged. The problem with the metal chassis is the expense, they do add to the cost of the Ultrabook and it seems that Intel is targeting that expense as the next price cut to the Ultrabook in an attempt to drop it below $1000.
They are working with a company called MiTAC Technology to develop a fibreglass and plastic material that will be much less expensive than a metal alloy case but still have enough rigidity for ease of use and to protect the internals. DigiTimes points out that fibreglass is much easier to colour than metal which could result in a case that is as attractive as brushed aluminium. The all-in-one PCs that they sell do include a touch screen so there must be some firmness to MiTAC's materials.
One of MiTAC's AIOs
"Intel has recently been aggressively cooperating with notebook chassis suppliers hoping to achieve the goal of dropping Ultrabook prices to below US$1,000, and Intel is currently focusing on pushing plastic and fiberglass hybrid chassis for the new machines, according to sources from the PC supply chain.
The sources pointed out that magnesium-aluminum alloy chassis are still the top choice for Ultrabooks, but limited by capacity and price, most of brand vendors are unable to offer an end price below the targeted US$1,000, and the three already-launched Ultrabooks from Acer, Lenovo and Toshiba are all estimated to have end price higher.
The sources also revealed that at one of Intel's recent supply chain conferences, Intel invited fiberglass chassis supplier Mitac Technology to participate and even had personnel from Mitac on stage to explain the technology which most of the attending suppliers believe is an indication for brand vendors to adopt the chassis."
Here is some more Tech News from around the web:
- 3M and IBM get into the skyscraper business @ SemiAccurate
- Google will launch Android Ice Cream Sandwich in October or November @ The Inquirer
- Skype: Microsoft's $8.5 billion identity tool @ The Register
- TSMC expects to ramp 14nm process in 2015, says R&D head @ DigiTimes
- Yahoo pondering sale; what might Microsoft make of this mess? @ Ars Technica
- Nvidia boss: Windows 8 will run Windows Phone 7 apps @ The Register
- EnGenius ESR-9850 Wireless Router @ TechwareLabs
- Speedlink Snappy Smart Webcam @ XSReviews
Silly Intel, the high price and limited availability were the parts your Ultrabook was supposed to drop
Subject: General Tech | September 6, 2011 - 02:17 PM | Jeremy Hellstrom
Tagged: ultrabook, Intel
The Ultrabook gambit is receiving a lot of attention and has been since before there was even a single model available for review. In this particular case the interest is not because of the hardware but because of the gamble Intel is taking trying to muscle in on Apple's ultramobile territory, especially since the memory of the UMPC is still fresh in the minds of many. Two benchmarks for success have pretty much been agreed upon by the tech wonks; it must cost less than the equivalent MacBook Air and people have to be able to buy one easily.
As we have seen, the price point is not great as the top tier manufacturers warned us it would be. By just barely matching Apple's prices on a new technology it gives Apple the chance to show off the maturity of their ultra-thin notebook lineup. If Intel had managed to better the pricing then there was a chance of some price conscious consumers at least giving the Ultrabook a try. Since all things are essentially equal between the two products, Apple users are probably just going to stick with what they know.
That price point also raised some reg flags, if manufactures are just barely able to match the competitors market prices it seems likely that their profit margin is taking a hit and the Ultrabooks are being sold on a thin margin just to ensure some will sell. If that were the case then you would expect to see limited initial runs of Ultrabooks from the major players in the industry and as of today we know that to be the reality. According to DigiTimes every single Intel Ultrabook partner is limiting their initial runs to under 50,000 units worldwide. That speaks volumes towards the confidence, or lack thereof, that these companies have in the financial success of the Ultrabook.
That leads directly to the second hurdle Intel faces; availability. No matter how fantastically paradigm breaking your product might be, if no one can buy one to find out for themselves then it won't survive in the marketplace. With under 50K available fom the four major top-tier vendors, it will be very hard to find an Ultrabook for sale or being demonstrated. That will kill the interest of consumers very quickly and could even trigger enough resentment to ensure that the Macbook Air remains the ultraportable of choice even if Intel's product might better the Apple product in certain ways.
"First-tier notebook brand vendors Acer, Lenovo, Toshiba and Asustek Computer, understanding that demand for notebooks is unlikely to recover in the fourth quarter, while Apple's products are taking up all the glory in the market, will limit their initial Ultrabook shipment volume to below 50,000 units for testing the water, according to sources from notebook makers.
To encourage its notebook brand partners, Intel will host a conference for Ultrabooks on September 14 in the hopes to resolve some technology bottlenecks and attract more notebook players to join the Ultrabook industry.
Acer, Toshiba, Lenovo and Asustek's new Ultrabook models will all start shipping in September and products will appear in the global retail channels in October. Acer's Ultrabook is manufactured by both Compal Electronics and Quanta Computer, while Toshiba's machine is outsourced to Compal with Lenovo's device handled by Wistron and Asustek's model by Pegatron Technology."
Here is some more Tech News from around the web:
- Ultrabook: Intel's $300 million plan to beat Apple at its own game @ Ars Technica
- Intel’s Dave Byrne and the state of the Solid State @ kitguru
- Intel reportedly plans to back off MeeGo OS @ DigiTimes
- Intel’s Ivy Bridge ‘delay’ rumors are laughable @ SemiAccurate
- Promise releases a Thunderbolt to fibre channel adaptor for Macs @ The Inquirer
- Space junk at 'tipping point', now getting worse on its own @ The Register
- Wicked Laser S3 Krypton Lightning Review: Holy Christ Now It’s Green and Goes Into Space @ Gizmodo
- iPhone 5 full specs detailed @ Tech-Reviews
- Coil gun revolver @ Hack a Day
- Nikon S2500 Review @ Tech-Reviews
- The next computing revolution will be televised @ The Tech Report
- MillionManLan 10 Event Coverage @ ThinkComputers
- The TR Podcast 95: Razer's Blade, Jobs retires, and a PC in your palm