Subject: Processors | August 15, 2011 - 10:45 AM | Tim Verry
Tagged: sandy bridge-e, Intel, hsf, cooling
We reported a few days ago that AMD is considering bunding a sealed loop water cooling solution with it's high end FX processors. In an interesting development, VR-Zone today stated that Intel will not be including any cooler at all with it's Sandy Bridge-E parts.
Specifically, Intel will not be bundling any processor cooler with its Core i7 Sandy Bridge-E 3820, 3930, or 3960X CPUs. These processors are rated at a 130 watt TDP; however, VR-Zone reports that the processors may in fact be drawing as much as 180 watts at stock speeds. This massive jump in power compared to previous models, if true, would make Intel's move to not include a cooler a good thing, as enthusiasts will almost certainly want a quality third part air cooler at least, and a proper water loop if any overclocking is involved. Enthusiasts especially have always opted to use an aftermarket cooler instead of the included Intel one as they have been notoriously noisy and mediocre in the performance department. While they are decent for stock speeds, overclockers have always demanded more than the Intel coolers could provide.
The situation is made all the more interested when paired against AMD's announcement; Intel has opted to not include any heatsink at all while AMD has opted to ratchet up the cooling performance with a sealed water loop. Personally, I find the two companies' reactions- because they are almost direct opposite solutions- very intersting and telling about the company mindset. Which solution do you like more, would you like the chip makers to ratchet up their stock cooling performance, or do you prefer the hands-off approach where they allow you to grab the cooler of your choice by not bundling anything in the processor box? Let us know in the comments!
Image Credit: Tim Verry. Used With Permission.
Subject: Processors | August 12, 2011 - 01:35 PM | Jeremy Hellstrom
Tagged: sandybridge, pentium, G850, Intel
Intel has updated the Pentium processor for the SandyBridge era with the 32nm G620, G840 and G850, all of which cost under $100. All are rated at 65W TDP with 3MB of level 3 cache, an integrated DDR3 memory controller, PCI Express 2.0 interface, Direct Media Interface 2.0, and Intel HD Graphics 2000. Legit Reviews tested the 2.9GHz G850 model and found no surprises, neither good nor bad. The Pentium line remains the workhorse model, perfect for office usage, web browsing and even watching movies. Those who make movies or want to do more than basic gaming are better off looking at an older LGA1156 processor or even a slightly more expensive Intel or AMD chip. If you've a relative that only needs a PC for light duty tasks, consider a system built around one of these new SandyBridge Pentiums.
"After trying out both the Intel Pentium G620 and Pentium G850 we must admit that we are still impressed by what these cost effective mainstream processors can do. Thanks to the powerful Intel 'Sandy Bridge' microarchitecture these dual-core processors don't run too far behind the more expensive offerings from Intel and AMD. You can find some pretty good deals on LGA775 and LGA1156 platforms right now, but the Intel Pentium series for LGA1155 has more features and as you could see in the performance tests they weren't that far behind in the benchmarks..."
Here are some more Processor articles from around the web:
- All Core i3 Models @ Hardware Secrets
- Intel Sandybridge 2500k @ XSreviews
- Intel Pentium G620 Sandy Bridge 2.6GHz CPU Review @ Legit Reviews
- Desktop CPU Comparison Guide @ TechARP
- AMD A6-3650 Llano APU Review @ Hardware Canucks
- AMD A6-3650 APU/Processor Review @ TechwareLabs
- AMD Fusion A8-3850 APU "Llano" On Linux @ Phoronix
Last week we were in Dallas, Texas covering Quakecon 2011 as well as hosting our very own PC Perspective Hardware Workshop. While we had over 1100 attendees at the event and had a blast judging the case mod contest, one of the highlights of the event is always getting to sit down with John Carmack and pick his brain about topics of interest. We got about 30 minutes of John's time over the weekend and pestered him with questions about the GPU hardware race, how Intel's intergrated graphics (and AMD Fusion) fit in the future of PCs, the continuing debate about ray tracing, rasterization, voxels and infinite detail engines, key technologies for PC gamers like multi-display engines and a lot more!
One of our most read articles of all time was our previous interview with Carmack that focused a lot more on the ray tracing and rasterization debate. If you never read that, much of it is still very relevant today and is worth reading over.
This year though John has come full circle on several things including ray tracing, GPGPU workloads and even the advantages that console hardware has over PC gaming hardware.
Subject: General Tech | August 11, 2011 - 02:27 PM | Ken Addison
Tagged: podcast, pcper, nvidia, msi, Intel, GTX580, amd
PC Perspective Podcast #165 - 8/11/2011
This week we talk about QuakeCon 2011, MSI's GTX580 Lightning, Intel 710 SSDs, Ultrabooks and more!
The URL for the podcast is: http://pcper.com/podcast - Share with your friends!
- iTunes - Subscribe to the podcast directly through the iTunes Store
- RSS - Subscribe through your regular
- MP3 - Direct download link to the MP3 file
Hosts: Ryan Shrout, Jeremy Hellstrom, Josh Walrath and Allyn Malventano
This Podcast is brought to you by
- 0:00:27 Introduction
- 1-888-38-PCPER or firstname.lastname@example.org
- http://twitter.com/ryanshrout and http://twitter.com/pcper
- 0:02:02 Quakecon 2011 and our Workshop - Postmortem
- 0:18:05 This Podcast is brought to you by
, and their all new Sandy Bridge Motherboards!
- 0:18:54 MSI N580GTX Lightning Xtreme Edition Review: What a GTX 580 Should Be
- 0:30:18 Antec High Current Gamer HCG-750 PSU Review
- 0:31:30 Samsung Galaxy Tab 10.1 Review - The Best Android Tablet?
- 0:32:16 Just Delivered Exclusive: PNY XLR8 Liquid Cooled GTX 580 Combo
- 0:36:40 Let us do some math, shall we? The cost of consoles
- 0:41:46 Intel 710 SSD Prices Leaked
- 0:47:40 ExpressCard trying to pull a (not so) fast one?
- 0:55:30 NVIDIA Outlines Multi-GPU and Cloud Graphics With Project Maximus and Virtual Graphics Technologies
- 1:06:50 Will Intel's Ultrabook form factor come with an integral Achilles Heel?
- 1:09:15 Hardware / Software Pick of the Week
- 1-888-38-PCPER or email@example.com
- http://twitter.com/ryanshrout and http://twitter.com/pcper
- 1:23:50 Closing
Subject: General Tech, Systems | August 10, 2011 - 10:23 PM | Scott Michaud
Tagged: ultrabook, Intel
Intel has this little platform that they are attempting to push against the world known as the Ultrabook, a category of ultra-thin and light laptops that range 11-inch to 17-inch screens with high performance and high price. The actual cost of an Ultrabook is somewhat hotly debated between Intel and others. On the Intel side of the fence, the claim for the cost of parts in an Ultrabook range between $475 and $710; this bill of materials comes days after manufacturers discussed component costs around the $1000 mark. To further push the Ultrabook platform, Intel just released a statement announcing a $300 million fund to invest in technologies that further the Ultrabook platform.
Is Intel getting themselves into a jackpot?
Intel described their intents with the fund in this snippet from their press release:
Ultrabooks will deliver a highly responsive and secure experience in a thin, light and elegant design and at mainstream prices. To help realize that vision, the Intel Capital Ultrabook Fund aims to invest in companies building hardware and software technologies focused on enhancing how people interact with Ultrabooks such as through sensors and touch, achieving all day usage through longer battery life, enabling innovative physical designs and improved storage capacity. The overall goal of the fund, which will be invested over the next 3-4 years, is to create a cycle of innovation and system capabilities for this new and growing category of mobile devices.
It looks as though Intel is putting their money where their mouth is. While $300 million is not exactly huge in the scale of Intel revenue it is a substantial sum and equal (less inflation) to what they used to back Centrino over eight years ago. While their last investment went to subsidizing wireless access points, marketing, and similar programs this investment should be mostly focused on the technology itself -- both hardware and software -- with battery, input, and interface specifically mentioned. Part of me muses about Meego in terms of the Ultrabook platform potentially even as a supplement to Windows. We shall see what Intel has in store for the platform that could, and bludgeoned forward with heaps of raw cash when it could not.
Subject: Storage | August 9, 2011 - 09:10 PM | Tim Verry
Tagged: ssd, mlc, Intel, hitachi, enterprise
Hitachi recently released a new enterprise class SSD based on Intel's 25nm MLC flash. Dubbed the Hitachi SSD400M, the new solid state drive is aimed at Enterprise users and Cloud data centers. It comes in the standard 2.5" form factor, features a SAS 6Gb/s interface, and will be available in 200GB and 400GB capacities.
As an enterprise drive, the Hitachi SSD400M supports end to end data protection, error correction, error handling and self encryption on certain models compliant with the Trusted Computing Group’s Enterprise A Security Subsystem Class encryption specification. Further showing it's intended usage as an Enterprise drive, the 25nm MLC based drive is rated for 7.3 Petabyte lifetime write, which Hitachi says amounts to 10 full drive writes per day for five years. Coincidentally, the warranty of the drive is a five year limited warranty or until the drive exceeds the maximum rated number of petabyte writes per capacity. Hitachi states that they expect a .44 annual failure rate and have projected a 2 million hour MTBF.
Performance of the drive is much better than that of the previously reported Intel drive, as it delivers 495MB/s sequential reads and 385MB/s sequential writes. The SSD is further rated at 56,000 read IOPS and 24,000 write IOPS.
The SSD400M has already shipped to various OEMs and will be available soon. More information on the new SSD can be found here.
According to VR-Zone, Intel's newest enterprise series 710 Lyndonville solid state drives (SSD) will be launching soon in a mid-august time frame, and will be carrying a price-per-gigabyte metric that only a corporate expense account could love.
The Intel 311. The 710 series will have the same 2.5" form factor.
The new drives will come in 100GB, 200GB, and 300GB capacities and will be priced at approximately $650, $1250, and $1900 USD respectively. Featuring 25mm eMLC HET, the drives feature 64MB of cache, user-controllable over-provisioning up to 20% (which helps drive longevity by reserving more of the drive for replacement of worn out cells), and a SATA II 3.0Gbps connection. The SATA 3Gbps connection is not likely to bottleneck the drive as it will only feature 270MB/s read and 210MB/s write speeds.
The eMLC HET flash chips are higher quality MLC chips that Intel hopes will provide enterprise level SLC enduring without the higher cost of the SLC chips. Interestingly, the drives only carry a 3 year warranty that is then further impacted by the state of the E9 wear level indicator so that the warranty expires once the three years are up or the E9 indicator reaches 1, whichever comes first. The consumer grade Intel 320 drives on the other hand carry a longer 5 year warranty.
My aging X-25 drive remembers the days when Intel pushed for driving down the cost of SSDs; however, does Intel still remember that goal?
Subject: General Tech, Mobile | August 5, 2011 - 02:00 PM | Tim Verry
Tagged: ultrabook.asus, Intel
Digitimes reported today that Intel will be meeting with its Original Design Manufacturer (ODM) partners in Taipei next week to discuss the Bill of Materials (BOM) that outlines the components to be used in Intel's Ultrabook notebook class. The goal of the meeting will be to tweak the Bill of Materials such that the initial selling price will be below $1,000 USD.
Intel has further broken up the Ultrabook category into two thickness classes of 18mm and 21mm. The 18mm reference designs, of which Intel has rendered five, have thus far omitted any optical drives. An example of the 18mm design can be seen in the upcoming Asus UX21 and UX31 ultrabooks. The proposed Bill of Materials for the 18mm ultrabooks is between $493 and $710 USD while the 21mm ultrabooks BOM is between $475 and $650 USD.
Beyond the Bill of Materials, the site notes that Intel is further planning to release next generation ultrabooks based on 22nm Ivy Bridge processors in 2012 and 22nm Haswell CPUs in 2013. These ultrabooks will come in sizes ranging from 11" to 17." The 11" to 13" models will have a thickness of 18mm while the 14" to 17" models will be of the 21mm variety.
Apple Insider notes that the push from Intel to keep the cost of materials and initial selling price for its ultrabooks below $1,000 may be due to the $999 entry level Macbook selling so well and Intel's desire to provide a competitive product that can match the thin-ness of the Mac notebooks and is priced to sell. Do you think Intel's ultrabooks will catch on with consumers, or will it be another niche and/or gimmick product?
Subject: General Tech | August 3, 2011 - 02:24 PM | Jeremy Hellstrom
Tagged: ultrabook, Intel
Look at that UX21 there, isn't it gorgeous? Only 1.1kg of brushed aluminium, fully kitted out with a new style lithium battery, is only 1.7cm thick and it has ASUS' Instant On technology which will boot you to desktop in 5 seconds. It was shown off as the shining example of what Intel's Ultrabook could be at this years CES and everyone who saw it loved it. It seemed that Intel was going to go straight to the core of Apple's ultra light market, not that their processors aren't already in Apple's MacBooks but it is nice to keep the PC partners happy as well.
DigiTimes has heard from a few manufacturers and are ready to add a large lead weight to the Ultrabook, the same weight that dragged down the CULV; namely price. When competing with Apple, the number one thing you need to do is beat them on price. You might be able to match their quality of design, or match them on the size of the notebook or even on the weight but the problem is that Apple was there first. Consumers know Apple's ultramobile platforms and have been using them for years, so if a newcomer tries stealing market share from Apple the only thing they cannot match is Apple's prices. The manufacturers that DigiTimes talked to placed the cost of the components they need to include to meet Intel's specfications are ~$1000, which is the market price of a lower end MacBook Air. Since businesses tend to like to make a bit of profit, as does everyone else in the supply chain, the cost of even a low end Ultrabook will be higher than an equivalent MacBook. Unless Intel is willing to drop prices, the Ultrabook will likely do even worse than the CULV, since at least the CULV had a mobile power user niche to crawl into and hide.
"While Intel is positioning ultrabook as a set of specifications to enable partners to design notebooks imitating MacBook Air, ultrabooks may encounter the same frustrations as CULV notebooks did if prices are not lower than those of the Air, according to sources from Taiwan-based supply chain makers.
The sources pointed out that Intel's ultrabook concept is not a brand new innovation, but a design to allow first-tier notebook players to quickly catch up with Apple's advances in the ultra-thin segment and help the notebook industry recover from the impact of tablet PCs.
Intel has been hosting conferences with the upstream notebook supply chain about its ultrabook since the second quarter and is providing suggestions and assistance in designing related components and methods for reducing costs. Ultrabooks will feature a similar design as MacBook Air and adopt li-polymer batteries, which will completely remove the device's capability of exchanging the battery, to significantly reduce weight, while the machine will adopt metal chassis for heat dissipation and a solid state drive (SSD).
In addition, all the components will be soldered on to the machine's PCB to save space and reduce weight, but the new methods will completely change the existing notebook production process of combining several modules together.
The sources pointed out that the new MacBook Airs are priced at about US$999-1,599 with rather strong demand in the US; however, designing an ultrabook based on Intel's technical suggestions will still be unable to reduce the machine's price level to lower than the MacBook Air's unless Intel is willing to reduce its prices, which already account for one-third of the total cost. If Intel does reduce its prices there is a chance for vendors to provide pricing below US$1,000."
Here is some more Tech News from around the web:
- Apple II+ retrocomputing with an FPGA @ ExtremeTech
- IE users are stupid report was faked @ The Inquirer
- Zero day bug threatens many WordPress sites @ The Register
- Google Patches 30 Chrome Bugs, Adds Instant Pages @ Slashdot
- Elpida starts producing 25nm DRAM chips @ The Inquirer
- IBM To Unveil Secure Open Wireless At Black Hat @ Slashdot
- Intel Sandy Bridge Speeds Up On Linux 3.1 Kernel @ Phoronix
- Compro IP70 Network camera @ Bjorn3D
- Real World Labs And Antec Joint Contest
Subject: General Tech, Processors | July 28, 2011 - 06:50 PM | Scott Michaud
Tagged: Sandy Bridge-EP, Intel
Since we got back together with Sandy B we have played a few games, made a couple home movies together, and went around travelling. Now that our extended vacation is over Sandy decided it is time to get a job. Sandy B was working part-time as a server and apparently like her job because Intel brought her to a job opening in Jaketown. Intel has apparently released details on their server product, Sandy Bridge-EP “Jaketown” that will debut in Q4, to replace the current server line of up-clocked desktop parts with disabled GPUs.
According to Real World Tech, Intel’s server component will contain up to 8 cores and sport PCI-Express 3.0 and Quick Path Interconnect 1.1. Rumors state that the highest-clocked component will run at up to 3GHz with the lowest estimated to be 2.66GHz. The main components of the CPU will be tied together with a ring bus, although unlike the original Sandy Bridge architecture the Sandy Bridge-EP ring will be bi-directional. Clock rates of the internal ring are not known but the bidirectional nature should decrease travelling distance of data by half on average. The L3 cache size is not known but is designed to be fast and low latency.
Intel looks to be really focusing this SKU down to be very efficient for the kinds of processes that servers require. There is no mention of the Sandy Bridge-EP containing a GPU, for instance, which should leave more options for highly effective x86 performance; at some point the GPU will become more relevant in the server market but Intel does not seem to think that today is that day. Check out the analysis at Real World Tech for more in-depth information.
Get notified when we go live!