Subject: General Tech | January 1, 2013 - 03:34 PM | Ryan Shrout
Tagged: tv, intel tv, intel media, Intel, google tv, CES, apple tv
How's this to set off your 2013 tech news? According to multiple reports and this rather lengthy one from GigaOm, Intel has a new division called Intel Media that is planning on launching a TV service this year. While it apparently will not be ready to show off at CES next week, "knowledgeable sources" make the GigaOm author quite confident that it will happen in the March time frame.
Running much like a stealth startup rather than the multi-billion dollar corporate entity that it is, a new division called Intel Media has been working on an Intel TV service that aims to beat Google and Apple to the goal of an on-demand, a-la-carte video. Running under a separate board of directors headed by Intel CEO Paul Otellini and content lead Eric Free among others, Intel Media has lofty goals.
Intel CEO Paul Otellini is pushing services on his way out
The base for this service will be an Intel produced and branded set top box that will be sold online and through retailers like Best Buy. Maybe something like the Intel Next Unit of Computing we tested in December? But Intel also plans to have access to the service on any screen including PCs, laptops, tablets and mobile devices. The GigaOm story didn't mention if this would run on iOS and Android devices but if the service is to stand a chance, it had better.
Building hardware is easy; the real challenge is in convincing content creators and owners to license the video for an "access anywhere" mindset. Even Apple hasn't been able to accomplish that and I would dare say they have more industry clout with media companies than Intel.
That will likely include an ambitious licensing play to secure content across all of these devices. Intel’s set-top box will offer access to third-party apps, but also TV content licensed by Intel — something that has been one of the key challenges of the project. Reuters and the Wall Street Journal detailed earlier this year how the company wanted to secure the right to stream individual TV channels over the internet, and Forbes reported this weekend that it will offer consumers the ability to subscribe to individual channels, as opposed to a big and expensive cable bundle.
Intel's desire to develop this service area isn't unexpected as the company has been wanting to get away from being known only as a "chip manufacturer" and move to a "platform provider." It's just hard to see what Intel will be able to do so much better than what Apple has done with the Apple TV or what Google did with the Google TV platforms. Intel has no successful operating system and would either have to go with a Windows platform (expensive), Android (what would stop other people for duplicating it) or something custom (not a good track record).
There are a lot more questions about what Intel Media is or could become than we have information to address. But Intel is hoping that the executive team they have assembled will have those answers. Personnel includes Erik Huggers who led the BBC iPlayer, Sean Ludick from Jawbone, Courtnee Westendorf who handled global marketing for Apple and several more. Intel wants to be prepared for a world that cares less about the silicon that powers devices and more about the software and services on those devices.
The goal of getting individual channels of live television and on-demand content without the need for huge cable and satellite bills is the goal of a modern media consumption society but there are very large organizations that would like to prevent it from happening. If Intel does in fact have the answer then I will be among the first to stand up and applaud (and pre-order). If we are merely getting an Android powered version of the AppleTV with Netflix and Amazon Prime streaming video, I'll pass.
Google TV had a lot of lofty goals and promise as well...
There is a lot more information and speculation on this Intel Media directive on the source GigaOm article, and I encourage you all to check it out. Personally I don't see how this could be successful without a dramatic shift from the other software moves that Intel has made in recent years. Remember AppUp? How about MeeGo? Exactly my point. It is understandable for a company as large as Intel to want to branch out and look for new growth opportunities but they have yet to prove they are capable of doing so successfully. And many would implore Intel to stay focused on the technology...
PC Perspective's CES 2013 coverage is sponsored by AMD.
Follow all of our coverage of the show at http://pcper.com/ces!
Subject: General Tech | December 20, 2012 - 03:16 PM | Ken Addison
Tagged: video, virtu, VIA, tegra 4, Samsung, radeon, podcast, nvidia, nvelo, nuc, lucid, Intel, hackintosh, gigabyte, Dataplex, arm, amd, 8000m
PC Perspective Podcast #231 - 12/20/2012
Join us this week as we talk about the Intel NUC, AMD 8000M GPUs, Building a Hackintosh and more!
The URL for the podcast is: http://pcper.com/podcast - Share with your friends!
- iTunes - Subscribe to the podcast directly through the Store
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- MP3 - Direct download link to the MP3 file
Hosts: Ryan Shrout, Josh Walrath, Allyn Malventano and Chris Barbere
Program length: 1:13:41
Podcast topics of discussion:
- 0:01:50 We are going to try Planetside 2 after the podcast!
- Week in Reviews:
- 0:32:35 This Podcast is brought to you by MSI!
News items of interest:
- 0:33:30 Cutting the Cord Complete!
- 0:36:10 VIA ARM-based SoCs in upcoming ASUS tablet
- 0:42:00 Lucid MVP 2.0 will be sold direct
- 0:44:50 Samsung acquires NVELO SSD Caching Software
- 0:49:00 AMD announces mobility 8000M series of GPUs
- 0:54:15 Some NVIDIA Tegra 4 Details
- 0:58:55 NEC Unveils Super Thin Ultrabook
- 1:00:30 Win a Sapphire HD 7870 GHz Edition FleX!!
- 1-888-38-PCPER or firstname.lastname@example.org
- http://twitter.com/ryanshrout and http://twitter.com/pcper
Subject: General Tech, Mobile | December 19, 2012 - 01:44 PM | Tim Verry
Tagged: ultrabook, nec, lavie x, Japan, Intel
NEC, a Japanese PC vendor has unveiled a new LaVie ultrabook–called the LaVie X–that is one of the thinnest on the market. The LaVie X measures 12.8mm thick and weighs 3.5 lbs. It will come pre-loaded with the full version of Windows 8 x64. On the outside, the LaVie X features an IPS display with a resolution of 1920x1080, a thin island-style keyboard, and a number of IO ports. Around the edges, the LaVie X has two USB 3.0 ports, an HDMI video output, and a SD card reader. Above the display is a 2MP camera for video conferencing. Interestingly, while the LaVie Y has a touchscreen, NEC decided to not include a touchscreen on the LaVie X ultrabook in order to maintain its thin form factor. Reportedly, the ultrabook will run for up to 7 hours on battery power.
Internal specifications include an Intel Core i7 3517U dual core processor running at 1.9GHz with HyperThreading support, 4GB of DDR3 RAM, and either a 128GB or 256GB solid state drive (SSD). It further has 802.11n Wi-Fi and Bluetooth 4.0 wireless radios.
While you will not be able to get this ultrabook stateside without importing it, it will be available in Japan on December 27th. The LaVie X with a 128GB SSD will cost 129,780 Yen, and the version with a 256GB SSD will cost 175,000 Yen. Not including any import fees, you are looking at approximately $1539.89 USD and $2076.41 USD respectively.
Read more about ultrabooks running Windows 8 at PC Perspective.
Intel Board Team Creates New Form Factor
In many ways the desktop computer needs to evolve. Yes, I know that PC gaming is not only thriving and growing but for the majority of consumers the need to have a box in their office that measures 2' x 3' x 1', taking up leg room under the desk is...exaggerated. Intel thinks they have a solution for this, a new form factor for a PC they are calling the NUC - Next Unit of Computing.
By utilizing low power versions of the Intel Ivy Bridge mobile processors Intel has shrunk the desktop PC to a size even smaller than mini-ITX and hopes they can address various market segments with this new design.
Check out our video right here and continue on for the full written review!
While the consumer that simply needs a basic computing box is definitely a target for Intel and its board division, they are hoping to hit the mainstream markets with interactive displays, digital signage, marketing, analytics and more. And though the design we are looking at today has a very specific form factor, the low power boards themselves could easily be placed into nearly any industrial design.
For a size reference, the Intel NUC is a 4-in x 4-in design that is noticeably smaller than even the mini-ITX form factor that is quickly becoming popular in the DIY markets. The NUC does not have a removable processor though so what you buy is what you get with only a few components that are upgradeable.
Subject: Processors | December 12, 2012 - 05:07 PM | Ryan Shrout
Tagged: haswell, Intel, i7-4770k
A (translated) report coming from VR-Zone shows a table that is giving us just a bit more information about the upcoming Intel Haswell architecture and processors.
First, it looks like Intel is going to lean into the same naming scheme for these parts calling them the Core i3/i5/i7 4000 series parts, starting with the Core i7-4770K as the highest end option. It will be a quad-core HyperThreaded part with a maximum Turbo Boost frequency of 3.9 GHz, very similar to the speeds and feed of today.
Graphics will be updated and called the HD 4600 with a clock rate as high as 1250 MHz. The memory controller will remain dual-channel with support for DDR3-1600.
The only other item worth mentioning is the 84 watt TDP, up from the 77 watt TDP of the current Ivy Bridge lineup.
All that is left to know now is ... pretty much everything including the performance of these new cores, the new graphics architecture and how that higher TDP will be utilized.
Subject: General Tech | December 11, 2012 - 07:48 PM | Jeremy Hellstrom
Tagged: 32nm, 22nm, tri-gate, Intel, atom, Avoton
Intel's Atom S1200 line of chips are obviously designed to compete with ARM's upcoming 64bit chips in the server room. The family of processors will all be under 10W TDP, with the top chip, the Atom S1260, which is a dual core 2GHz part that produces 8.5W. The three chips they have released are on the older 32nm process but according to EETimes you can expect new models using the 22nm tri-gate processors in the near future. From what The Register could find out Intel has not yet ruled out LGA models as well as the embedded chips you will be seeing first. They did pin down some more stats, with the new Atoms supporting DDR3 1333MHz and support eight lanes of PCI Express 2.0, what they will not be able to support on chip is network connectivity, these chips will still be at least partially dependent on other chips for some of their features so they are not truly an SoC, yet.
"CHIPMAKER Intel has released its Atom S1200 series aimed at low power single socket servers.
Intel's race to meet ARM in the low power server market has seen the firm push its Atom branded chips into sub-10W territory while supporting 64-bit memory addressing and ECC memory. Now the firm has released three dual-core chips that make up its Atom S1200 series, all sporting sub-10W TDP."
Here is some more Tech News from around the web:
- Asustek refutes rumors about adopting ARM platform from VIA @ DigiTimes
- TSMC and Global Foundries Plan Risky Process Jump As Intel Unveils 22nm SoC @ Slashdot
- Flexible graphene transistor breaks new records @ NanoTechWeb
- Valve chief confirms Steam-centric console-killing PC @ The Register
- New transistor tech could beat silicon and save Moore's Law @ The Register
- Dell tunes up servers for high freaky traders @ The Register
- Ninjalane Podcast - Forced Obsolescence, No More LGA? And Mainstream Watercooling
- IBM achieves 25Gbit/s photonics breakthrough @ The Inquirer
- Killer Wireless-N 1202 Mini PCIe NIC Review @ Hi Tech Legion
- AMD bites bullet, slashes chip orders @ The Register
- Modding article - How to build a tiny Arcade Cabinet based on a classic Nintendo hardware at Metku.net
- Simulating CRT or Vector displays for more realistic emulation @ Hack a Day
- Holiday 2012 Workstation Buyer's Guide @ AnandTech
- Stanley FatMax LEDLISL and HIDLISL Lithium-Ion Spotlight Double Review @ ModSynergy
- Win silent goodies with BeQuiet! decorate hardware! @ Kitguru
- The Tech Report's 2012 Christmas gift guide
Subject: General Tech | December 6, 2012 - 03:44 PM | Jeremy Hellstrom
DigiTimes reports that Intel continues to successfully shrink their process, with 14nm on schedule for about 12 months from now and aggressive shrinkage over the following years with 5nm being the plan for 2015. This is in line with GLOBAL FOUNDRIES who plan to have 14nm FinFET ready at about the same time and well ahead of both Samsung and TSMC. If that isn't far reaching enough for you, they plan to move to 18" wafers in 2017.
"At the end of 2013, Intel will enter the generation of 14nm CPUs (P1272) and SoCs (1273), while expanding its investments at its D1X Fab in Oregon, and Fab 42 in Arizona, the US and Fab 24 in Ireland, and will gradually enter 10nm, 7nm and 5nm process generations starting 2015."
Here is some more Tech News from around the web:
- AMD finishes its 'Piledriver' Opteron server chip rollout @ The Register
- Common Linux tools on Android without root by installing BusyBox @ Hack a Day
- MIPS processors go virtual @ The Inquirer
- Qualcomm, Sharp, Foxconn will become a new triangle chain in the industry, says Foxconn chairman @ DigiTimes
- NAND then something new came along: Nanotube men get $10m @ The Register
- Slash A THIRD off Surface RT price or it's toast, Microsoft told @ The Register
- McAfee AntiVirus Plus 2013 Review @ TechReviewSource
- Nero Kwik Overview and Tutorial @ Hi Tech Legion
- NETGEAR D6300 Wireless AC Modem Router and A6200 80211.ac USB Adapter Review @ HardwareHeaven
- ASUS EA-N66 & Amped SR20000G Wi-Fi Extender Review @ Legit Reviews
- New 25-GPU Monster Devours Strong Passwords In Minutes @ Slashdot
- 32 powerline adapters round-up: internet from your power grid @ Hardware.info
- Netgear WN1000RP 2.4GHz WiFi Booster @ eTeknix
- RC car transforms into RC robot @ Hack a Day
- Seasonic Christmas Platinum Giveaway – win PSUs and more! @ Kitguru
Subject: Processors | December 6, 2012 - 01:21 PM | Ryan Shrout
Tagged: socket, BGA, Intel, amd
Okay, so this has been an interesting debate. After the first rumors and reports that Intel might be killing the DIY PC (or at least crippling it) by removing the socketed option for future processors after the Broadwell architecture, the Internet had a hissy-fit. Josh debated here that the future didn't look at that bleak at all and AMD chimed in later with its commitment to sockets into 2014 and beyond.
It looks like Intel has officially addressed the issue through a story at MaximumPC.com:
Intel remains committed to the growing desktop enthusiast and channel markets, and will continue to offer socketed parts in the LGA package for the foreseeable future for our customers and the Enthusiast DIY market. However, Intel cannot comment on specific long-term product roadmap plans at this time, but will disclose more details later per our normal communication process.
While those in the community that see the glass half empty will look at Intel's use of "foreseeable future" as a red herring, we have to at least attempt to take Intel at its word until any more details might be released to counter it.
Let the debate continue!
Subject: Cases and Cooling | December 6, 2012 - 12:57 AM | Tim Verry
Tagged: waterproof, stealth, PC, nettop, Intel, desktop, atom d525
Stealth has debuted a new rugged and waterproof computer called the WPC-525F. The nettop-like system is a ruggedized small form factor PC powered by Intel’s Atom D525 processor and ICH8M chipset. IP67/NEMA 6 rated, the company states that the WPC-525F is dust, rain, and splash resistant as well as, allegedly, being capable of being run over by a pickup truck and continuing to function.
If only the tire tread came as a standard silkscreen option...
On the outside, the WPC-525F is a black box with covered ports on the rear, a VESA mount on the bottom, and a power button on the front. Simple enough. Dimensions are 10.15” (W) x 6.22” (D) x 2.04” (H) (258x158x52mm), and it weighs 5.1 pounds without cables. Interestingly, instead of typical ports, it has water resistant “Bayonet” connections with cables that lead away from the back of the PC to the devices. With all the cables connected, you get the following IO options:
4 x USB 2.0
2 x RJ45 LAN (Gigabit Ethernet)
1 x RS232 serial
1 x VGA
1 x Power
It can accept 6 to 36V DC input for power. According to Stealth, the entire system will consume 16W when idle and 19W under full load.
The outside of the Stealth WPC-525F is impressive, but the internals are certainly not as flashy. It features an Intel Atom D525 dual core processor clocked at 1.8GHz (1MB cache), 4GB DDR3 RAM, and a 120GB MLC SSD. The board also includes two internal Mini-PCIe expansion slots. For video, the computer uses the onboard Intel GMA 3150. As implied by the ports listed above, there is no audio support on the WPC-525F, though you could add a USB sound card if it was really needed.
The WPC-525F is fanless and uses the aluminum chassis to facilitate cooling. The ruggedized PC is available now with a starting price of $1595 USD. (Keep in mind that that is without an OS or AC power adapter.) You can find more photos and specifications on the product page.
Subject: Processors | December 5, 2012 - 05:33 PM | Ryan Shrout
Tagged: socket, Intel, BGA, amd
Over the past week or more we have been seeing a lot of news about Intel's rumored move to leave the world of socket-based processors behind after the pending Broadwell parts are released as BGA - ball grid array - and are soldered to motherboards directly. I would highly encourage everyone to read Josh's thoughts on the subject that are not nearly as damning as others might have you believe.
However, we got this official note from AMD earlier in the week that I thought I would share:
AMD has a long history of supporting the DIY and enthusiast desktop market with socketed CPUs & APUs that are compatible with a wide range of motherboard products from our partners. That will continue through 2013 and 2014 with the “Kaveri” APU and FX CPU lines. We have no plans at this time to move to BGA only packaging and look forward to continuing to support this critical segment of the market.
As the company that introduced new types of BGA packages in ultrathin platforms several years ago, and today offers BGA-packaged processors for everything from ultrathin notebooks to all-in-one desktops, to embedded applications and tablets, we certainly understand Intel’s enthusiasm for the approach. But for the desktop market, and the enthusiasts with whom AMD has built its brand, we understand what matters to them and how we can continue to bring better value and a better experience.
Obviously AMD is trying to persuade PC builders that not only is its path the safest in the future but maybe that supporting AMD today might help make sure it can arrive to the future well enough to continue the enthusiast path.
If Intel even starts to heavily side with BGA processors, is a move to AMD in your future again? Leave your thoughts in the comments below!