Subject: General Tech, Systems | August 28, 2014 - 12:27 AM | Scott Michaud
Tagged: Intel, nuc, Broadwell
The Intel NUC is their small computing form factor, packing what is equivalent to an Ultrabook into a chassis that is smaller than a CD spool. The first release came with Ivy Bridge and it was refreshed with Haswell about a year later. FanlessTech has got a hold a... semi-redacted (?)... slideshow presentation that outlines various models and features. Six models are expected, spread out between Q4 2014 (Haswell), Q1 2015 (Broadwell Core iX), and Q2 2015 (Broadwell Celeron).
Note that a typical Intel NUC contains fans, although the company has released a fanless Bay Trail-based model (and third parties have made their own, custom cooled models based on the form factor). I expect that FanlessTech covers it for those two reasons; it does not mean that these models will be passively cooled. In fact, the product matrix claims that none of these new products will be.
The six models are broken into three code names.
Both Maple Canyon and Rock Canyon cover the Core i3 and i5 processor segments. Both include NFC, an optional 2.5" drive, four external USB 3.0 ports, LAN, a SATA 3 port, and so forth. They begin to diverge in terms of display outputs, however. Rock Canyon, which is targeted at home theater, home office, and gaming, includes one mini HDMI (1.4a) and one mini DisplayPort (1.2) output. Maple Canyon, on the other hand, includes two mini DisplayPort (version unknown, probably also 1.2) connections. While I do not have a slide for Maple Canyon, replacing the mini HDMI for a mini DisplayPort suggests that it will be targeted more at kiosks and other situations where monitors, rather than TVs, will be used.
One Haswell Core i5-based Maple Canyon NUC is expected for Q4 2014. Maple Canyon with Broadwell Core i3, Maple Canyon with Broadwell Core i5, Rock Canyon with Broadwell Core i3, and Rock Canyon with Broadwell Core i5 are all expected in Q1 2015. All models will accept up to two DIMMs of memory (16 GB max).
Only one Pinnacle Canyon model is listed. It will be based on Broadwell Celeron, allow up to 8 GB of memory (1 DIMM), and include four USB 3.0 ports (external). Its display configuration is significantly different from Rock Canyon and Maple Canyon, however. It will have one, full-sized HDMI (1.4a) and one VGA output. It will launch in Q2 2015.
For more information, check out the slides at FanlessTech.
Subject: Processors | August 26, 2014 - 05:32 PM | Jeremy Hellstrom
Tagged: rumour, leak, Intel, Haswell-E, 5960X, 5930K, 5820K
Take it with a grain of salt as always with leaks of these kind but you will be interested to know that videocardz.com has what might be some inside information on Haswell-E pricing and model numbers.
Intel i7 / X99 Haswell-E pricing:
- Intel Core i7 5960X 8C/16HT – 40-lane PCI-Express support (x16 + x16 + x8) — $999
- Intel Core i7 5930K 6C/12HT – 40-lane PCI-Express support (x16 + x16 + x8) — $583
- Intel Core i7 5820K 6C/12HT – 28-lane PCI-Express support (x16 + x8 + x4) —– $389
As you can see there is a big jump between the affordable i7-5820K and the more expensive 5930K. For those who know they will stick with a single GPU or two low to mid-range GPUs the 5820K should be enough for you but if you have any thoughts of upgrading or adding in a number of PCIe SSDs then you might want to seriously consider saving up for the 5930K. Current generation GPUs and SSDs are not fully utilizing PCIe 3.0 16x but that is not likely to remain true for long so if you wish for your system to have some longevity this is certainly something you should think long and hard about. Core counts are up while frequencies are down, the 8 core 5960X has a base clock of 3GHz, a full gigahertz slower than the 4790K but you can expect the monstrous 20MB cache and quad-channel DDR4-2133 to mitigate that somewhat. Also make sure to note that TDP, 140W is no laughing matter and will require some serious cooling.
Since the introduction of the Haswell line of CPUs, the Internet has been aflame with how hot the CPUs run. Speculation ran rampant on the cause with theories abounding about the lesser surface area and inferior thermal interface material (TIM) in between the CPU die surface and the underside of the CPU heat spreader. It was later confirmed that Intel had changed the TIM interfacing the CPU die surface to the heat spreader with Haswell, leading to the hotter than expected CPU temperatures. This increase in temperature led to inconsistent core-to-core temperatures as well as vastly inferior overclockability of the Haswell K-series chips over previous generations.
A few of the more adventurous enthusiasts took it upon themselves to use inventive ways to address the heat concerns surrounding the Haswell by delidding the processor. The delidding procedure involves physically removing the heat spreader from the CPU, exposing the CPU die. Some individuals choose to clean the existing TIM from the core die and heat spreader underside, applying superior TIM such as metal or diamond-infused paste or even the Coollaboratory Liquid Ultra metal material and fixing the heat spreader back in place. Others choose a more radical solution, removing the heat spreader from the equation entirely for direct cooling of the naked CPU die. This type of cooling method requires use of a die support plate, such as the MSI Die Guard included with the MSI Z97 XPower motherboard.
Whichever outcome you choose, you must first remove the heat spreader from the CPU's PCB. The heat spreader itself is fixed in place with black RTV-type material ensuring a secure and air-tight seal, protecting the fragile die from outside contaminants and influences. Removal can be done in multiple ways with two of the most popular being the razor blade method and the vise method. With both methods, you are attempting to separate the CPU PCB from the heat spreader without damaging the CPU die or components on the top or bottom sides of the CPU PCB.
Subject: General Tech, Processors | August 24, 2014 - 07:33 AM | Scott Michaud
Tagged: Intel, Haswell-E, Ivy Bridge-E, haswell, solder, thermal paste
Sorry for being about a month late to this news. Apparently, someone got their hands on an Intel Core i7-5960X and they wanted to see its eight cores. Removing the lid, they found that it was soldered directly onto the die with an epoxy, rather than coated with a thermal paste. While Haswell-E will still need to contend with the limitations of 22nm, and how difficult it becomes to exceed various clockspeed ceilings, the better ability to dump heat is always welcome.
Image Credit: OCDrift
While Devil's Canyon (Core i7 4970K) used better thermal paste, the method used with Haswell-E will be event better. I should note that Ivy Bridge-E, released last year, also contained a form of solder under its lid and its overclocking results were still limited. This is not an easy path to ultimate gigahertz. Even so, it is nice that Intel, at least on their enthusiast line, is spending that little bit extra to not introduce artificial barriers.
Subject: Motherboards | August 24, 2014 - 03:45 AM | Tim Verry
Tagged: X99, socket 2011-3, Intel, Haswell-E, evga, ddr4, classified
As Intel's next generation enthusiast desktop platfom gets closer to fruition, several leaks (such as Gigabyte's X99 manual) and motherboard teasers have surfaced on the Internet. A few days ago, EVGA posted a teaser photograph of an upcoming "next generation" Micro ATX motherboard on its Instagram page.
The so-called EVGA X99 Micro is set to be the company's smallest Classified-branded X99 chipset offering supporting multiple graphics cards, DDR4 memory, and (of course) Intel's upcoming Haswell-E processors. The all-black motherboard features black heatsinks over the PCH and power delivery hardware. It is outfitted with a 10-phase VRM that feeds the CPU socket (socket 2011-3), two DDR4 memory sockets on each side of the processor socket, three PCI-E 3.0 x16 slots (just enough to max out a Core i7-5820K), one M.2 connector, and six SATA III 6Gbps ports. The board will support USB 3.0 and USB 2.0 ports, but beyond that it is difficult to say what the exact rear IO port configuration will be as a metal shield blocks off the ports in the teaser photo. There is an eight pin CPU power connector along with a 24-pin ATX connector for getting power to the board. Overclockers will be further pleased to see physical power and reset buttons.
According to Maximum PC, this pint sized Classified motherboard will be priced around $250 USD making it one of the most expensive mATX motherboards around. As part of EVGA's Classified series, it should be packing plenty of overclocking friendly features in the UEFI firmware and hardware build quality. This could make for one heck of a powerful small form factor system though, and I'm looking forward to seeing what people are able to get out of this board (especially when it comes to overclocking Haswell-E)!
Subject: General Tech, Processors | August 23, 2014 - 05:38 AM | Scott Michaud
Tagged: X99, Intel, Haswell-E
Haswell-E, with its X99 chipset, are expected to launch soon. This will bring a new spread of processors and motherboards to the high-end, enthusiast market. These are the processors that fans of Intel should buy if they have money, want all the RAM, and have a bunch of PCIe expansion cards to install.
If you count the PCIe x1 slots, the table would refer to the first, third, fifth, and seventh slots.
To me, this is not too bad. You are able to use three GPUs with eight-lane bandwidth and stick a four-lane PCIe SSD on the last slot. Considering that each lane is PCIe 3.0, it is similar to having three PCIe 2.0 x16 slots. While two-way and three-way SLI is supported on all CPUs, four-way SLI is only allowed with processors that provide forty lanes of PCIe 3.0.
Gigabyte also provides three PCIe 2.0 x1 slots, which are not handled by the CPU and do not count against its available lanes.
Since I started to write up this news post, Gigabyte seems to have replaced their manual with a single, blank page. Thankfully, I was able to have it cached long enough to finish my thoughts. Some sites claim that the manual failed to mention the 8-8-8 configuration and suggested that configurations of three GPUs were impossible. That is not true; the manual refers to these situations, just not in the most clear of terms.
Haswell-E should launch soon, with most rumors pointing to the end of the month.
Subject: Motherboards | August 22, 2014 - 06:26 PM | Jeremy Hellstrom
Tagged: Z97-A, lga 1150, Intel, asus
At $145 the ASUS Z97-A is an inexpensive base for a system and yet it still offers quite a few higher end features. Three PCIe 3.0 16x slots that support Crossfire and SLI along with a pair of both PCIe 2.0 1x and legacy PCI slots allow for a variety of configurations. The half dozen SATA 6Gbps ports are simply expected now but the addition of an M.2 port is a welcome enhancement. When [H]ard|OCP overclocked their 4790K in this board they could almost hit 4.8GHz but ended up with 4.7GHz as the best overclock which makes it perfect for the price conscious consumer. Read their full review of this Gold winning motherboard here.
"While ASUS is usually known for motherboards like the Maximus and Rampage Extreme series’ or even feature rich solutions like the Z97-Deluxe it is motherboards like the Z97-A that are ASUS’ bread and butter. Shopping for an inexpensive motherboard doesn’t have to mean accepting poor quality feature stripped solutions."
Here are some more Motherboard articles from around the web:
- ASUS Z97-Deluxe & Z97-A Review @ OCC
- Biostar Hi-Fi Z97WE @ Kitguru
- ASUS Z97I-PLUS ITX Motherboard Review @ Hardware Canucks
- Gigabyte Z97X Gaming G1 Motherboard Review @ Hardware Asylum
- MSI Z97 XPOWER AC - Extreme Overclocking for the new Haswell @ Bjorn3d
- MSI Z97 Gaming 9 AC – MSI’s top tier gaming offering @ Bjorn3d
- Gigabyte GA-Z97X-Gaming 3 @ X-bit Labs
- MSI Z97 MPOWER @ X-bit Labs
- MSI Z97 XPower AC @ [H]ard|OCP
Subject: General Tech | August 21, 2014 - 04:50 PM | Ken Addison
Tagged: podcast, corsair, angelbird, wrk, ddr4, freesync, gsync, nvidia, amd, Intel, titan-z, VIA, video
PC Perspective Podcast #314 - 08/21/2014
Join us this week as we discuss the Corsair Air 240 Case, Angelbird SSD wrk, DDR4 Pricing, and more!
The URL for the podcast is: http://pcper.com/podcast - Share with your friends!
- iTunes - Subscribe to the podcast directly through the Store
- RSS - Subscribe through your regular RSS reader
- MP3 - Direct download link to the MP3 file
Hosts: Ryan Shrout, Jeremy Hellstrom, Josh Walrath, and Allyn Malventano
NVIDIA Live Stream Friday at noon
Week in Review:
Last Weeks Winner: Brian H.
News items of interest:
Hardware/Software Picks of the Week:
Josh: Just a nice, solid LCS.
Subject: General Tech | August 20, 2014 - 04:35 PM | Jeremy Hellstrom
Tagged: galileo, Intel, windows, SoC
Intel's first generation low powered SoC which goes by the name of Galileo and is powered by a 400MHz Quark X1000 is now capable of running Windows with the help of the latest firmware update. Therefore if you are familiar enough with their tweaked Arduino IDE you should be able to build a testbed for low powered machines that will be running Windows. You will want to have some time on hand, loading Windows to the microSD card can take up to two hours and those used to SSDs will be less than impressed with the boot times. For developers this is not an issue and well worth the wait as it gives them a brand new tool to work with. Pop by The Register for the full details of the firmware upgrade and installation process.
"Windows fans can run their OS of choice on Intel’s counter to Raspberry Pi, courtesy of an Intel firmware update."
Here is some more Tech News from around the web:
- Samsung Smartcam HD Pro @ The Inquirer
- Netgear R8000 Nighthawk X6 AC 3200 Tri-Band WiFi Router Review @ Legit Reviews
- Chinese Linux Trojan makes the jump to Windows @ The Inquirer
- Tech patent hoarder Intellectual Ventures to lose a fifth of its trolls @ The Register
Subject: General Tech, Graphics Cards, Shows and Expos | August 16, 2014 - 12:33 AM | Scott Michaud
Tagged: siggraph 2014, Siggraph, OpenGL Next, opengl 4.5, opengl, nvidia, Mantle, Khronos, Intel, DirectX 12, amd
Let's be clear: there are two stories here. The first is the release of OpenGL 4.5 and the second is the announcement of the "Next Generation OpenGL Initiative". They both occur on the same press release, but they are two, different statements.
OpenGL 4.5 Released
OpenGL 4.5 expands the core specification with a few extensions. Compatible hardware, with OpenGL 4.5 drivers, will be guaranteed to support these. This includes features like direct_state_access, which allows accessing objects in a context without binding to it, and support of OpenGL ES3.1 features that are traditionally missing from OpenGL 4, which allows easier porting of OpenGL ES3.1 applications to OpenGL.
It also adds a few new extensions as an option:
ARB_pipeline_statistics_query lets a developer ask the GPU what it has been doing. This could be useful for "profiling" an application (list completed work to identify optimization points).
ARB_sparse_buffer allows developers to perform calculations on pieces of generic buffers, without loading it all into memory. This is similar to ARB_sparse_textures... except that those are for textures. Buffers are useful for things like vertex data (and so forth).
ARB_transform_feedback_overflow_query is apparently designed to let developers choose whether or not to draw objects based on whether the buffer is overflowed. I might be wrong, but it seems like this would be useful for deciding whether or not to draw objects generated by geometry shaders.
KHR_blend_equation_advanced allows new blending equations between objects. If you use Photoshop, this would be "multiply", "screen", "darken", "lighten", "difference", and so forth. On NVIDIA's side, this will be directly supported on Maxwell and Tegra K1 (and later). Fermi and Kepler will support the functionality, but the driver will perform the calculations with shaders. AMD has yet to comment, as far as I can tell.
Image from NVIDIA GTC Presentation
If you are a developer, NVIDIA has launched 340.65 (340.23.01 for Linux) beta drivers for developers. If you are not looking to create OpenGL 4.5 applications, do not get this driver. You really should not have any use for it, at all.
Next Generation OpenGL Initiative Announced
The Khronos Group has also announced "a call for participation" to outline a new specification for graphics and compute. They want it to allow developers explicit control over CPU and GPU tasks, be multithreaded, have minimal overhead, have a common shader language, and "rigorous conformance testing". This sounds a lot like the design goals of Mantle (and what we know of DirectX 12).
And really, from what I hear and understand, that is what OpenGL needs at this point. Graphics cards look nothing like they did a decade ago (or over two decades ago). They each have very similar interfaces and data structures, even if their fundamental architectures vary greatly. If we can draw a line in the sand, legacy APIs can be supported but not optimized heavily by the drivers. After a short time, available performance for legacy applications would be so high that it wouldn't matter, as long as they continue to run.
Add to it, next-generation drivers should be significantly easier to develop, considering the reduced error checking (and other responsibilities). As I said on Intel's DirectX 12 story, it is still unclear whether it will lead to enough performance increase to make most optimizations, such as those which increase workload or developer effort in exchange for queuing fewer GPU commands, unnecessary. We will need to wait for game developers to use it for a bit before we know.