Subject: General Tech | August 7, 2014 - 12:45 PM | Jeremy Hellstrom
Tagged: HPC, amd, firepro, S9150, S9050, opencl
The new cooling on the 290X tends to have it at the top of the gaming charts and with the impending release of two new FirePro HPC cards AMD looks to take the productivity title away from the Tesla K40. The higher end S9150 boasts 16GB GDDR5 memory with a 512-bit memory interface, 44 GCN compute units with 64 stream processors each there is a total of 2816 stream processors on board. That equates to 5.07 TFLOPS peak single-precision 2.53 TFLOPS peak double-precision performance with theoretical memory bandwidth of 320GB per second. AMD expects the S9150 to have support for OpenCL 2.0 drivers by the end of the year, which the lower priced and specced S9050 will not though both will support AMD Stream technology and OpenCL 1.2. Check them out at The Register.
"The company's new big gun is the FirePro S9150 card, which maxes out at a blistering 5.07 TFLOPS peak single-precision floating-point performance and 2.53 TFLOPS peak double-precision performance."
Here is some more Tech News from around the web:
- How to Choose the Best Linux Desktop for You @ Linux.com
- nCrypted Cloud brings client side integration to Dropbox, Microsoft Onedrive @ The Inquirer
- IBM can't give away its chip business: report @ The Register
- Testing VR Limits with a Raspberry Pi @ Hack a Day
- Google Will Give a Search Edge To Websites That Use Encryption @ Slashdot
- OpenSSL receives nine post-Heartbleed critical bug fixes @ The Inquirer
- Now even Internet Explorer will throw lousy old Java into the abyss @ The Register
- Striker Capsule Task Light @ Benchmark Reviews
- Almost $1K worth of prizes up for grabs in our haiku contest @ The Tech Report
Subject: General Tech | July 2, 2014 - 02:58 PM | Jeremy Hellstrom
Tagged: HPC, ISS
The Register visited this years ISS and snapped some pictures of the hardware that was on display. There were a lot of storage solutions being demonstrated like the Silent Brick Library from Fast LTA which offers an alternative to tape archives with the ability to can hold up to 60TB of uncompressed data with 12 bricks in a rack mounted device. Samsung had a brief presentation on 3D V-NAND but did not reveal anything new about their new type of NAND. AMD showed off their new W9100 FirePro and quite a few vendors, Intel included, are increasing their usage of watercooling in racks. Click over to see the latest expensive HPC gear.
"The International Supercomputer Show in Leipzig, Germany, was full of fascinating things at the high-end grunt front of the computing business. Here's what attracted this roving hack's eye."
Here is some more Tech News from around the web:
- Memcapacitors could make our computers faster @ Nanotechweb
- Bug In Fire TV Screensaver Tears Through 250 GB Data Cap @ Slashdot
- Samsung/Globalfoundries team reportedly lands 14nm orders from Qualcomm, Apple @ DigiTimes
- Microsoft releases test patch to address Windows 8.1 update woes @ The Inquirer
- Using Android 4.3? Don't let malware snatch your private login keys @ The Register
- ARM tears apart the LG G Watch and Samsung Gear Live @ The Inquirer
- Third Person Perspective is Guaranteed to Mess With Your Senses @ Hack a Day
- WiME Wi-Watch M5 Smartwatch Review @ TechwareLabs
- Silicon Power Worldwide Joint Giveaway @ NikKTech
Subject: General Tech | December 9, 2013 - 12:47 PM | Jeremy Hellstrom
Tagged: interconnect, fibre optics, 32 Gbps, HPC
With new emphasis on building modular HPC machines from multitudes of low powered processors working in parallel interconnect technology needs to provide immense amounts of bandwidth. This is becoming much closer to reality as 32 Gbps channel is undergoing standardization and will likely be quickly accepted and certified. Products using this standard are still a year or more from market but will likely be quickly adopted by companies who depend on large arrays of VMs. According to the roadmap on The Register 64 Gbps is already starting development with 2016 as a possible goal for its standardization process to begin.
"The Association has let it be known that the “INCITS T11 standards committee has recently completed the Fibre Channel Physical Interface - sixth generation (FC-PI-6) industry standard for specifying 32 Gigabit per second (Gbps) Fibre Channel and will forward it to the American National Standards Institute (ANSI) for publication in the first quarter of 2014."
Here is some more Tech News from around the web:
Subject: General Tech, Storage | July 18, 2013 - 04:56 PM | Scott Michaud
Tagged: Raspberry Pi, nvidia, HPC, amazon
Adam DeConinck, high performance computing (HPC) systems engineer for NVIDIA, built a personal computer cluster in his spare time. While not exactly high performance, especially when compared to the systems he maintains for Amazon and his employer, its case is made of Lego and seems to be under a third of a cubic foot in volume.
Image source: NVIDIA Blogs
Raspberry Pi is based on a single-core ARM CPU bundled on an SoC with a 24 GFLOP GPU and 256 or 512 MB of memory. While this misses the cutesy point of the story, I am skeptical of the expected 16W power rating. Five Raspberry Pis, with Ethernet, draw a combined maximum of 17.5W, alone, and even that neglects the draw of the networking switch. My, personal, 8-port unmanaged switch is rated to draw 12W which, when added to 17.5W, is not 16W and thus something is being neglected or averaged. Then again, his device, power is his concern.
Despite constant development and maintenance of interconnected computers, professionally, Adam's will for related hobbies has not been displaced. Even after the initial build, he already plans to graft the Hadoop framework and really reign in the five ARM cores for something useful...
... but, let's be honest, probably not too useful.
Subject: Systems | June 3, 2013 - 09:27 PM | Tim Verry
Tagged: Xeon Phi, tianhe-2, supercomputer, Ivy Bridge, HPC, China
A powerful new supercomputer constructed by Chinese company Inspur is currently in testing at the National University of Defense Technology. Called the Tianhe-2, the new supercomputer has 16,000 compute nodes and approximately 54 Petaflops of peak theoretical compute performance.
Destined for the National Supercomputer Center in Guangzhou, China, the open HPC platform will be used for education and research projects. The Tianhe-2 is composed of 125 racks with 128 compute nodes in each rack.
The compute nodes are broken down into two types: CPM and APU modules. One of each node type makes up a single compute board. The CPM module hosts four Intel Ivy Bridge processors, 128GB system memory, and a single Intel Xeon Phi accelerator card with 8GB of its own memory. Each APU module adds five Xeon Phi cards to every compute board. The compute boards (a CPM module + a APU module) contain two NICs that connect the various compute boards with Inspur's custom THExpress2 high bandwidth interconnects. Finally, the Tianhe-2 supercomputer will have access to 12.4 Petabytes of storage that is shared across all of the compute boards.
In all, the Tianhe-2 is powered by 32,000 Intel Ivy Bridge processors, 1.024 Petabytes of system memory (not counting Phi dedicated memory--which would make the total 1.404 PB), and 48,000 Intel Xeon Phi MIC (Many Integrated Cores) cards. That is a total of 3,120,000 processor cores (though keep in mind that number is primarily made up of the relatively simple individual Phi cores as there are 57 cores to each Phi card).
Inspur claims up to 3.432 TFlops of peak compute performance per compute node (which, for simplicity they break down as one node is 2 Ivy Bridge chips, 64GB memory, and 3 Xeon Phi cards although the two compute modules that make up a node are not physically laid out that way) for a total theoretical potential compute power of 54,912 TFlops (or 54.912 Petaflops) across the entire supercomputer. In the latest Linpack benchmark run, researchers saw up to 63% efficiency in attaining peak performance -- 30.65 PFlops out of 49.19 PFlops peak/theoretical performance -- when only using 14,336 nodes with 50GB RAM each. Further testing and optimization should improve that number, and when all nodes are brought online the real world performance will naturally be higher than the current benchmarks. With that said, the Tianhe-2 is already besting Cray's TITAN, which is promising (though I hope Cray comes back next year and takes the crown again, heh).
In order to keep all of this hardware cool, Inspur is planning a custom liquid cooling system using chilled water. The Tianhe-2 will draw up to 17.6 MW of power under load. Once the liquid cooling system is implemented the supercomputer will draw 24MW while under load.
This is an impressive system, and an interesting take on a supercomputer architecture considering the rise in popularity of heterogeneous architectures that pair massive numbers of CPUs with graphics processing units (GPUs).
The Tianhe-2 supercomputer will be reconstructed at its permanent home at the National Supercomputer Center in Guangzhou, China once the testing phase is finished. It will be one of the top supercomputers in the world once it is fully online! HPC Wire has a nice article with slides an further details on the upcoming processing powerhouse that is worth a read if you are into this sort of HPC stuff.
Also read: Cray unveils the TITAN supercomputer.
Subject: General Tech | April 24, 2013 - 01:38 PM | Jeremy Hellstrom
Tagged: Steve Scott, nvidia, HPC, tesla, logan, tegra
The Register had a chance to sit down with Steve Scott, once CTO of Cray and now CTO of NVIDIA's Tesla projects to discuss the future of their add-in cards as well as that of x86 in the server room. They discussed Tegra and why it is not receiving the same amount of attention at NVIDIA as Tegra is, as well as some of the fundamental differences in the chips both currently and going forward. NVIDIA plans to unite GPU and CPU onto both families of chips, likely with a custom interface as opposed to placing them on the same die, though both will continue to be designed for very different functions. A lot of the article focuses on Tegra, its memory bandwidth and most importantly its networking capabilities as it seems NVIDIA is focused on the server room and providing hundreds or thousands of interconnected Tegra processors to compete directly with x86 offerings. Read on for the full interview.
"Jen-Hsun Huang, co-founder and CEO of Nvidia has been perfectly honest about the fact that the graphics chip maker didn't intend to get into the supercomputing business. Rather, it was founded by a bunch of gamers who wanted better graphics cards to play 3D games. Fast forward two decades, though, and the Nvidia Tesla GPU coprocessor and the CUDA programming environment have taken the supercomputer world by storm."
Here is some more Tech News from around the web:
- AMD pins future growth to embedded marketplace @ The Register
- AMD announces new embedded G-series SoC @ DigiTimes
- TSMC captures almost 50 percent of foundry market thanks to 28nm demand @ The Inquirer
- $45 BeagleBone Black Keeps Eyes on the Pi's @ Linux.com
- BlackBerry OS 10.1 leaks its secret goo over all the web @ The Register
- Samsung MV900F Wi-Fi 16.3MP Digital Camera Review @ ModSynergy
- i’m Watch: A Smartwatch Review @ TechwareLabs
Subject: General Tech | April 10, 2013 - 04:14 PM | Tim Verry
Tagged: xeon-ex, xeon-ep, xeon, server, Intel, HPC, haswell
Intel officially announced its next-generation Xeon processors at IDF Beijing today. The new lineup includes the Haswell-based Xeon E3 1200 V3 family on the low end, and the Ivy Bridge-EP Xeon E5 and Ivy Bridge-EX Xeon E7 aimed at the mid-range general purpose and high-end HPC markets respectively. Intel did not disclose pricing or details on the new chips (such as core counts, cache, clockspeeds, number of SKUs etc.). However, the x86 chip giant did state that the new chips are coming later this year as well as teasing a few tidbits of information on the new Xeon chips.
The upcoming Xeon E3 processors will be part of the Xeon E3 1200 V3 family. These chips will be based on Haswell and are limited to one socket per board. Thanks to the Haswell architecture, Intel has managed to reduce power consumption by approximately 25% and increase video transcoding performance by about 25%. There will be at least one Xeon E3 1200 V3 series chip with a 13W TDP, for example.
Intel is also releasing a new media software development kit (SDK) for Linux and Windows machines that will provide a common platform for developers. It has allowed Intel to maximize the use of both the CPU and GPU for HD video transcoding as well as increasing the number of simultaneous video transcodes over previous generations. The new Xeon E3 1200 V3 (Haswell) chips will be available sometime before the end of 2013.
The next-generation Xeon E5 chips will be based on the 22nm Ivy Bridge-EP architecture. They will be positioned at general purpose computing in data centers (and possibly high-end workstations), and will be limited to 2 sockets per motherboard. The new Xeon E5 processors will incorporate Intel Secure Key and OS Guard technologies. OS Guard is the evolution of the company's existing Intel Execute Disable Bit security technology. Intel is also including AES-NI (AES-New Instructions), to improve the hardware acceleration of AES encrypt/decrypt operations. These mid-range Xeon chips will be available in Q3 2013.
Finally, the top-end Xeon E7 processors will be based on the 22nm Ivy Bridge-EX architecture. The upcoming processors are intended for high performance server and supercomputing applications where scalability and performance are important. The Ivy Bride-EX chips are compatible with motherboards that will have between 4 and 8 sockets and up to 12TB of RAM per node. Further, Intel has packed these processors with new RAS features, including Resilient System Technology and Resilient Memory Technology. The RAS features ensure stability and data integrity in calculations are maintained. Such features are important in scientific, real-time analytics, cloud computing, and banking applications, where performance and up-time are paramount and any errors could cost a company money. Intel has stated that the new Xeon E7 CPUs will be available in the fourth quarter of this year (Q4'13).
While I was hoping for more details as far as core count, clockspeeds, and pricing, the approximate release to market timeframe for the chips is known. Do you think you will be upgrading to the new Xeon chips later this year, or are your current processors fast enough for your server applications?
More information on the upcoming Xeon chips can be found in this Intel fact sheet (PDF).
Subject: General Tech, Graphics Cards | March 19, 2013 - 06:52 PM | Tim Verry
Tagged: GTC 2013, tyan, HPC, servers, tesla, kepler, nvidia
Server platform manufacturer TYAN is showing off several of its latest servers aimed at the high performance computing (HPC) market. The new servers range in size from 2U to 4U chassis and hold up to 8 Kepler-based Tesla accelerator cards. The new product lineup consists of two motherboards and three bare-bones systems. The S7055 and S7056 are the motherboards while the FT77-B7059, TA77-B7061, and FT48-B7055.
The TA77-B7061 is the smallest system, with support for two Intel Xeon E5-2600 processors and four Kepler-based Tesla accelerator cards. The FT48-B7055 has si7056 specifications but is housed in a 4U chassis. Finally, the FT77-B7059 is a 4U system with support for two Intel Xeon E5-2600 processors, and up to eight Tesla accelerator cards. The S7055 supports a maximum of 4 GPUs while the S7056 can support two Tesla cards, though these are bare boards so you will have to supply your own cards, processors, and RAM (of course).
According to TYAN, the new Kepler-based HPC systems will be available in Q2 2013, though there is no word on pricing yet.
Stay tuned to PC Perspective for further GTC 2013 Coverage!
Subject: General Tech | November 23, 2012 - 01:03 PM | Jeremy Hellstrom
Tagged: gpgpu, amd, nvidia, Intel, phi, tesla, firepro, HPC
The skeptics were right to question the huge improvements seen when using GPGPUs in a system for heavy parallel computing tasks. The cards do help a lot but the 100x improvements that have been reported by some companies and universities had more to do with poorly optimized CPU code than with the processing power of GPGPUs. This news comes from someone who you might not expect to burst this particular bubble, Sumit Gupta is the GM of NVIDIA's Tesla team and he might be trying to mitigate any possible disappointment from future customers which have optimized CPU coding and won't see the huge improvements seen by academics and other current customers. The Inquirer does point out a balancing benefit, it is obviously much easier to optimize code in CUDA, OpenCL and other GPGPU languages than it is to code for multicored CPUs.
"Both AMD and Nvidia have been using real-world code examples and projects to promote the performance of their respective GPGPU accelerators for years, but now it seems some of the eye popping figures including speed ups of 100x or 200x were not down to just the computing power of GPGPUs. Sumit Gupta, GM of Nvidia's Tesla business told The INQUIRER that such figures were generally down to starting with unoptimised CPU."
Here is some more Tech News from around the web:
- Intel reportedly speeds up development of low-power processors @ DigiTimes
- Firefox and Opera squish big buffer overflow bugs @ The Register
- Hexing MAC address reveals Wifi passwords @ The Register
- Cisco Linksys EA6500 Smart Wi-Fi Router Review @ Legit Reviews
- Camera shootout: Samsung Galaxy S III vs S III mini @ Hardware.info
- Black Friday Tech Deals @ TechReviewSource
- Lawrence 'Empire Strikes Back' Kasdan to pen future Star Wars script @ The Register
- Win Corsair AX860i, AX760i, AX860 & AX760 power supplies @ Kitguru
Subject: Graphics Cards | November 13, 2012 - 04:15 PM | Tim Verry
Tagged: tahiti, HPC, gpgpu, firepro s10000, firepro
On Monday, AMD launched its latest graphics card aimed at the server and workstation market. Called the AMD FirePro S10000 (for clarity, that’s FirePro S10,000), it is a dual GPU Tahiti graphics card that offers up some impressive performance numbers.
No, unfortunately, this is not the (at this point) mythical dual-7970 AMD HD 7990 graphics card. Rather, the FirePro S10,000 is essentially two Radeon 7950 GPUs on a single PCB along with 6 GB of GDDR5 memory. Specifications on the card include 3,584 stream processors, a GPU clock speed of 825 MHz, and 6 GB GDDR5 with a total of 480 GB/s of memory bandwidth. That is 1,792 stream processors and 3 GB of memory per GPU. Interestingly, this is a dual slot card with an active cooler. At 375W, a passive cooler is just not possible in a form factor necessary to fit into a server rack. Therefore, AMD has equipped the FirePro S10,000 GPGPU card with a triple fan cooler reminiscant of the setup PowerColor uses on its custom (2x7970) Devil 13, but not as large. The FirePro card has three red fans (shrouded by a black cover) over a heatpipe and aluminum fin heatsink. The card does include display outputs for workstation uses including one DVI and four mini DisplayPort ports.
AMD is claiming 1.48 TFLOPS in double precision work and 5.91 TFLOPS in single precision workloads. Those are impressive numbers, and the card even manages to beat NVIDIA’s new Tesla K20X with big Kepler GK110 and the company’s dual GPU GK104 Tesla K10 by notable margins. Additionally, the new FirePro S10000 manages to beat its FirePro 9000 predecessor handily. The S9000 in comparison is rated at 0.806 TFLOPS for double precision calculations and 3.23 TFLOPS on single precision work. The S9000 is a single GPU card equivalent to the Radeon 7950 on the consumer side of things with 1,792 shader cores. AMD has essentially taken two S9000 cards and put them on a single PCB, and managed to get almost twice the potential performance without needing twice the power.
Efficiency and calculations per watt were numbers that AMD did not dive too much into, but the company did share that the new FirePro S10000 achieves 3.94 GLOPS/W. AMD compares this to NVIDIA’s dual GPU (Fermi-based) Tesla M2090 at 2.96 GFLOPS/W. Unfortunately, NVIDIA has not shared a single GPU GFLOPS/W rating on its new K20X cards.
|AMD S10000||AMD S9000||NVIDIA K20X||NVIDIA K10|
|Double Precision||1.48 TF||0.806 TF||1.31 TF||0.19 TF|
|Single Precision||5.91 TF||3.23 TF||3.95 TF||4.58 TF|
|Architecture||Tahiti (x2)||Tahiti (x1)||GK110||GK104 (x2)|
|Memory Bandwidth||480 GB/s||264 GB/s||250 GB/s||320 GB/s|
|Memory Capacity||6 GB||6 GB||6 GB||8 GB|
|Core clock speed||825 MHz||900 MHz||732 MHz||745 M|
Other features of the AMD FirePro S10000 include support for OpenCL, Microsoft RemoteFX, Direct GPU pass-through, and (shared) virtualized graphics. AMD envisions businesses using these FirePro cards to provide GPU hardware acceleration for virtualized desktops and thin clients. With Xen Server, multiple users are able to tap into the hardware acceleration offered by the FirePro S10000 to speed up desktop and speed up programs that support it.
Operating systems in particular have begun tapping into GPU acceleration to speed up the user interface and run things like the Aero desktop in Windows 7. High end software for workstations also have a high GPU acceleration adoption rate, so there are benefits to be had, and AMD is continuing to offer it with its latest FirePro card.
AMD is offering up a card that can be used for a mix of compute or graphics output, making them an interesting choice for workstations. The FirePro S10000’s major fault lies with a 375W TDP, and while the peak performance is respectable it is going to use more power while provided that compute muscle.
The cards are available now with an MSRP of $3,599. It is neat to finally see AMD come out with a dual GPU card with Tahiti chips, and it will be interesting to see what kind of design wins the company is able to get for its beastly FirePro S10000.