New Intel PCN Addresses NUC Overheating Issues

Subject: General Tech, Cases and Cooling | July 20, 2013 - 12:29 AM |
Tagged: Intel, dccp847dye, nuc, SFF, pcn, wi-fi

Intel recently posted a Product Change Notification (PCN, number 112432-00) regarding one of its first NUC bare-bones systems, model number BOXDCCP847DYE. The PCN seeks to address the overheating issues that several hardware review sites encountered when performing large file copies across the network using the built-in Wi-Fi card. Intel has reportedly found a solution by adding a 9.5mm thermal pad to the underside of the top cover. The thermal pad will make contact with the mSATA SSD and facilitate heat transfer from the drive into the metal chassis.

Intel PNC Upgrade to Bottom NUC cover aids cooling.jpg

The overheating problems spotted by PC Perspective (in our review) and other tech sites lead to system freezes and restarts. When transferring large amounts of data across the network, the built-in mPCI-E Wi-Fi card would heat up, and because the SSD is mounted just above the Wi-Fi card, the system would lock up or crash when the SSD overheated. Thus, Intel’s workaround is to improve the cooling of the SSD such that it (hopefully) will no longer overheat and users will not have to resort to buying a USB Wi-Fi dongle or running an Ethernet cable to the switch.

According to the PCN, the solution works and system retailers should expect shipments of the BOXDCCP847DYE with upgraded cover to arrive as early as August 1st. Notably, Intel is planning to ship out all pre-modification inventory before moving onto shipping updated bare-bones systems. It may be some time before consumers can be sure they are getting the updated model. In the meantime, users can always opt to use one of the many third party NUC cases that take full advantage of passive cooling techniques.

Source: Intel (PDF)