Report: Intel Broadwell-E Flagship i7-6950X a 10 Core, 20 Thread CPU

Subject: Processors | November 13, 2015 - 06:40 PM |
Tagged: X99, processor, LGA2011-v3, Intel, i7-6950X, HEDT, Haswell-E, cpu, Broadwell-E

Intel's high-end desktop (HEDT) processor line will reportedly be moving from Haswell-E to Broadwell-E soon, and with the move Intel will offer their highest consumer core count to date, according to a post at XFastest which WCCFtech reported on yesterday.


Image credit: VR-Zone

While it had been thought that Broadwell-E would feature the same core counts as Haswell-E (as seen on the leaked slide above), according to the report the upcoming flagship Core i7-6950X will be a massive 10 core, 20 thread part built using Intel's 14 nm process. Broadwell-E is expected to provide an upgrade to those running on Intel's current enthusiast X99 platform before Skylake-E arrives with an all-new chipset.

WCCFtech offered this chart in their report, outlining the differences between the HEDT generations (and providing a glimpse of the future Skylake-E variant):


Intel HEDT generations compared (Credit: WCCFtech)

It isn't all that surprising that one of Intel's LGA2011-v3 processors would arrive on desktops with 10 cores as these are closely related to the Xeon server processors, and Haswell based Xeon CPUs are already available with up to 18 cores, though priced far beyond what even the extreme builder would probably find reasonable (not to mention being far less suited to a desktop build based on motherboard compatibility). The projected $999 price tag for the Extreme Edition part with 10 cores would mark not only the first time an Intel desktop processor reached the core-count milestone, but it would also mark the lowest price to attain one of the company's 10-core parts to date (Xeon or otherwise).

Report: Unreleased AMD Bristol Ridge SoC Listed Online

Subject: Processors | November 5, 2015 - 09:30 PM |
Tagged: SoC, report, processor, mobile apu, leak, FX-9830PP, cpu, Bristol Ridge, APU, amd

A new report points to an entry from the USB implementors forum, which shows an unreleased AMD Bristol Ridge SoC.


(AMD via

Bristol Ridge itself is not news, as the report at Computer Base observes (translation):

"A leaked roadmap had previously noted that Bristol Ridge is in the coming year soldered on motherboards for notebooks and desktop computers in special BGA package FP4."


( via Computer Base)

But there is something different about this chip as the report point out the model name FX-9830P pictured in the screen grab is consistent with the naming scheme for notebook parts, with the highest current model being FX-8800P (Carrizo), a 35W 4-thread Excavator part with 512 stream processors from the R7 GPU core.


(BenchLife via Computer Base)

No details are available other than information from a leaked roadmap (above), which points to Bristol Ridge as an FP4 BGA part for mobile, with a desktop variant for socket FM3 that would replace Kaveri/Godavari (and possibly still an Excavator part). New cores are coming in 2016, and we'll have to wait and see for additional details (or until more information inevitably leaks out).

Update, 11/06/15: WCCFtech expounds on the leak:

“Bristol Ridge isn’t just limited to mobility platforms but will also be featured on AM4 desktop platform as Bristol Ridge will be the APU generation available on desktops in 2016 while Zen would be integrated on the performance focused FX processors.”

WCCFtech’s report also included a link to this SiSoftware database entry for an engineering sample of a dual-core Stoney Ridge processor, a low-power mobile part with a 2.7 GHz clock speed. Stoney Ridge will reportedly succeed Carrizo-L for low-power platforms.

The report also provided this chart to reference the new products:



Report: Intel Xeon D SoC to Reach 16 Cores

Subject: Processors | October 23, 2015 - 02:21 PM |
Tagged: Xeon D, SoC, rumor, report, processor, Pentium D, Intel, cpu

Intel's Xeon D SoC lineup will soon expand to include 12-core and 16-core options, after the platform launched earlier this year with the option of 4 or 8 cores for the 14 nm chips.


The report yesterday from CPU World offers new details on the refreshed lineup which includes both Xeon D and Pentium D SoCs:

"According to our sources, Intel have made some changes to the lineup, which is now comprised of 13 Xeon D and Pentium D SKUs. Even more interesting is that Intel managed to double the maximum number of cores, and consequentially combined cache size, of Xeon D design, and the nearing Xeon D launch may include a few 12-core and 16-core models with 18 MB and 24 MB cache."

The move is not unexpected as Intel initially hinted at an expanded offering by the end of the year (emphasis added):

"...the Intel Xeon processor D-1500 product family is the first offering of a line of processors that will address a broad range of low-power, high-density infrastructure needs. Currently available with 4 or 8 cores and 128 GB of addressable memory..."


Current Xeon D Processors

The new flagship Xeon D model will be the D-1577, a 16-core processor with between 18 and 24 MB of L3 cache (exact specifications are not yet known). These SoCs feature integrated platform controller hub (PCH), I/O, and dual 10 Gigabit Ethernet, and the initial offerings had up to a 45W TDP. It would seem likely that a model with double the core count would either necessitate a higher TDP or simply target a lower clock speed. We should know more before too long.

For futher information on Xeon D, please check out our previous coverage: 

Source: CPU-World

Qualcomm Enters Server CPU Space with 24-Core Socketed Processor

Subject: Processors | October 12, 2015 - 12:24 PM |
Tagged: servers, qualcomm, processor, enterprise, cpu, arm, 24-core

Another player emerges in the CPU landscape: Qualcomm is introducing its first socketed processor for the enterprise market.


Image credit: PC World

A 24-core design based on 64-bit ARM architecture has reached the prototype phase, in a large LGA package resembling an Intel Xeon CPU.

From the report published by PC World:

"Qualcomm demonstrated a pre-production chip in San Francisco on Thursday. It's a purpose-built system-on-chip, different from its Snapdragon processor, that integrates PCIe, storage and other features. The initial version has 24 cores, though the final part will have more, said Anand Chandrasekher, Qualcomm senior vice president."


Image credit: PC World

Qualcomm built servers as proof-of-concept with this new processor, "running a version of Linux, with the KVM hypervisor, streaming HD video to a PC. The chip was running the LAMP stack - Linux, the Apache Web server, MySQL, and PHP - and OpenStack cloud software," according to PC World. The functionality of this design demonstrate the chip's potential to power highly energy-efficient servers, making an obvious statement about the potential cost savings for large data companies such as Google and Facebook.

Source: PC World

Photos and Tests of Skylake (Intel Core i7-6700K) Delidded

Subject: Processors | August 8, 2015 - 05:55 PM |
Tagged: Skylake, Intel, delid, CPU die, cpu, Core i7-6700K

PC Watch, a Japanese computer hardware website, acquired at least one Skylake i7-6700K and removed the heatspreader. With access to the bare die, they took some photos and tested a few thermal compound replacements, which quantifies how good (or bad) Intel's default thermal grease is. As evidenced by the launch of Ivy Bridge and, later, Devil's Canyon, the choice of thermal interface between the die and the lid can make a fairly large difference in temperatures and overclocking.


Image Credit: PC Watch

They chose the vice method for the same reason that Morry chose this method in his i7-4770k delid article last year. This basically uses a slight amount of torque and external pressure or shock to pop the lid off the processor. Despite how it looks, this is considered to be less traumatic than using a razer blade to cut the seal, because human hands are not the most precise instruments and a slight miss could damage the PCB. PC Watch, apparently, needed to use a wrench to get enough torque on the vice, which is transferred to the processor as pressure.


Image Credit: PC Watch

Of course, Intel could always offer enthusiasts with choices in thermal compounds before they put the lid on, which would be safest. How about that, Intel?


Image Credit: PC Watch

With the lid off, PC Watch mentioned that the thermal compound seems to be roughly the same as Devil's Canyon, which is quite good. They also noticed that the PCB is significantly more thin than Haswell, dropping in thickness from about 1.1mm to about 0.8mm. For some benchmarks, they tested it with the stock interface, an aftermarket solution called Prolimatech PK-3, and a liquid metal alloy called Coollaboratory Liquid Pro.


Image Credit: PC Watch

At 4.0 GHz, PK-3 dropped the temperature by about 4 degrees Celsius, while Liquid Metal knocked it down 16 degrees. At 4.6 GHz, PK-3 continued to give a delta of about 4 degrees, while Liquid Metal widened its gap to 20 degrees. It reduced an 88 C temperature to 68 C!


Image Credit: PC Watch

There are obviously limitations to how practical this is. If you were concerned about thermal wear on your die, you probably wouldn't forcibly remove its heatspreader from its PCB to acquire it. That would be like performing surgery on yourself to remove your own appendix, which wasn't inflamed, just in case. Also, from an overclocking standpoint, heat doesn't scale with frequency. Twenty degrees is a huge gap, but even a hundred MHz could eat it up, depending on your die.

It's still interesting for those who try, though.

Source: PC Watch
Subject: Systems
Manufacturer: PC Perspective
Tagged: quad-core, gpu, gaming, cpu

Introduction and Test Hardware


The PC gaming world has become divided by two distinct types of games: those that were designed and programmed specifically for the PC, and console ports. Unfortunately for PC gamers it seems that far too many titles are simply ported over (or at least optimized for consoles first) these days, and while PC users can usually enjoy higher detail levels and unlocked frame rates there is now the issue of processor core-count to consider. This may seem artificial, but in recent months quite a few games have been released that require at least a quad-core CPU to even run (without modifying the game).

One possible explanation for this is current console hardware: PS4 and Xbox One systems are based on multi-core AMD APUs (the 8-core AMD "Jaguar"). While a quad-core (or higher) processor might not be techincally required to run current games on PCs, the fact that these exist on consoles might help to explain quad-core CPU as a minimum spec. This trend could simply be the result of current x86 console hardware, as developement of console versions of games is often prioritized (and porting has become common for development of PC versions of games). So it is that popular dual-core processors like the $69 Intel Pentium Anniversary Edition (G3258) are suddenly less viable for a future-proofed gaming build. While hacking these games might make dual-core CPUs work, and might be the only way to get such a game to even load as the CPU is checked at launch, this is obviously far from ideal.


Is this much CPU really necessary?

Rather than rail against this quad-core trend and question its necessity, I decided instead to see just how much of a difference the processor alone might make with some game benchmarks. This quickly escalated into more and more system configurations as I accumulated parts, eventually arriving at 36 different configurations at various price points. Yeah, I said 36. (Remember that Budget Gaming Shootout article from last year? It's bigger than that!) Some of the charts that follow are really long (you've been warned), and there’s a lot of information to parse here. I wanted this to be as fair as possible, so there is a theme to the component selection. I started with three processors each (low, mid, and high price) from AMD and Intel, and then three graphics cards (again, low, mid, and high price) from AMD and NVIDIA.

Here’s the component rundown with current pricing*:

Processors tested:

Graphics cards tested:

  • AMD Radeon R7 260X (ASUS 2GB OC) - $137.24
  • AMD Radeon R9 280 (Sapphire Dual-X) - $169.99
  • AMD Radeon R9 290X (MSI Lightning) - $399
  • NVIDIA GeForce GTX 750 Ti (OEM) - $149.99
  • NVIDIA GeForce GTX 770 (OEM) - $235
  • NVIDIA GeForce GTX 980 (ASUS STRIX) - $519

*These prices were current as of  6/29/15, and of course fluctuate.

Continue reading our Quad-Core Gaming Roundup: How Much CPU Do You Really Need?

MSI Launches 8 New FM2+ Motherboards Supporting AMD Godavari CPUs

Subject: Motherboards | May 4, 2015 - 02:49 PM |
Tagged: processor, msi, motherboard, Godavari, FM2+, cpu, APU, amd

MSI has revealed a new FM2+ motherboard lineup with support for upcoming AMD Godavari processors, further indicating the launch of these new CPUs will be very soon though no official announcement has yet been made by AMD.


As reported back in January when the lineup allegedly leaked the new Godavari SKUs feature higher clocks on both processor and, more significantly, in GPU cores in upcoming APUs like the rumored 8850K. MSI states that "these new models are available in ATX, micro-ATX, and mini-ATX form factors and are backwards compatible with FM2 processors (Kaveri, Richland, Trinity, 6000 and 5000 series)", so it makes sense to consider these new models for future compatibility if shopping for an FM2 motherboard today. It remains to be seen if vendors will offer support for Godavari through BIOS updates, though it does at least seem likely.

For those interested here is the list of new MSI AMD FM2+/FM2 motherboard models:

  • A68HM-E33 V2
  • A88XM-E45 V2
  • A78M-E35 V2
  • A88XM-P33 V2
  • A78M-E45 V2
  • A88X-G41 PC Mate V2
  • A88XM-E35 V2
  • A88XI AC V2

The familiar Military Class 4 and OC Genie 4 branding is visible across the lineup, and the new models also feature "a rich blend of features and technologies, such as onboard LAN, PCI Express 3.0 x16, SATA 6Gb/s, USB 3.0 and multiple display support".

Source: MSI

GIGABYTE Enables 5th Gen Intel Core CPU Support for 9 Series Motherboards

Subject: Motherboards | April 30, 2015 - 10:32 PM |
Tagged: gigabyte, Intel, Broadwell, h97, z97, bios, cpu, processor

GIGABYTE has announced support for the upcoming LGA 1150 variants of Intel's 5th-generation Core (Broadwell) processors for all existing 9-series motherboards via BIOS update.


The full press release appears below:

City of Industry, California, April 30th, 2015 – GIGABYTE TECHNOLOGY Co. Ltd., a leading manufacturer of motherboards and graphics cards is proud to announce their entire line-up of Z97 and H97 motherboards now support the soon-to-launch 5th Generation Intel® Core™ processors.

GIGABYTE engineers have tested and validated all GIGABYTE 9 series motherboards including Z97 and H97 chipset-based motherboards to ensure optimal performance for 5th Generation Intel® Core™ processors. Users wanting to take advantage of all the features of 5th Gen Intel® Core™ processors have to offer at launch, simply need to download the latest UEFI BIOS from the GIGABYTE website.

To get the latest UEFI BIOS for your motherboard, please visit the GIGABYTE website:


Report: AMD Godavari CPU Lineup Leaked - New APUs and Athlon X4 Processors

Subject: Processors | January 29, 2015 - 10:41 AM |
Tagged: rumor, processors, Kaveri, Godavari, cpu, Athlon X4, APU, amd

VR-Zone has published a report with a detailed slide showing upcoming AMD Godavari processors, and the updated lineup includes 12 new models.


Image credit: VR-Zone

The release schedule indicates a spring availability for most of the new APUs, with the Athlon X4 850 and 870K shipping in May. The APU line gets a new flagship desktop part with the A10-8850K, and this appears to be a higher-clocked version of the A10-7850K, with a 100MHz higher boost clock (4.1 GHz vs. 4.0 GHz) and a higher GPU clock of 856 MHz (vs. 720 MHz).

Of particular interest for the potential budget quad-core buyer is the Athlon X4 870K, a new 95W part which would presumably replace the X4 860K - a processor that has seen inconsistent availability (and is currently unavailable on Newegg). With more games being released that require a quad-core to run, these sub-$100 Athlon CPUs present a great value in constructing a low-cost gaming system these days.

The slide does not indicate a change in the 28nm process from Kaveri, and it should be safe to assume these will not represent a significant architectural change. The modest clock increases from Kaveri will result in some performance gains, and this is good for consumers assuming these will sell at the same price points as the outgoing models.

Source: VR Zone

Report: AMD Carrizo APU Benchmarks Show 2x the Performance of Kaveri, 3x Intel Iris Pro

Subject: Processors | January 18, 2015 - 05:16 PM |
Tagged: SoC, rumor, processor, leak, iris pro, Intel, graphics, cpu, carrizo, APU, amd

A new report of leaked benchmarks paints a very interesting picture of the upcoming AMD Carrizo mobile APU.


Image credit: SiSoftware

Announced as strictly mobile parts, Carrizo is based on the next generation Excavator core and features what AMD is calling one of their biggest ever jumps in efficiency. Now alleged leaked benchmarks are showing significant performance gains as well, with numbers that should elevate the IGP dominance of AMD's APUs.


Image credit: WCCFtech

WCCFtech explains the performance shown in this SiSoft Sandra leak in their post:

"The A10 7850K scores around 270 Mpix/s while Intel’s HD5200 Iris Pro scores a more modest 200 Mpix/s. Carriso scores here over 600 Mpix/s which suggests that Carrizo is more than twice as fast as Kaveri and three times faster than Iris Pro. To put this into perspective this is what an R7 265 graphics card scores, a card that offers the same graphics performance inside the Playstation 4."


While the idea of desktop APUs with greatly improved graphics and higher efficency is tantalizing, AMD has made it clear that these will be mobile-only parts at launch. When asked by Anandtech, AMD had this to say about the possibility of a desktop variant:

“With regards to your specific question, we expect Carrizo will be seen in BGA form factor desktops designs from our OEM partners. The Carrizo project was focused on thermally constrained form factors, which is where you'll see the big differences in performance and other experiences that consumers value.”

The new mobile APU will be manufactured with the same 28nm process as Kaveri, with power consumption up to 35W for the Carrizo down to a maximum of 15W for the ultra-mobile Carrizo-L parts.

Source: WCCFtech