Subject: General Tech | August 18, 2013 - 05:57 PM | Tim Verry
Tagged: zalman, nanofluids, liquid cooler, cpu cooler
Zalman recently launched the Reserator 3 Max, which is a new sealed loop liquid CPU cooler. The new cooler combines two radial radiators, a circular water block, and nanofluids to cool Intel and AMD’s latest processors. The cooler weighs a combined 897 grams and is available now in the UK.
The Reserator 3 Max is a sealed loop cooler. The CPU block has a pure copper base and internal array of copper micro-fins to increase the cooling potential. A pump is situated over the water block and two tubes connect the block to radiator. The radiator that Zalman uses is interesting as it is actually made of two (a smaller inner radiator, and a larger outer radiator) copper radiators. The radiators route the nanofluid coolant through copper pipes that are surrounded by copper fins. The copper on the radiator is nickel plated in a black pearl color. A 120mm fan with blue LED is bundled with the cooler, and users have the option to set up a push-pull configuration by adding a second 120mm fan. The bundled fan is PWM controlled and spins at anywhere between 1,000 and 2,200 RPM (18.9 to 36.7 dBA).
CPU compatibility includes LGA 775, 1150, 1155, 1156, 1366, and 2011 on the Intel side and socket AM2, AM2+, AM3, AM3+, FM1, and FM2 on the AMD side.
Zalman was not specific on the “nanofluids” used in the Reserator 3 Max, but the company’s site states that “using nanofluid coolant improves thermal conductivity by mixing nanoparticles with fluids.” It must be pretty impressive considering Zalman claims the cooler is capable of cooling up to 400W. This cooler would be well suited for systems using AMD’s 250W FX-9590 processor if it lives up to the marketing!
The Zalman Reserator 3 Max is available now in the UK for £83.33 pounds from Quiet PC. US pricing would probably be close to $100, though importing it now from overseas will cost around $130 at the current exchange rates before shipping. More information can be found on this Zalman product page.
I think it is a unique design and should perform well as a AIO cooler, though I’m curious to see whether it lives up to the 400W TDP and if the nanofluids make any appreciable difference. Hopefully benchmarks emerge soon!
Subject: General Tech | August 6, 2013 - 07:57 PM | Tim Verry
Tagged: thermalright, low profile, htpc, cpu cooler, axp-200
Thermalright recently released the AXP-200, a new low profile CPU cooler suitable for HTPCs and other systems with CPU HSF hieght restrictions. The AXP-200 is the successor to the existing AXP-100, and is available in Europe for €50 Euros, which is approximately $67 USD.
Thermalright’s AXP-200 measures 150mm x 140mm x 73mm including the bundled TY-14013 140mm fan and weighs 475 grams (~1.04 lbs). Features include a nickel plated copper base plate that connects to an aluminum heatsink with 49 fins via six soldered 6mm nickel plated heatpipes. Thermalright logos are etched onto the heatpipe caps and fan shroud. Speaking of the fan, it is rated at 700-1300 RPM, 64.52 CFM, and a maximum of 30.6 dBA.
Interestingly, the AXP-200 comes with a TY-150 mounting frame that allows it to support a150mm TY-150 fan instead of the bundled 140mm model.
The cooler supports all of the latest CPU sockets including:
- 775, 1150, 1155, 1156, 1366, 2011
- AM2, AM2+, AM3, AM3+, FM1, FM2
The low profile AXP-200 is available now in Europe for €50 and will hopefully hit the US soon. It should be a decent little cooler for your next HTPC or mini-ITX desktop build, though it is on the pricier side of things.
Subject: Cases and Cooling | July 20, 2013 - 02:03 AM | Tim Verry
Tagged: v8 gts, Intel, hsf, cpu cooler, cooler master, amd
Cooler Master has unveiled a massive CPU cooler called the V8 GTS. The new high end air cooler measures 154 x 140 x 153.5mm and weighs 1.9 pounds. It combines a horizontal vapor chamber, eight heat pipes, triple aluminum fin stacks, and two shrouded PWM fans with red LEDs.
The V8 GTS is compatible with both Intel and AMD CPU sockets, including LGA 775, 1150 1155, 1156, 1366, and 2011 on the Intel side and AM2, AM3, AM3+, FM1, and FM2 on the AMD side. A horizontal vapor chamber is used for the CPU baseplate to effectively move heat away from the processor an into the heatpipes.
Eight 6mm heat pipes further transfer heat to three total aluminum fin stacks. Further, two 140mm PWM-controlled fans move cool air across the fins to facilitate cooling high end and overclocked processors. The fans can spin between 600 and 1,600 RPM and are rated for between approximately 28 and 82 CFM respectively.
Other features of the Cooler Master V8 GTS include red LEDs and a black shroud. The cooler is designed to allow plenty of room for clearance around the RAM area to allow for memory with heatspreaders to be used. It is rated to be able to cool up to 250W. It may be rather heavy and may or may not be a hemi, but it certainly looks cool (heh)!
The CM V8 GTS is model number RR-V8VC-1GPR-R1 and comes with a 2 year warranty. Cooler Master has not yet detailed pricing or availability. In the meantime, Hardware Secrets managed to get their hands on the massive cooler to put its performance to the test.
Subject: Cases and Cooling | June 10, 2013 - 11:54 AM | Tim Verry
Tagged: streacom db4, streacom, hsf, Fanless PSU, fanless, cpu cooler
Streacom recently showed off a new cube-shaped case called the DB4. The new case measures 250 x 250 x 250mm (a bit under 10 inches cubed) and doubles as a passive heatsink for internal components.
The Streacom DB4 is a large cube with vertical finned sides that is held aloft by a thin angled bar. The case is intended to be used as the base for a passively cooled desktop PC. Each side of the cube-shaped DB4 case can cool 65W TDP parts, for a total cooling potential of 260W. In addition to being able to cool processors and low-end graphics cards passively, the case also cools the bundled ZeroFlex 250W fanless power supply.
Unfortunately, Streacom is not showing off the internals or detailing how the PC components are connected to the side(s) of the case. When asked for details by Fanless Tech, Streamcom responded that "we will reveal the internal alyout after all patents are through."
Streacom expects to have the case available for sale sometime between late September or early October for 200 Euros. This is a neat case that is not only fanless, but a work of art. I could see myself using this. What do you think about the Streacom DB4?
Subject: Systems | May 28, 2013 - 06:22 PM | Tim Verry
Tagged: SFF case, SFF, passive cooling, nimbus, heastink, fanless, cpu cooler, cirrus7
German PC manufacturer Cirrus7 has launched a new small form factor (SFF) PC called the Nimbus that uses slices of aluminum that do double duty as both a case and a passive CPU cooler (heatsink).
The Nimbus PC features an Intel DQ77KB motherboard and low-power Intel processor along with configurable DDR3 and mSATA storage options. The base model will come with 4GB of DDR3 and a 60GB mSATA SSD. CPU options include the Intel G1610T, G2020T, Core i3-3220T, i3-3470T, i5-3570T, and i7-3770T. From there you can add up to two 7mm 2.5” hard drives (or SSDs) and increase the amount of RAM (for a higher price, of course).
The Intel DQ77KB board supports vPro and KVM over IP on systems with the Core i5 or higher processor. It has the following external IO options:
- 4 x USB 3.0
- 4 x USB 2.0
- 2 x Intel Gigabit LAN
- 2 x Audio jacks (green jack is dual purpose, mini-TOSLink compatible)
- 1 x HDMI
- 1 x DisplayPort
The SFF PC comes preloaded with either Ubuntu 13.04, Ubuntu 12.04, or Windows 8 (depending on your choice at checkout).
Check out more photos of the Nimbus at FanlessTech.
In order to keep the hardware cool, Cirrus7 has opted for an all-aluminum enclosure that is built around and over the motherboard in a fin-spacer-fin pattern. Each aluminum fin is 12mm high and the height of the system can be varied by adding or reducing the number of fins used. For example, using all fins allows Cirrus7 to support higher TDPs like the Core i7 3770T. Alternatively, if you are just using an i3-3220T, you could get by with a smaller (and lighter) case/heatsink. Notably, judging by the hands-on photos over at FanlessTech, the Nimbus does not use a copper CPU block which may have reduce the heatsink's effectiveness. That, or maybe Cirrus7 expects that they have slapped enough aluminum fins on the system that it doesn't matter much (heh). Also note that the case is not completely sealed, so although it is passively cooled, it is definitely not water or dust proof. Beyond that though, the case looks nice and the system would make a nice silent backup server, router, or HTPC!
The Nimbus will be available towards the end of June in Germany and Europe, with worldwide shipping available upon request. The system starts at €499 for the base model which is approximately $640 USD (before shipping). That price includes the case, processor, motherboard, RAM, and mSATA drive. Cirrus 7 has stated that Haswell-based models of the Nimbus will be available at some point, but are not expected until around the end of 2013 at the earliest.
Subject: Cases and Cooling | April 10, 2013 - 06:53 AM | Tim Verry
Tagged: slimhero, hsf, Gelid, fm2, cpu cooler, 1155
Hong Kong-based PC cooling company GELID Solutions launched a new low-profile CPU cooler yesterday called the SlimHero. The new SlimHero cooler joins the existing Silent HSF series, and is a mere 59mm high.
The low profile cooler measures 131 x 123 x 59mm including the fan and weighs 352g. The SlimHero cooler features four copper heatpipes connecting a copper block to a horizontal aluminum fin array. A 120mm fan is then mounted on top of the heatsink to push cool air over the fins and VRM area surrounding the processor. It is rated to cool processors up to 136 TDPs and is compatible with all of Intel and AMD's latest consumer sockets. On the AMD side, the cooler can be mounted in one of four directions on AM2, AM2, AM3, AM3+, FM1, and FM2.Further, it is compatible with Intel's LGA 775, 1156, 1366, and 1155 sockets.
The heatsink comes bundled with a 120mm fan and GC-2 thermal compound. The fan is PWM controlled and can spin at anywhere between 750 and 1600 RPM. GELID rates the 120mm fan at 52.4 CFM and 12-25.4 dBA.
The new cooler is designed to work with small form factor systems without getting in the way of RAM or VRM heat-spreaders. It comes with a 5 year warranty and is available now for an MSRP of $32 USD (25 EUR).
Subject: General Tech | March 20, 2013 - 12:05 AM | Tim Verry
Tagged: noctua, lga 1150, hsf, heatsink, haswell, cpu cooler
Noctua has recently announced that the company is providing free mounting kits to owners of existing coolers to make them compatible with Intel's latest LGA 1150 (Haswell) motherboards. The new NM-i115x mounting kit will allow enthusiasts to recycle their older Noctua coolers with the new platform without issue. The kit includes a new back plate with fixed struts and the necessary connectors (screws, springs, et al) to make alignment and mounting easier than previous setups.
Because the LGA 1150 socket keeps the same mounting hole spacing as the current LGA 1156 and LGA 1155 sockets, many newer Noctua cooler will not need the mounting kit upgrade, and can simply be installed into the Haswell machine as is. In other words, if the heatsink worked with your Lynnfield, Sandy Bridge, or Ivy Bridge-based system, it will work in a Haswell system as well. According to Noctua, the following coolers are already compatible with Haswell:
NH-C14, NH-D14, NH-C12P SE14, NH-L12, NH-L9i, NH-U12P SE2, NH-U9B SE2
If your cooler was released prior to LGA 1156, you will need to grab the NM-i115x mounting kit upgrade by filling out this form. Noctua will make the kit available on its website as well as in retail stores (for a minimal charge, though the company did not provide specific pricing). You will need to provide proof of purchase for your existing cooler by sending Noctua a scan or screenshot of your invoice or receipt.
For more information on the NM-i115x, head over to the Noctua product page.
It is nice to see Noctua standing behind its products like this, even if it only affects a small number of users that will be making the jump for LGA 775/ect to LGA 1150.
Subject: Cases and Cooling | December 1, 2012 - 10:18 PM | Tim Verry
Tagged: vapor-x, sapphire, hsf, cpu cooler, cooling
Sapphire, a popular graphics card add-in-board partner in the US recently announced a new product that strays from the norm. Called the Vapor-X, it is a new tower-style CPU cooler aimed at enthusiasts.
The new cooler has the Vapor-X designation because it uses the company’s vapor chamber heatsink technology to take heat away from the processor into an aluminum fin array. The vapor chamber makes contact with the CPU, and from there four 7mm heatpipes transfer heat to the aluminum fins where two 120mm fans and a black plastic shroud channel cool air through. The fans are rated at 77 CFM and a maximum of 40 dBA. Both fans have variable (PWM) speeds from 495 to 2200 RPM.
The Vapor-X heatsink has a gross weight of 1524.8 grams (approximately 3.4 pounds) including the fans. Dimensions are 135 x 110.4 x 163.5mm, and it is designed to work within the constraints of the LGA 2011 socket without limiting you to low profile memory modules.
Unfortunately, Sapphire does not list a TDP rating for this heatsink, but it is aimed at high end processors with support for the following processor sockets:
- AMD: FM1, FM2, AM2, AM2+, AM3, AM3+
- Intel: LGA 1366, LGA 1155, LGA 1156, LGA 775
While it has yet to show up at Newegg, it is reportedly on its way with a MSRP of $69.99. You can find more photos and specifications on Sapphire's product page.
My first major gaming graphics card was from Sapphire, so it is neat to see the company taking its graphics card cooling expertise and applying it to CPUs. The reviews should be interesting – particularly whether the shroud really helps to lower temps.
Subject: General Tech | November 26, 2012 - 01:00 AM | Tim Verry
Tagged: thermalright, sb-e 2x, hsf, heatsink, cpu cooler
Thermalright has announced a new tower CPU cooler called the Archon SB-E 2X. The new heatsink is a slim tower design, which is designed to not infringe on the RAM slots or PCI-E expansion slots. It measures 170mm x 155mm x 53mm and weighs just over 1.7 pounds (775 grams).
The heatsink itself is 53mm wide. The aluminum fins are attached to the baseplate using eight 6mm copper heatpipes. The contact plate and heatpipes are nickel plated with a mirror finish on the area that makes contact with the processor.
Thermalright is bundling the HSF with two of its silent-series TY-141 140mm fans. The fans are rated at 73.5 CFM and 21 dBA. Using PWM, the fans will spin anywhere between 900 and 1300 RPM. Including the two fans, the heatsink is 79.5mm wide. Thermalright claims that the heatsink will fit on LGA 2011 platforms without touching the RAM slots, however.
The new heatsink uses Thermalright’s VX BTKII mounting system that allows pressure to be adjusted. It supports the LGA 2011, 1366, 1155, 1156, and 775 Intel sockets and the AMD FM1, AM3+, AM2+, AM2, and 939 sockets.
While there is no specific release date mentioned on the Thermalright website, it should be available soon. The Archon SB-E 2X will have an MSRP of $99.95 USD. At that price, it is putting itself into closed-loop watercooling territory. It will be interesting to see how well it performs and stacks up to coolers like the H80 and Noctua DH-14.
Subject: Cases and Cooling | November 15, 2012 - 10:19 AM | Tim Verry
Tagged: zalman, Passive, hsf, cpu cooler
Images have emerged on the Internet of a new cooler coming from Zalman sometime next year. In a brief mention from Zalman, the company named the new passive CPU heatsink as the FX-100. The cube of fins are aligned in a cross, or +, shape and combined with shrouding at the corners, Zalman has created a hollow cube. At the top is a hexagonal-mesh grill. The base-plate is connected to the fin array by four copper heatpipes. The fins are nickel plated and are black pearl in color.
It is designed to be run in fan-less configurations, and Zalman is stating that it will not draw dust as well. The fan-less cube cooler is currently listed as a CES 2013 honoree, so here’s hoping it launches soon and lives up to the claims.
There are no details on pricing, availability or the TDP ratings it is designed to cool yet.
What do you think of the Zalman FX-100 passive cube?