Subject: Cases and Cooling | September 16, 2015 - 10:29 PM | Tim Verry
Tagged: water cooling, kryographics, GPU Water Block, copper, aqua computer
AMD officially launched its R9 Nano graphics card last week, and aftermarket coolers are already starting to ship. German-based Aqua Computer is the first company to offer a custom cooler for AMD’s pint-sized powerhouse. The Kryographics R9 Nano is a full cover water block that takes the already tiny card to a single slot design.
The Kryographics R9 Nano cooler is a machined copper block that covers the entire PCB and is paired to the VRMs using thermal pads and the GPU (and HBM) using thermal compound. The single slot cooler comes in two options including a see-through translucent ruby colored acrylic glass variant and a version with a brushed stainless steel top cover. In all cases, the block itself is all copper with microchannels over the GPU portion.
The cooler uses standard G1/4 threading on the ports and is compatible with CrossFire multi-GPU watercooled setups by removing the terminating screws and adding ports on the oppposite side of the card..
According to Aqua Computer, the Kryographics cooler was able to keep the R9 Nano GPU under 35 degrees C throughout their testing using Furmark. It will be interesting to see if the new cooler would allow the chips to maintain higher clockspeeds, especially with the power target maxed out in CCC. The need to fit a radiator, pump, and tubing in the case does while still needing to use a Nano (in lieu of a Fury X) makes this a niche within a niche product, but I’m sure some enthusiast will find a use for it!
The Kryographics R9 Nano is available for purchase now (though there is currently a shipping delay of 10 days). The base version without the see-through window has an MSRP of 89.90 EUR while the Kryographics Acrylic Glass Edition has a slight premium at 99.90 EUR. (At the time of writing, that pricing works out to about $102 and $113 USD respectively.)
Subject: General Tech | June 19, 2015 - 05:00 PM | Jeremy Hellstrom
Tagged: graphene, copper, interconnect
Earlier this week we heard news about IBM's research into optical transceiver chips and today comes news at The Register of another interesting project to increase the frequency of processors by sheathing current copper interconnects in graphene. This is not the first time the usage of graphene has been investigated for computers, indeed there is research being conducted into improving non-volatile storage and even cooling with the use of graphene. The project being carried out by a team at Stanford University found graphene-coated interconnects can reliably carry data at speeds 4-17% faster than copper without the sheathing. They feel that a 30% improvement is reachable with current process technology; you can read more in the full article.
"Researchers have made tremendous advances on all of the other components in chips but recently, there hasn't been much progress on improving the performance of the wires," said Stanford electrical engineer Philip Wong."
Here is some more Tech News from around the web:
- HP launches its first USB Type-C Windows 10 tablets @ The Inquirer
- Feature-rich work in progress: Windows Mobile 10 build 10136 @ The Register
- Samsung spins up its latest rusty rotators for release @ The Register
Subject: Processors, Systems | May 29, 2012 - 09:15 PM | Ryan Shrout
Tagged: server, dell, copper, arm
Dell announced today that is going to help enable the world of the ARM-based server ecosystem by enabling key hyperscale customers to access and develop on Dell's own "Copper" ARM servers.
Dell today announced it is responding to the demands of our customers for continued innovation in support of hyperscale environments, and enabling the ecosystem for ARM-based servers. The ARM-based server market is approaching an inflection point, marked by increasing customer interest in testing and developing applications, and Dell believes now is the right time to help foster development and testing of operating systems and applications for ARM servers.
Dell is recognized as an industry leader in both the x86 architecture and the hyperscale server market segments. Dell began testing ARM server technology internally in 2010 in response to increasing customer demands for density and power efficiency, and worked closely with select Dell Data Center Solutions (DCS) hyperscale customers to understand their interest level and expectations for ARM-based servers. Today's announcement is a natural extension of Dell's server leadership and the company's continued focus on delivering next generation technology innovation.
While these servers are still not publicly available, Dell is fostering the development of software and verification processes by seeding these unique servers to a select few groups. PC Perspective is NOT one of them.
Each of these 3U rack mount machines includes 48 independent servers, each based around a 1.6 GHz quad-core Marvell Armada XP SoC. Each of the sleds (pictured below) holds four discrete server nodes, each capable of as much as 8GB of memory on a single DDR3 UDIMM. Each node can access one 2.5-in HDD bay and one Gigabit Ethernet connection.
Click for a larger view
Even though we are still very early into the life cycle of ARM architectures in the server room, Dell claims that these systems are built perfectly for web front-ends and Hadoop environments:
Customers have expressed great interest in understanding ARM-based server advantages and how they may apply to their hyperscale environments. Dell believes ARM infrastructures demonstrate promise for web front-end and Hadoop environments, where advantages in performance per dollar and performance per watt are critical. The ARM server ecosystem is still developing, and largely available in open-source, non-production versions, and the current focus is on supporting development of that ecosystem. Dell has designed its programs to support today's market realities by providing lightweight, high-performance seed units and easy remote access to development clusters.
There is little doubt that Intel will feel and address this competition in the coming years.