CES 2013: WonderMedia Dualcore PRIZM SoC

Subject: General Tech, Mobile, Shows and Expos | January 9, 2013 - 07:35 PM |
Tagged: WonderMedia, ces 2013, CES

WonderMedia, a subsidiary of VIA Technologies, designs low-cost ARM processors. Like many chip designers such as NVIDIA, they do not have their own fabrication capabilities. Still, companies such as TSMC are almost always happy to fulfill orders for interested parties.

PRIZM Logo 2WM8980_medium.jpg

Vis-à-VIA

While the majority of CES hype is about the devices, they would literally be pretty dumb without logic behind them. WonderMedia is hoping to power your cheap tablets and set top boxes and in the process bring them up to Android 4.2. The System on a Chip (SoC) also supports Miracast in hopes to bring wireless display technologies down to an even cheaper price point.

The PRIZM WM8980 is currently available for sampling with mass production shipments in Q1 2013.

Check in after the break for the press release.

Coverage of CES 2013 is brought to you by AMD!

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Source: WonderMedia

CES 2013: Valve Announces Steam Box Not Announced in '13

Subject: Editorial, General Tech, Systems, Shows and Expos | January 9, 2013 - 02:44 PM |
Tagged: CES, ces 2013, valve, Steam Box

CES opened with excitement from Xi3 Corporation and their announcement of the Piston. When Gabe Newell spoke with Kotaku at the VGAs he said that we would see Big Picture PCs this year. With word that Xi3 received funding from Valve some of us, including myself, wondered if this Piston was Valve’s “Nexus” Steam Box.

Ben Krasnow, hardware engineer at Valve, comments in the video below about whether we have seen Valve’s canonical Steam Box or if there are any planned announcements for 2013.

Thank you Ben.

There seems to be some discrepancies between statements from Krasnow and Valve Managing Director, Gabe Newell. The major deviation concerns whether the official Steam Box will be based on Linux or another operating system. When interviewed by The Verge, Gabe Newell claimed the official box will be based on Linux with no unclear terms:

We’ll come out with our own and we’ll sell it to consumers by ourselves. That’ll be a Linux box, [and] if you want to install Windows you can. We’re not going to make it hard. This is not some locked box by any stretch of the imagination.

Krasnow in an email discussion with Engadget was somewhat more timid in future plans. The Engadget article was published on the same day as the The Verge interview which makes neither position particularly out of date. His statement:

"The box might be linux-based, but it might not," he continued. "It's true that we are beta-testing Left for Dead 2 on Linux, and have also been public about Steam Big Picture Mode. We are also working on virtual and augmented reality hardware, and also have other hardware projects that have not been disclosed yet, but probably will be in 2013."

At the same point this might all become irrelevant very quickly. As reported yesterday, Gabe Newell in the very same interview seemed to strongly suggest that post-Kepler GPUs will bring virtualization to the consumer market. If that is the case, then the only barrier between Linux and Windows would be for a company to provide a user-friendly virtual machine. Having your host operating system as one or the other would not particularly matter if the user could run gaming applications from the other platform.

Coverage of CES 2013 is brought to you by AMD!

PC Perspective's CES 2013 coverage is sponsored by AMD.

Follow all of our coverage of the show at http://pcper.com/ces!

Source: Engadget

CES 2013: ASUS Shows Off P9X79-E WS Motherboard for SB-E Processors

Subject: Motherboards | January 9, 2013 - 12:01 PM |
Tagged: workstation, usb 3.0, socket 2011, sandy bridge-e, p9x79-e, ces 2013, CES, asus

ASUS is showing off a new flagship X79 motherboard at CES called the P9X79-E WS. The workstation-class board is packed with hardware and ready to take Intel’s socket 2011-based Sandy Bridge-E processors to the extreme. The P9X79-E WS is of the E-ATX variety and features a LGA 2011 socket nestled between eight DDR3 DIMM slots. The board can support a maximum of 64GB clocked at 2400 MHz. An eight-pin CPU power and standard 24-pin ATX connector supplies power to the board while ASUS’ 10+2 phase DIGI+ VRM delivers clean power to the processor and memory.

ASUS-P9X79-E-WS.jpg

The P9X79-E WS uses the X79 PCH and features six SATA 6 Gbps ports and four SATA 3 Gbps ports. With seven total PCI-E 3.0 x16 expansion slots, the P9X79-E WS can support quad SLI or CrossfireX multi-GPU solutions.

ASUS P9X79-E WS Motherboard for Socket 2011 Processors.jpg

Rear IO on the ASUS motherboard includes the following ports:

  • 1 x combo PS/2 port
  • 7 x USB 2.0 ports
  • 2 x USB 3.0 ports (plus two additional USB 3.0 headers on the motherboard)
  • 1 x USB BIOS flash port and button
  • 2 x Gigabit Ethernet ports
  • 2 x eSATA ports
  • 6 x Analog audio ports
  • 1 x S/PDIF port
  • 1 x FireWire port

While not quite as outlandish as the Zeus and Wolverine prototype motherboards ASUS showed off at Computex, the P9X79-E WS is a high-end board that should actually see the light of day. Unfortunately, ASUS has not released any official pricing or availability for its new flagship X79 motherboard yet. WCCF Tech has several close up photos of the ASUS board worth looking at as well.

Coverage of CES 2013 is brought to you by AMD!

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Source: WCCF Tech

CES 2013 Video: NVIDIA GRID Cloud Gaming Technology

Subject: Graphics Cards, Shows and Expos | January 9, 2013 - 11:46 AM |
Tagged: video, nvidia, grid, cloud gaming, ces 2013, CES

Despite all the excitement about the NVIDIA Shield handheld gaming device at CES, the company was also heavily promoting its GRID Cloud Gaming Technology, marking another company that is promosing "game everywhere on everything".  NVIDIA's claims of lower latency thanks to rendering and encoding on the same GPU have really yet to be verified as the hands-on demos they had at the show were running on local servers (not exactly a real-world test...).

NVIDIA isn't planning on releasing a self-branded service to the public but instead wants to sell servers to ISPs and service providers to increase density (more games per server) and performance.  There are no current cloud gaming companies using GRID technology so it looks like we'll have to wait a bit longer to see it's true capabilities.

Coverage of CES 2013 is brought to you by AMD!

PC Perspective's CES 2013 coverage is sponsored by AMD.

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CES 2013 Video: Intel Demonstrates Power Efficiency of Clovertrail, Tegra 3 and Krait

Subject: Mobile | January 9, 2013 - 11:18 AM |
Tagged: video, tegra 3, qualcomm, power, nvidia, krait, Intel, clovertrail, ces 2013, CES

One of the more interesting demonstrations from CES thus far has come from Intel in the form of power consumption comparisons between three of the current tablet SoC solutions.  Intel pits the Clovertrail SoC against NVIDIA's Tegra 3 and Qualcomm's Krait in a battle of power efficiency during video playback.  What you'll see is that Intel's test shows the Clovertrail processor able to not only run near but surpass the power efficiency of the ARM-based processors shown.

This is an incredibly powerful collection of tools that Intel has presented and we are hoping to be able to dive into a similar level of detail in the future.  By utilizing direct monitoring of power VRMs on the processor we could even see the power consumption of the CPU cores in comparison to the GPU cores and even against the L2 cache in some instances. 

Intel is on a mission to prove that they are not only competitive today in the tablet SoC market but that they are a leader in the market.  More to follow!!

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CES 2013: MSI Launches A85XMA-E35 ATX Motherboard

Subject: Motherboards | January 9, 2013 - 08:21 AM |
Tagged: msi, fm2, ces 2013, CES, atx, APU, a85xma-e35

MSI has launched another micro ATX motherboard for AMD APUs using the FM2 socket called the A85XMA-E35. Measuring 24.4 x 22.8 cm, the motherboard packs a number of MSI technologies including the company’s ClickBIOS II UEFI BIOS and OC Genie II auto-overclocking software.

 

MSI A85XMA-E35 FM2 ATX Motherboard.jpg

The micro ATX board features the FM2 socket, two DDR3 DIMM slots (16GB max), six SATA 6 Gbps ports, the Realtek ALC887 audio chip, a TPM module, PCI slot, two PCI-E 2.0 x1 slots, and a single PCI-E 2.0 x16 expansion slot.

MSI A85XMA-E35.jpg

Rear IO on the A85XMA-E35 board includes one PS/2 port, six USB 2.0 ports, two USB 3.0 ports, one Gigabit Ethernet port, six analog audio jacks, and VGA, DVI, and HDMI video outputs.

In the end, the A85XMA-E35 board is very similar to the A85XMA-P33 motherboard covered earlier today. MSI has added beefier heatsinks, additional expansion slots, and HDMI output so it should carry a small premium over the other board. MSI has not released official pricing for the board yet, however.

You can find more specifications and photos of the FM2-A85XMA-E35 on company's product page.

Read more about micro ATX motherboards at PC Perspective.

Coverage of CES 2013 is brought to you by AMD!

PC Perspective's CES 2013 coverage is sponsored by AMD.

Follow all of our coverage of the show at http://pcper.com/ces!

Source: MSI

CES 2013: MSI Launches A85XMA-P33 Micro ATX Motherboard With FM2 Socket

Subject: Motherboards | January 9, 2013 - 07:39 AM |
Tagged: msi, micro ATX, mATX, fm2, ces 2013, CES, APU, amd, a85xma-p33

MSI announced a new micro ATX motherboard at CES this week. Aimed at supporting AMD’s APUs, the MSI A85XMA-P33 is a socket FM2 motherboard that is replacing the company’s existing A75MA-P33 motherboard. The new A85XMA-P33 is nearly identical to the previous board, but it uses AMD’s A85X chipset rather than the A75.

MSI A85XMA-P33.jpg

The A85XMA-P33 features the FM2 socket, two DDR3 DIMM slots, and six SATA 6 Gbps ports. It also has one legacy PCI slot, one PCI-E 2.0 x16 slot, and a single PCI-E 2.0 x1 slot.

Rear IO on the micro ATX motherboard includes two PS/2 ports, four USB 2.0 ports, two USB 3.0 ports (plus an additional 2 via motherboard header), three (6 channel) audio jacks, and a gigabit Ethernet port. Display outputs include a single DVI and a single VGA connector.

Other features include a five phase VRM and a UEFI BIOS. No official pricing has been announced yet, but you can expect it to be around the $70 mark. MSI has posted more photos and specifications on its website.

Read more about micro ATX motherboards at PC Perspective.

Coverage of CES 2013 is brought to you by AMD!

PC Perspective's CES 2013 coverage is sponsored by AMD.

Follow all of our coverage of the show at http://pcper.com/ces!

Source: Softpedia

CES 2013: Lenovo Shows Off Clover Trail+ Powered K900 Smartphone

Subject: Mobile | January 9, 2013 - 04:07 AM |
Tagged: CES, smartphone, Lenovo, k900, Intel, clover trail, Android, ces 2013

Lenovo has shown off a new Android smartphone at CES. However, in an interesting twist the new Lenovo K900 is powered by an Intel Atom processor rather than an ARM SoC. The K900 smartphone is constructed of a stainless steel alloy and poly-carbonate material. Lenovo has managed to pack all the hardware in a 6.9mm thin chassis that weights 162 grams. It will come in one of four colors, including gold, silver, and grey in a brushed aluminum pattern and one that has a diamond-plate design on the back cover.

The K900 features a 5.5” IPS touchscreen display protected by Gorilla Glass 2 and with a resolution of 1920x1080. The chassis also hosts a front-facing webcam with an 88-degree field of view and a rear 13MP (F1.8) camera with a dual LED flash.

Lenovo K900_Clover Trail(plus).jpg

The outside is neat, but it is the internal specifications where the Lenovo K900 gets interesting. The smartphone is powered by an Intel Clover Trail+ SoC. While Intel is not yet providing details on the new processor, Engadget speculates that the SoC will be the Intel Atom Z2580, which is a dual core Clover Trail successor running at up to 2GHz. The K900 will also include 2GB of RAM and between 16GB and 64GB of internal storage (plus a microSD card slot). The phone will be running Android along with Lenovo’s Le Phone skin on top (though it can reportedly be disabled).

All in all it looks like a really slick smartphone from the specifications list. Battery life and performance are still unknown, but I’m excited to see benchmarks of this once it is released. Unfortunately, it is not headed to the United States at this time. Instead, the Lenovo K900 will be available in China starting in April of this year. Pricing should be available closer to the product’s release date. Engadget has the full press release along with hands on videos with the hardware.

Coverage of CES 2013 is brought to you by AMD!

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Source: Engadget

CES 2013: Razer Edge Back Again. Fiona Always Was Edgy.

Subject: General Tech, Systems, Mobile, Shows and Expos | January 9, 2013 - 02:58 AM |
Tagged: CES, ces 2013, razer

Last year Project Fiona was presented by Razer and we felt as awkward about it as it looked.

This is a new year and it looks like Razer took a bit of feedback from critics of yester-CES. The design itself looks quite similar than it did except that the controller-handles are now detachable. The Edge can operate in four different modes: tablet, keyboard, the controller-handles, and “home console” mode.

The Home Console mode allows you to dock your tablet and access it using 3 USB ports, HDMI, and 3.5mm audio in/out. You can use it as a desktop or as a home theatre PC. Also with Steam’s Big Picture Mode it sees the big picture as a potential Steam Box.

The technical specifications are slightly more solid than last year:

  • Intel Core i7 (2 core, 4 threads) @ 1.9GHz Turbo to 3.0GHz
  • Intel HD 4000/NVIDIA GT 640M LE
  • 8GB DDR3
  • 126/256GB SSD
  • Intel WLAN (B/G/N + Bluetooth 4.0)
  • 10.1” IPS 1366x768 10-point touchscreen
  • Windows 8

So what do you think? While I expect it will be out of my budget and I would probably just barely survive on 256GB due to recent 20-25GB games -- I think it looks pretty good.

Coverage of CES 2013 is brought to you by AMD!

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Source: Razer

CES 2013: Panasonic Unveils Two New Ruggedized Toughpad Tablets Running Windows 8 and Android

Subject: General Tech | January 9, 2013 - 02:51 AM |
Tagged: CES, windows 8, toughpad, tablet, ruggedized, Panasonic, Android, ces 2013

Panasonic is continuing to branch out from ruggedized notebooks into the world of tablets, and this time around the company is releasing two new ruggedized tablets that succeed the current-generation FZ-A1. The new Panasonic Toughpad FZ-G1 will run Windows 8 Pro while the JT-B1 will run Android 4.0 and use ARM hardware.

-toughpad-fz-g1-2.jpg

The Panasonic Toughpad FZ-G1 packs some respectable hardware for this type of ruggedized product. A dual core (with HyperThreading for four total threads) Intel Core i5-3437U processor running at 1.9GHz base/2.9GHz turbo, up to 8GB of RAM, and up to a 256GB SSD comprise the basic internal specifications. On the outside is a 10.1” touchscreen with active digitizer along with USB 3.0, USB 2.0, HDMI, microSDXC, RJ45, and serial ports. The FZ-G1 can also host a dedicated GPS and tap into Wi-Fi, Bluetooth, and cellular networks. The tablet is rated for various Mil-spec standards such that it can survive harsh working environments of industrial, military, public safety, et al jobs. The tablet does not come cheap though, as the ruggedized form factor comes at a high price – starting at $2,899 for the base model. Still, it is interesting to see that tablets are even being embraced in roles that ruggedized notebooks have long dominated. Notably, Panasonic has stated that it hopes to capture 50% of the ruggedized tablet market by 2015.

Processor Intel Core-i5 3437U @ 1.9GHz (2.9GHz turbo)
Memory 4-8GB
Storage 128-256GB SSD
Display 10.1" touchscreen w/ active digitizer @ 1920x1200
IO Full size: USB 3.0, HDMI, micro SDXC (optional), USB 2.0, LAN, and serial port or dedicated GPS.
Wireless 802.11 a/b/g/n Wi-Fi, Bluetooth 4.0, optional 4G LTE or 3G
Dimensions 10.6" x 7.4" x 0.75"
Weight 2.43 lbs
OS Windows 8 Pro
Rugged MIL-STD-810G, 4' drop, IP65, 14° to 122°F (operational temp range)

While the FZ-G1 runs Windows and has x86-64 hardware, the Panasonic Toughpad JT-B1 is smaller and goes with ARM internals and Google’s Android mobile OS. This 7” tablet maintains the same MIL-spec ratings as its bigger sibling, but weighs half as much. The JT-B1 features a 7” touchscreen with a resolution of 1024x600, a front and rear camera, and a micro USB port on the outside. Internally, the JT-B1 tablet includes a dual core TI OMAP 4660 (similar to the SoC used in Amazon’s Kindle HD tablets) running at 1.5GHz, 1GB of RAM, 16GB ROM for storage, and Wi-Fi, Bluetooth, and cellular radios.

toughpad-jt-b1.jpg

The Panasonic JT-B1 will run Android 4.0 and has a starting price of $1,199 making it only viable for the specialized industries that need such a ruggedized device--it is no Nexus 7 (but that’s a good thing for certain jobs).

Processor TI OMAP 4460 @ 1.5GHz (dual core)
Memory 1GB
Storage 16GB ROM
Display 7" touchscreen @ 1024x600
IO Micro USB, Front 1.3MP webcam, rear 13MP autofocus camera with LED flash
Wireless 802.11 a/b/g/n Wi-Fi, Bluetooth 4.0, optional 4G LTE and 3G
Dimensions 8.7"x 5.1" x 0.7"
Weight 1.2 lbs
OS Android 4.0
Rugged MIL-STD-810G, 5' drop, IP65, 14° to 122°F (operational temp range)

Both of the Panasonic Toughpads will be available later this year. The FZ-G1 will be available in March for $2,899 and the JT-B1 will be available in February for $1,199. You can find the full press release over at Engadget.

Tablet Pricing (base) Availability
Panasonic FZ-G1 $2,899 March
Panasonic JT-B1 $1,199 February

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PC Perspective's CES 2013 coverage is sponsored by AMD.

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Source: Engadget