Subject: Processors | November 20, 2014 - 01:31 PM | Josh Walrath
Tagged: amd, APU, carrizo, Carrizo-L, Kaveri, Excavator, Steamroller, SoC, Intel, mobile
AMD has certainly gone about doing things in a slightly different manner than we are used to. Today they announced their two latest APUs which will begin shipping in the first half of 2015. These APUs are running at AMD and are being validated as we speak. AMD did not release many details on these products, but what we do know is pretty interesting.
Carrizo is based on the latest iteration of AMD’s CPU technology. Excavator is the codename for these latest CPU cores, and they promise to be smaller and more efficient than the previous Steamroller core which powers the latest Kaveri based APUs. Carrizo-L is the lower power variant which will be based on the Puma+ core. The current Beema APU is based on the Puma architecture.
Roadmaps show that the Carrizo APUs will be 28 nm products, presumably fabricated by GLOBALFOUNDRIES. Many were hoping that AMD would make the jump to 20 nm with this generation of products, but that does not seem to be the case. This is not surprising due to the limitations of that particular process when dealing with large designs that require a lot of current. AMD will likely be pushing for 16 nm FinFET for the generation of products after Carrizo.
The big Carrizo supposedly has a next generation GCN unit. My guess here is that it will use the same design as we saw with the R9 285. That particular product is a next generation unit that has improved efficiency. AMD did not release how many GCN cores will be present in Carizzo, but it will be very similar to what we see now with Kaveri. Carrizo-L will use the same GCN units as the previous generation Beema based products.
I believe AMD has spent a lot more time hand tuning Excavator instead of relying on a lot of automated place and route. This should allow them to retain much of the performance of the part, all the while cutting down on transistor count dramatically. Some rumors that I have seen point to each Excavator module being 40% smaller than Steamroller. I am not entirely sure they have achieved that type of improvement, but more hand layout does typically mean greater efficiency and less waste. The downside to hand layout is that it is extremely time and manpower intensive. Intel can afford this type of design while AMD has to rely more on automated place and route.
Carrizo will be the first HSA 1.0 compliant SOC. It is in fact an SOC as it integrates the southbridge functions that previously had been handled by external chips like the A88X that supports the current Kaveri desktop APUs. Carrizo and Carrizo-L will also share the same infrastructure. This means that motherboards that these APUs will be soldered onto are interchangeable. One motherboard from the partner OEMs will be able to address multiple markets that will see products range from 4 watts TDP up to 35 watts.
Finally, both APUs feature the security processor that allows them access to the ARM TrustZone technology. This is a very small ARM processor that handles the secure boot partition and handles the security requests. This puts AMD on par with Intel and their secure computing solution (vPro).
These products will be aimed only at the mobile market. So far AMD has not announced Carrizo for the desktop market, but when they do I would imagine that they will hit a max TDP of around 65 watts. AMD claims that Carrizo is one of the biggest jumps for them in terms of power efficiency. A lot of different pieces of technology have all come together with this product to make them more competitive with Intel and their process advantage. Time will tell if this is the case, but for now AMD is staying relevant and pushing their product releases so that they are more consistently ontime.
Subject: General Tech | October 7, 2014 - 12:57 PM | Jeremy Hellstrom
Tagged: mobile apu, Excavator, Carrizo-L, carrizo, amd, 28nm
Kaveri, Beema and Mullins are on their way out to be replaced by the Excavator based Carrizo family towards the end of the year. We can hope they will appear in products in time for Christmas as the low power Carrizo-L, rumoured to be around 12-35W TDP, will arrive. In the new year the more powerful Carrizo, speculated at 45-65W TDP, will be available. It is unclear how long the delay will be between availability to system builders and the products appearing on the market. The chips will support DDR3, contain a GPU based on GCN 3.0 and stacked on-package memory which will be accessible by Through Silicon Via to act as a sort of L3 cache for HSA applications. DigiTimes also mentions it will run Win8 and Win10 as well as SLED.
"AMD is planning to announce next-generation Carrizo APUs in March 2015 to replace its existing Kaveri APUs for the mainstream performance notebook segment and will release Carrizo-L APUs for the entry-level notebook segment in December 2014 at the earliest to challenge Intel's Pentium and Celeron processors, according to sources from notebook players."
Here is some more Tech News from around the web:
- Hard for Samsung to compete with TSMC for Apple A9 processor orders, say Taiwan makers @ DigiTimes
- Hot DRAM! Samsung splurges $15 BILLION on Korean chip fab @ The Register
- Windows 10 Technical Preview hands-on review @ The Inquirer
- A Production-Ready Flying Car Is Coming This Month @ Slashdot
- Win an X99S Gaming 7 motherboard with KitGuru and MSI
Subject: General Tech | August 27, 2013 - 12:30 PM | Jeremy Hellstrom
Tagged: amd, roadmap, 2014, Kaveri, Kabini, carrizo, beema, Excavator, Nolan, 2015, socket sf1b
As is usually the case, AMD will not comment on the accuracy of DigiTimes information but as we have seen in the past their roadmaps have been spot on. Over the next 8 months or so will see the arrival of the Hawaii GPU family and the entrance of Kaveri and Kabini chips, nothing new there but good to have independent confirmation. In the latter part of 2014 and 2015 things are a little more interesting as Beema will replace Kabini with an HSA compliant architecture and use a new socket called FS1B. In 2015 Beema will be replaced by a chip called Nolan and we will finally see the Excavator based Carrizo which are slated to have 45W and 65W versions.
You can expect to see FM1 and AM3 phased out of active production by the end of 2013, with AM3+ and FM2 being the two active sockets until FS1B arrives.
"AMD has recently updated its product roadmap and is set to release its Hawaii-based GPUs at the end of September, Kaveri-based APUs for the high-end segment and Kabini-based APUs for the entry-level segment in the first quarter of 2014, according to sources from the upstream supply chain."
Here is some more Tech News from around the web:
- What Surface RT flop? Nokia said to be readying WinRT slab for September @ The Register
- Java 6 exploit found in the wild @ The Inquirer
- Chlorine has got graphene covered @ Nanotechweb
- Samsung will launch a 55in curved OLED 3D TV in the UK on 5 September @ The Inquirer
- The 20 most bizarre and innovative motherboards: 1999 - 2010 @ Hardware.Info
- NAND flash vendors gearing up for 3D chips @ DigiTimes
- Epic Games’ Tim Sweeney and AMD don’t see eye-to-eye on hUMA @ VR-Zone
- Linksys Smart Wi-Fi Router EA6500 @ Kitguru
- TP-Link TL-PA551KIT AV550+ Gigabit Powerline Kit With AC Passthrough @ eTeknix
- Making S’mores with 50,000 Volts @ Hack a Day
Subject: Processors | July 31, 2013 - 03:59 AM | Tim Verry
Tagged: Kaveri, fm2, carrizo, APU, amd radeon, amd
Rumors recently surfaced via VR-Zone china that AMD’s Kaveri APU successor will be code-named Carrizo, and it will be compatible with the upcoming FM2+ socket and AMD A88X chipset that Kaveri will use.
AMD’s Carrizo APUs will reportedly be available in TDPs up to 65W and will feature Excavator CPU cores along with a next generation Radeon GPU. Much like Kaveri, Carrizo will be fully HSA compliant. The chips will also include support for DDR4.
Carrizo will allegedly begin sampling in August 2014 with mass production starting around December. That means Carrizo will be available for purchase within the first half of 2015.
FM2+ boards like the ASUS A55BM-A/USB3 are rumored to support AMD's Carrizo APUs (the successor to Kaveri).
The rumors also suggest that Carrizo will be joined by a low power “Beema” System on a Chip (SoC) and a BGA-based Nolan APU for embedded systems. Details on these complementary chips are scarce, however. Perhaps most telling is last bit of the article that suggests that AMD will not be releasing a AM3+ Vishera CPU-only processor successor. It seems AMD is going all in as an APU company after all.
I have been looking forward to the launh of AMD's Kaveri since AFDS 2012, and Carrizo appears to be a refinement of that chip. It should be more power efficient and faster thanks to architecture tweaks and process shrinks. I think that AMDs architecture and HSA approach has potential, and I'm excited to see what these upcoming chips can do with regards to performance.