Subject: General Tech | October 17, 2013 - 01:06 PM | Jeremy Hellstrom
Tagged: Intel, Broadwell, delay
Making changes to the CPU in a line of machines creates a much larger impact on a company than changing the GPU, as even if the socket remains the same there are often feature additions and other obstacles to overcome. DigiTimes points out that for vendors who are still rolling out new product lines based on Haswell the delay of Broadwell is good news as it gives them time to sell a few Haswell machines before the chip goes EOL. For consumers looking forward to the discounts on this generation of machine when the next generation is released this news is not as welcome but then again, vendors won't need to recover as much lost income as they would have if Broadwell was released according to its original schedule.
"Intel's decision to delay the mass shipment schedule of its 14nm Broadwell-based processors by one quarter from the end of 2013 is expected to buy brand vendors some time to finish their transition from Ivy Bridge to Haswell and allow them and Intel to readjust their steps in platform transitioning, according to sources from notebook players."
Here is some more Tech News from around the web:
- Early adopters struggle with Windows 8.1 update @ The Inquirer
- Microsoft saddles up for a ride on Sky Giraffe @ The Register
- Quark will not be enough for Intel to succeed in wearable or IoT markets @ DigiTimes
- Slip your SIM into a plastic sheath, WIPE international call charges @ The Register
- Rorschach test suggested as CAPTCHA replacement @ The Register
- iPin Mobile Laser Presenter for iPhone @ Funky Kit
- Papa's got a brand-new, undead-proof European carryall @ The Tech Report
Subject: General Tech | October 16, 2013 - 01:12 PM | Jeremy Hellstrom
Tagged: Intel, delay, Broadwell, 14nm
Sad news for those hoping to see Broadwell as Brian Krzanich confirmed that the delays we first heard about in June are still true and Broadwell will not be available until some time in 2014. This slowdown of their Tick Tick strategy has been caused by the high density of defects on wafers which is driving the yields down on these chips which not only leads to less profitability but also means that supplies will be too low to go to market with. He did give The Register some positive news, Intel is working on reducing the time it takes to implement changes to chips in production and within the next year they hope to be able to make changes to a chip three months before it is slated for release without negatively effecting yeilds.
"One of the biggest tasks that Intel CEO Brian Krzanich has set himself is reconfiguring Chipzilla so that it's quicker to build and deploy new products.
So it's a pity he has had to delay the rollout of 14-nanometer Broadwell processor chips until the first quarter of next year due to problems with quality control."
Here is some more Tech News from around the web:
- Intel slumps into mud despite lobbing Internet-of-Things, etc at buyers @ The Register
- How to Code Android Applications With Security In Mind @ Linux.com
- HGST pushes out bulk storage spinner with 5 power-sipping settings @ The Register
- Samsung's Green DDR4 data centre memory can save 45 terawatts per hour @ The Inquirer
- 35,000 vBulletin Sites Have Already Been Exploited By Week Old Hole @ Slashdot
- Building a Rail Gun @ Hack a Day
- Backup4all Professional and novaPDF Professional @ Computing on Demand
Subject: General Tech | September 10, 2013 - 02:29 PM | Tim Verry
Tagged: Intel, idf 2013, idf, haswell, fanless, convertible tablet, Broadwell, 14nm
New Intel CEO Brian Krzanich took the stage at IDF 2013 to talk about Intel's future and the PC market. The CEO believes that there is more innovation in the PC than ever before as the company introduces new Haswell and Broadwell chips, new form factors are being experimented with, and Intel moves from traditional CPU to SoC type of architectures.
Two such chips that Intel showed off that are aimed at consumer PCs include a new Haswell-Y chip and the launch of a 14nm Broadwell SoC.
Haswell Y is an ultra low power variant of the Haswell processors that have been avaialble in desktops since June. This new chip is a 4.5W TDP chip that will enable fanless mobile devices such as laptops and slate tablets. The x86-64 chip will allow fanless mobiles that run Windows and should be a good bit more powerful than current Atom-powered Windows mobiles!
A fanless Haswell Y system.
In addition to Haswell Y, Intel is introducing a 14nm Broadwell SoC. The Broadwell chips will be used in both servers and consumer products in 2014.
The 14nm Broadwell SoC.
Interestingly, it looks like Intel is well on its way to shipping chips as Intel showed off a working laptop with the Broadwell chip at IDF today. Further, Intel announced that the Broadwell chips will be shipping by the end of the year!
A 14nm Broadwell-powered laptop.
Stay tuned to PC Perspective for more information!
Subject: General Tech | July 23, 2013 - 03:44 PM | Jeremy Hellstrom
Tagged: Intel, atom, 14nm, Avoton, Broadwell, Denverton, xeon, rangeley
Intel has spent the day announcing new products for the server room, from new Atoms to Xeons. Atom will bear the names of Avoton and Rangeley, Avoton will deal with microservers where power and heat are a major concern while Rangeley will appear in network devices and possibly mobile communication devices. In the case of Avoton it will be replacing a chip that has not yet been released, the 32nm Atom S1200 lineup is due out in the near future and will fill a new niche for Intel that Centerton failed to fill. The Register talks a bit more indepth here.
Slightly more powerful will be new Broadwell and Denverton Xeons, the first SoC server chips from Intel which will be manufactured on the 14nm process. We heard much less about these upcoming chips, due for 2014 but you can read what is available at The Inquirer.
"SAN FRANCISCO: CHIPMAKER Intel has revealed more details about its server processor roadmap, including its upcoming Atom chips codenamed Avoton and Rangeley and new 14nm Xeon and Atom parts codenamed Broadwell and Denverton, respectively."
Here is some more Tech News from around the web:
- Multiple Raspberry Pi boards used to create video wall @ Hack a Day
- PIN-Cracking Robot To Be Showed Off At Defcon @ Slashdot
- Flexible PCB makers gearing up mass production for new iPhones @ DigiTimes
- ARM servers to gain boost from ARM, Oracle Java partnership @ The Register
- Linksys EA6700 review: dual-core high-end ac router @ Hardware.info
- UK flicks switch on 'I am a pervert' web filters @ The Register
- Win one of Raijintek's new CPU coolers @ Kitguru
Subject: Processors | June 21, 2013 - 09:39 AM | Tim Verry
Tagged: Intel, haswell, cpu, Broadwell, 14nm
Alongside the good news of 8-core Haswell-E parts, VR-Zone revealed an updated Intel road map that makes no mention of the 14nm Haswell architecture die shrink Broadwell. Broadwell was originally intended to be the next "tick" in Intel's yearly "tick-tock" chip release schedule set to release next year. If recent reports are true, this will no longer be the case. Instead, 2014 will be dominated (at least on the Intel side of things) by consumer Haswell and enthusiast-grade Haswell-E chips.
What is going on with Broadwell?
Broadwell is essentially supposed to be a CPU using the Haswell micro-architecture that is built on a (impressively) smaller 14nm manufacturing process. There may be a few minor tweaks to the architecture or updates to the instruction set extensions, but the big difference between Broadwell and Haswell is the die shrink from 22nm to 14nm. The die shrink will allow for better low-power performance and will be beneficial in battery-powered mobile devices first and foremost. Likely as a result of the main benefits being mobile parts, Intel has previously announced that Broadwell chips would be BGA only, which means that there would not be a traditional LGA socket-ed desktop part. Broadwell chips would only come soldered onto motherboards in bare-bones systems, laptops, and tablets for example.
Despite the small architectural differences, the die shrink alone is a monumental task. Intel needs to not only be able to shrink Haswell and its wealth of transistors to 14nm, but it has to do so in a way that allows them to get the yields and power efficiency characteristics that they want. This is extremely hard, and the move to manufacturing nodes below 22nm is going to get exceedingly difficult. Intel accomplished 22nm with its Tri-gate 3D transistors, but with 14nm they are going to have to push beyond that, and even with its huge money vault, physics is working against them in a big way here. As a result of the huge challenges of moving to 14nm, it seems at this point that Broadwell will not be ready in time for a 2014 launch after all. Instead, Intel is now shooting for a 2015 launch of the BGA Broadwell chips alongside the LGA (socket-ed) 14nm Sky Lake processors (the "tock" to Broadwell's "tick").
Some enthusiasts and media have painted the Broadwell delay to be, at least in part, due to less competition from AMD. That is possible, but I can't help but thinking that slowing down Broadwell is the last thing Intel would want to do. The sooner Intel is able to move its Haswell (and future) micro-architecture-based chips to 14nm and beyond, the sooner AMD is put all that much farther behind. If Intel had managed 14nm Broadwell in 2014, AMD would have been screwed out of a lot of SFF NUC-type systems as well as mobile devices as they would not really be able to compete on performance or power efficiency! (Then Intel could happily focus on trying to bring down ARM in the mobile space, which it seems to want to do heh.) In some internal discussion with PC Perspective's Josh Walrath, I think that Intel would have loved to bring 14nm chips next year but, because of manufacturing process woes, the chips are simply not ready.
The new plan: Refresh Haswell in 2014 with a new Z97 chipset
Now, with the launch of Broadwell moved back to at least 2015, consumers will now be presented with a refresh of 22nm Haswell chips on the consumer side around Q2 2014 and the upcoming launch of enthusiast-platform Haswell-E processors in the second half of 2014.
The Haswell (LGA 1150) refresh will include better binned chips with a lineup that is likely to see a slight speed bump in stock clockspeed across the board as well as an updated Z97 chipset. The new chipset will support 1000 MB/s SATA Express and boot-level malware protection technology in the form of Intel Device Protection and Boot Guard. Granted motherboards using the updated Z97 chipset are not going to be all that alluring to those users already running Z87 chipsets with their Haswell processors. However, users that have not yet upgraded might as well go with the newer chipset and enjoy the small tweaks and benefits that go along with it. In other words, if you were holding out waiting to upgrade to a Broadwell CPU plus motherboard combo, you are going to be waiting at least another year. You will be able to grab a refreshed Haswell CPU and a Z87 or Z97 chipset-based motherboard next year though (which should still be a healthy upgrade if you have a pre-Sandy Bridge system).
Also worth noting is that if you have already upgraded to Haswell, you can rest easy knowing that you have at least another year of your chip being the newest model--quite a feat considering how fast the tech world traditionally moves!
On the other hand, if Haswell just isn't fast enough, there is always Haswell-E to look forward to in 2014! Haswell-E will bring 8-core, 16-thread chips with 20MB of L3 cache (up to ~140W TDP) and the X99 chipset, which should keep the top-end enthusiast market happy no matter the state of Broadwell.
I'm looking forward to more details regarding the 14nm manufacturing process, and hoping that once the chips are on the way the company will be willing to talk about some of the challenges and issues they faced moving to such a small process node (perhaps at IDF? One can hope.) In the mean time, Haswell has another year to shine and make Intel money while AMD works on its HSA and APU strategies.
What do you think about the 14nm Broadwell delay? Does it impact you, or were you waiting for Haswell-E anyway?
Moving Towards BGA Only?
The sky is falling. Does this mean that Chicken Little is panicking for no reason or is Chicken Little the Cassandra of our time? It has been widely reported that Intel will not be offering the next generation Broadwell architecture as a LGA based product. Broadwell is a 14 nm product that will integrate southbridge functions into the chip, making it essentially a SOC. It will be offered only as a BGA only product, which means that it will be soldered onto a motherboard with no chance of being able to be swapped out. Broadwell is the successor to the upcoming Haswell, itself a 22 nm product that features many architectural changes to both the CPU and graphics portion as compared to the current 22 nm Ivy Bridge.
Will Broadwell be the death of the desktop industry and enthusiasts? Will LGA become as scarce as chicken teeth? Will we ever see a product with a swappable CPU after 2014?
Broadwell is aimed at TDPs ranging from 10 watts to 57 watts. Current high end Ivy Bridge parts max out at 77 watts and do not feature any southbridge type functionality. So that means that another 5 to 7 watts are added in for the chipset when discussing basic system TDPs. So we are looking at around 87 watts for a top end product when including SATA and USB functionality. 30 watts is a pretty big deal in OEM circles. We see right off the bat that Intel is aiming this architecture at a slightly different market, or at least a changing marketplace.
The unease that we are seeing is essentially this; Intel appears to be trying to take more profits from this setup and pass more costs onto the motherboard industry. This is not necessarily new for Intel, as they did this when transitioning to the LGA socket. LGA sockets are more expensive and more troublesome for the motherboard manufacturers as compared to a more traditional pin based interface. AMD continues to use pin based chips as this lowers the cost that is incurred by the motherboard manufacturers, and it also lowers overall support issues. LGAs are pretty solid, but it is very easy to bend one or more of those contacts so that they in fact do not create a solid connection with the CPU. This is something that is uncommon with pin based CPUS, but the downside of pin based is that it is more expensive to produce the CPU in the first place as compared to a LGA chip which only features the pads on the substrate of the CPU.
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