Subject: Systems | March 25, 2013 - 01:14 PM | Jeremy Hellstrom
Tagged: arm, calxeda, Boston Viridis
Perhaps the most telling part of AnandTech's review of the Calxeda Boston Viridis server was the statement that "It's a Cluster, Not a Server" as that paints a different picture of the appliance in many tech's heads. When you first open the chassis you are greeted by 24 2.5” SATA drive bays and a very non-standard looking motherboard full of PCIe slots, each of which can hold a EnergyCard which consists of four quad-core ARM SoCs, each with one DIMM slot and 4 SATA ports with the theoretical limit being 4096 nodes interconnected by physical, distributed layer-2 switches not virtualized switches which use CPU cycles. Check out the results of AnandTech's virtual machine testing and a deeper look at the architecture of the cluster in the full article.
"ARM based servers hold the promise of extremely low power and excellent performance per Watt ratios. It's theoretically possible to place an incredible number of servers into a single rack; there are already implementations with as many as 1000 ARM servers in one rack (48 server nodes in a 2U chassis). What's more, all of those nodes consume less than 5KW combined (or around 5W per quad-core ARM node). But whenever a new technology is hyped, it's important to remain objective. The media loves to rave about new trends and people like reading about "some new thing"; however, at the end of the day the system administrator has to keep his IT services working and convince his boss to invest in new technologies."
Here are some more Systems articles from around the web:
- MESH Slayer 3770K OC System @ Kitguru
- Apple iMac 27 inch 2012 review: Core i7, GTX 680MX and Fusion Drive @ Hardware.info
- ARIA Gladiator Warbird 660 i5-3570K GTX660 SLI OC @ Kitguru
- Digital Storm Bolt Desktop Gaming PC @ Tweaktown
- Gateway One ZX4970G-UW308 Review @ TechReviewSource
Linaro Forms Linux Networking Group to Collaborate on Open Source Software for ARM Networking Hardware
Subject: General Tech | February 22, 2013 - 02:16 AM | Tim Verry
Tagged: oss, open source, networking, linux networking group, linux, linaro, arm
Linaro, a non-profit engineering group, announced a new collaborative organization called the Linux Networking Group at the Embedded Linux Conference in San Francisco this week. The new group will work on developing open source software to be used with ARM-based hardware in cloud, mobile, and networking industry sectors. Of course, being open source, the software for ARM SoCs will be used with Linux operating systems. One of the Linux Networking Group’s purposes is to develop a new “enhanced core Linux platform” for networking equipment, for example.
The new Linux Networking Group is currently comprised of the following organizations:
- Nokia Siemens Networks
- Texas Instruments
The new cooperative has announced four main goals for 2013:
- "Virtualization support with considerations for real-time performance, I/O optimization, robustness and heterogeneous operating environments on multi-core SoCs.
- Real-time operations and the Linux kernel optimizations for the control and data plane.
- Packet processing optimizations that maximize performance and minimize latency in data flows through the network.
- Dealing with legacy software and mixed-endian issues prevalent in the networking space."
Reportedly, Linaro will have an initial software release within the first half of this year. Further, the organization will follow up with monthly software updates to improve performance and add new features. More collaboration and the furthering of ARM-compatible open source software is always a good thing. It remains to be seen how useful the Linux Networking Group will be in pushing its ARM software goals, but here’s hoping it works out for the best.
The full press release can be found below.
Subject: General Tech | February 18, 2013 - 01:52 PM | Jeremy Hellstrom
Tagged: winRT, arm, x86 emulator
While there was a previous hack which allowed you to run unsigned applications on WinRT devices it would not survive a reboot and so needed to be reapplied. A programmer at XDA Developers has created a similar and improved tool which functions as a limited 32bit x86 emulator on WinRT. Once you unlock your device and install the software, which is still in beta, you will be able to run a number of older games and a number of simple applications. One thing it cannot do at this point is launch an x86 program from within an emulated x86 program so some installers will not function if they rely on decompressing and launching a second program. Check out the latest version of the software and the FAQ by following the link from Hack a Day.
"It seems with a lot of black magic, [mamaich] over at the XDA Developers forum has a solution for us. He’s created a tool for running x86 Win32 apps on Windows RT. Basically, he’s created an x86 emulator for ARM devices that also passes Windows API calls to Windows RT."
Here is some more Tech News from around the web:
- Microsoft’s Office 2013 software licence can’t be transferred to another PC @ The Inquirer
- Ready or not: Microsoft preps early delivery of IE10 for Windows 7 @ The Register
- Interactive Tool Visualizes Tolkien's Works @ Slashdot
- NVIDIA Free-to-Play Reviewed @ OCC
- Canonical will release Ubuntu smartphone software on 21 February @ The Inquirer
- Light Virtualization and Instant Recovery Software: A great overall safety net for your computer @ Tweaktown
- Survey shows Americans treat mobile devices as best friends, says Citrix @ DigiTimes
Subject: General Tech | February 10, 2013 - 12:45 PM | Tim Verry
Tagged: SFF, Raspberry Pi, camera, arm
The Raspberry Pi Foundation has been working on offering a camera attachment for Raspberry Pi boards for some time now. The developers began with a 41MP sensor, but have since moved to a smaller (and cheaper) camera with a 5MP sensor. That particular model is nearly complete and should be available for purchase sometime this spring, according to the developers.
The Raspberry Pi camera will be $25 which aligns itself well with the recently released Model A Raspberry Pi computer (which is also $25). The PCB hosting the camera module measures 20 x 25 x 10mm, while the camera module itself measures 8.5 x 8.5 x 5mm. It connects to the Raspberry Pi board via a flat cable into the CSI port below the Ethernet jack.
The $25 camera is capable of capturing HD video as well as stills. It uses the Omnivision OV5647 sensor and a fixed focus lens. The 5MP sensor is capable of capturing still photos with a pixel resolution of 2592 x 1944 and up to 1080p video. While the developers are still working on the kinks to ensure that it the camera can do this, the sensor itself is capable of 1080p30, 720p60, and 640x480p90 video capture. The Raspberry Pi Foundation has stated that at least the 1080p30 capture mode is working.
Interestingly, the Raspberry Pi ISP hardware can support two cameras, but the PCB only provides a single CSI connector (so no 3D image capture using two cameras). The Raspberry Pi Foundation is providing this little CSI camera as an alternative to USB cameras. While it is possible to use USB cameras with the Raspberry Pi, USB driver overhead and USB bandwidth issues specific to the Raspberry Pi limit the performance that you can get out of USB cameras. The $25 CSI camera add-on bypasses the USB interface in favor of the CSI port that feeds into the image processing parts of the ARM SoC.
The developers have not released an exact weight measurement, but have described it as being rather lightweight--making it ideal for use in drones, weather balloons, and other flying projects. For more information, the developers have set up a forum thread to answer questions and keep interested users updated on the project status.
Subject: General Tech | February 5, 2013 - 05:32 AM | Tim Verry
Tagged: Raspberry Pi, model a, cheap computer, arm
The Raspberry Pi Foundation has announced that its Model A computer is (finally) available for purchase in Europe. The Raspberry Pi Model A is the small computer that the foundation originally pitched as the low-cost $25 PC. The other computer is the Model B, which has been available for some time now. The Model A is a stripped down version of the Model B covered previously. It features a single USB port, and half of the RAM of the latest Model B at 256MB. Further, there is no Ethernet jack on the model B, so users wanting Internet access will have to grab a USB NIC.
The Model A PC. Notice the lack of Ethernet support.
The Model A is powered by the same Broadcom BCM2835 chipset as the Model B. That includes an ARM1176JZFS processor clocked at 700MHz and a Videocore 4 GPU. The GPU is capable of hardware accelerating H.264 video decodes at up to 1080p30 and 40Mbps video. The GPU is rated at 24 GLOPS general compute performance, and it supports the OpenGL ES2.0 and OpenVG libraries.
Interestingly, the Model A was originally planned to have a mere 128MB of RAM, but with the update of the Model B to 512MB RAM, the Raspberry Pi Foundation was also able to include twice the RAM in the Model A while maintaining the $25 price point.
The underside of the Raspberry Pi Model A.
The Model A reportedly uses as much as a third of the power as the Model B, which makes it ideal for projects that will run off of battery or renewable energy sources--like solar. The Raspberry Pi Foundation suggests that the Model A will be useful in robotics and networking projects, for example.
The Model A Raspberry Pi PC is currently available in Europe, but US availability is coming soon. It will cost $25, but you will also need at least an SD card for the operating system and a DC power source (like a cell phone wall charger with male micro USB connector). The promised $25 PC is finally here (at least for those on the other side of the pond). What will you be using it for?
Read more about the Raspberry Pi at PC Perspective.
Subject: General Tech | January 17, 2013 - 01:56 PM | Jeremy Hellstrom
Tagged: cardboard, APC, ice cream sandwich, arm, Cortex A9, VIA
APC has released a version of their Rock PC called the Paper which comes in a recycled cardboard case which resembles a hard cover book. Powered by a Cortex A9 based Via Wondermedia chip running at 800MHz, 512GB of RAM and 4GB of NAND storage and sporting a pair of USB ports, ethernet and HDMI this Ice Cream Sandwich system is great for browsing the web. At an MSRP of $100 it is an interesting device, almost as expensive as a tablet but in a very different form factor, if it could be convinced to act as an HTPC you could hide it in your bookshelf and only the wiring would give it away as anything but another book. Check out more at The Inquirer.
"TAIWANESE TECHNOLOGY FIRM APC has shown off a PC that comes in a book-like cardboard case.
The firm calls its under $100 PC Paper, because it comes with a cardboard case that looks like a book. Inside Paper is the firm's redesigned Rock board. Both run Android and both are designed for mouse and keyboard inputs."
Here is some more Tech News from around the web:
- Applied Micro ARM servers all over Open Compute Project @ The Register
- AMD+friends forge 'Roadrunner' Open Compute server mobo @ The Register
- Lenovo reportedly to directly procure PCBs @ DigiTimes
- New Phishing Toolkit Uses Whitelisting To 'Bounce' Non-Victims @ Slashdot
- Apple's 10-Year Run: where they succeeded and others were too lazy to innovate @ Techspot
- CES 2013: OCZ Shows Off Epic Storage Z-Drive R4 @ FunkyKit
- TechwareLabs CES 2013 Coverage: Kopi
- CES 2013 Coverage Day 1: LG, Qualcomm, Samsung, NVIDIA, Intel, and Corsair @ Hi Tech Legion
Subject: Editorial | January 16, 2013 - 09:41 PM | Josh Walrath
Tagged: ST Ericsson, planar, PD-SOI, L8580, FinFET, FD-SOI, Cortex A9, cortex a15, arm
SOI has been around for some time now, but in partially depleted form (PD-SOI). Quite a few manufacturers have utilized PD-SOI for their products, such as AMD and IBM (probably the two largest producers of SOI based parts). Oddly enough, Intel has shunned SOI wafers altogether. One would expect Intel to spare no expense to have the fastest semiconductor based chips on the market, but SOI did not provide enough advantages for the chip behemoth to outweigh the nearly 10% increase in wafer and production costs. There were certainly quite a few interesting properties to PD-SOI, but Intel was able to find ways around bulk silicon’s limitations. These non-SOI improvements include stress and strain, low-K dialectrics, high-K metal gates, and now 3D FinFET Technology. Intel simply did not need SOI to achieve the performance they were looking for while still using bulk silicon wafers.
Things started looking a bit grim for SOI as a technology a few years back. AMD was starting to back out of utilizing SOI for sub-32 nm products, and IBM was slowly shifting away from producing chips based on their Power technology. PD-SOI’s days seemed numbered. And they are. That is ok though, as the technology will see a massive uptake with the introduction of Fully Depleted SOI wafers. I will not go into the technology in full right now, but expect another article further into the future. I mentioned in a tweet some days ago that in manufacturing, materials are still king. This looks to hold true with FD-SOI.
Intel had to utilize 3D FinFETs on 22 nm because they simply could not get the performance out of bulk silicon and planar structures. There are advantages and disadvantages to these structures. The advantage is that better power characteristics can be attained without using exotic materials all the while keeping bins high, but the disadvantage is the increased complexity of wafer production with such structures. It is arguable that the increase in complexity completely offsets the price premium of a SOI based solution. We have also seen with the Intel process that while power consumption is decreased as compared to the previous 32 nm process, the switching performance vs. power consumption is certainly not optimal. Hence the reason why we have not seen Intel release Ivy Bridge parts that are clocked significantly faster than last generation Sandy Bridge chips.
FD-SOI and planar structures at 22 nm and 20 nm promise the improve power characteristics as compared to bulk/FinFET. It also looks to improve overall power vs. clockspeed as compared to bulk/FinFET. In a nutshell this means better power consumption as well as a jump in clockspeed as compared to previous generations. Gate first designs using FD-SOI could be very good, but industry analysts say that gate last designs could be “spectacular”.
So what does this have to do with ST Ericsson? They are one of the first companies to show a products based on 28 nm FD-SOI technology. The ARM based NovaThore L8580 is a dual Cortex A9 design with the graphics portion being the IMG SGX544. At first glance we would think that ST is behind the ball, as other manufacturers are releasing Cortex A15 parts which improve IPC by a significant amount. Then we start digging into the details.
The fastest Cortex A9 designs that we have seen so far have been clocked around 1.5 GHz. The L8580 can be clocked up to 2.5 GHz. Whatever IPC improvements we see with A15 are soon washed away by the sheer clockspeed advantage that the L8580 has. While it has been rumored that the Tegra 4 will be clocked up to 2 GHz in tablet form, ST is able to get the L8580 to 2.5 GHz in a smartphone. NVIDIA utilizes a 5th core to improve low power performance, but ST was able to get their chip to run at 0.6v in low power mode. This decrease in complexity combined with what appears to be outstanding electrical and thermal characteristics makes this a very interesting device.
The Cortex A9 cores are not the only ones to see an improvement in clockspeed and power consumption. The well known and extensively used SGX544 graphics portion runs at 600 MHz in a handheld device, and is around 20% faster clocked than other comparable parts.
When we add all these things together we have a product that appears to be head and shoulders above current parts from Qualcomm and Samsung. It also appears that these parts are comparable, if not slightly ahead, of the announced next generation of parts from the Cortex A15 crowd. It stands to reason that ST Ericsson will run away with the market and be included in every new handheld sold from now until the first 22/20 nm parts are released? Unfortunately for ST Ericsson, this is not the case. If there was an Achilles Heel to the L8580 it is that of production capabilities. ST Ericsson started production on FD-SOI wafers this past spring, but it was processing hundreds of wafers a month vs. the thousands that are required for full scale production. We can assume that ST Ericsson has improved this situation, but they are not exactly a powerhouse when it comes to manufacturing prowess. They simply do not seem to have the FD-SOI production capabilities to handle orders from more than a handful of cellphone and table manufacturers.
ST Ericsson has a very interesting part, and it certainly looks to prove the capabilities of FD-SOI when compared to competing products being produced on bulk silicon. The Nova Thor L8580 will gain some new customers with its combination of performance and power characteristics, even though it is using the “older” Cortex A9 design. FD-SOI has certainly caught the industrys’ attention. There are more FD-SOI factoids floating around that I want to cover soon, but these will have to wait. For the time being ST Ericsson is on the cutting edge when it comes to SOI and their proof of concept L8580 seems to have exceeded expectations.
Subject: Systems | January 16, 2013 - 12:30 PM | Tim Verry
Tagged: VIA, pico-itx, embedded system, cortex a8, arm
VIA has launched a new small form factor PC for embedded applications and powered by ARM hardware. The ARMOS-800 is ruggedized and low power. It features a fanless design with an aluminum chassis that can operate between -40 and 80 degrees Celsius.
Internal hardware includes a pico-ITX motherboard, and Freescale ARM Cortex A8 processor clocked at 800MHz. It also has two integrated GPUs capable of dual display outputs. Other specifications include 1GB DDR3 SDRAM, 4GB eMMC internal storage, and a microSD card slot.
IO options on the ARMOS-800 include a COM port, DIO port, CAN port, and three audio jacks (line in, line out, and mic in). Rear IO includes one VGA, one HDMI, one Ethernet jack (10/100), three USB 2.0 ports, and an optional VNT9271 Wi-Fi card attached via an internal USB header.
The ARMOS-800 PC uses an average of 3.14W during normal operation. It can officially support Android 2.3 or Embedded Linux 2.6. The PC measures 15 x 4.6 x 10.8 centimeters. The ARMOS-800 is available now. You can find more information on the VIA product page.
Subject: General Tech | January 15, 2013 - 09:55 AM | Tim Verry
Tagged: windows rt, microsoft, arm
One of the downsides to Microsoft’s ARM-powered Windows RT operating system is the lack of desktop applications. While Windows RT devices to retain the traditional Windows desktop, only Microsoft applications that come pre-packaged with Windows are allowed to run. Instead, Microsoft wants users to stick to Modern UI applications and the Windows Store to get new apps. (Granted, the ARM hardware powering these devices necessitates porting x86 desktop applications in order to run in the first place, but Windows RT locks out even recompiled apps).
Enthusiasts are working on changing that, however. A XDA Developers forum member known as Netham45 recently released a tool that allows users to run unsigned desktop applications on Windows RT. The new RT Jailbreak tool is a batch file that automates a hack discovered by another hacker known as clrokr.
The hack is currently only temporary, and needs to be redone after every computer restart. It does, however, allow Windows RT to run unsigned code on the desktop. After downloading the batch file, you run the runExploit.bat and follow the prompts. After it completes, you users can run recompiled desktop apps such as PuTTY, 7-zip, TightVNC, DOSBox, Quake 2, and more.
While it is not a permaent solution, it is a step in the right direction, and makes ARM-powered Windows RT devices a lot more interesting and useful to power users. For more information on the RT Jailbreak hack, and to grab the batch file to unlock your WinRT tablet, check out this forum thread on the XDA Developers website.
Subject: Mobile | January 11, 2013 - 09:05 AM | Tim Verry
Tagged: SoC, qualcomm 800, qualcomm 600, qualcomm, krait, ces 2013, CES, arm, adreno 330, adreno 320
Qualcomm introduced two new high end mobile processors at CES earlier this week. Known as the Snapdragon 600 and Snapdragon 800, the new SoCs take the company’s Krait CPU cores to the next level. Both of the new chips are based on a 28nm HPm manufacturing process and feature faster (and more efficienct) CPU and GPU portions.
The Qualcomm Snapdragon 600 is SoC with four Krait 300 CPU cores clocked at 1.9GHz along with an Adreno 320 GPU, and 4G LTE modem. The Snapdragon 600 also supports LPDDR3 RAM. The Adreno 320 GPU features suport fro OpenGL ES 3.0, OpenCL, and Renderscript Compute technologies. According to Qualcomm, the Snapdragon 600 is 40% faster than the Snapdragon S4 Pro processor used in devices like the Google Nexus 4 smartphone. Also, the Adreno 320 GPU is up to 3-times faster than the previous-generation A225.
The Snapdragon 600 SoC is inteded for smartphones, and we should start to see the new processor shipping with new devices by Q2 2013.
Meanwhile, the Snapdragon 800 processor takes performance up yet another notch over the company’s existing chips. The new SoC includes four Krait 400 CPU cores clocked at 2.3GHz, an Adreno 330 GPU, support for 2x32-bit LPDDR3 at 800MHz (12.8Gbps), and a 4G LTE modem. The chip also features two image signal processors (ISP) that can handle up to four cameras and 55MP (total) resolution. Devices with the Snapdragon 800 processor will be able to record 1080p30 video as well as encode and decode stored videos with up to 4K resolutions. As far as wireless, the Snapdragon 800 includes a 4G LTE modem and 802.11ac Wi-Fi. The upcoming SoC can handle 4K video output and HD audio in the form of DTS-HD, Dolby Digital+, and 7.1 Surround Sound.
The Adreno 330 GPU in the Snapdragon 800 chip also supports OpenGL ES 3.0, OpenCL, and Rednderscript Computer technologies. It can output 4K video and reportedly offers up to twice the compute performance versus the Adreno 320 GPU in the Snapdragon 600 processor.
According to Qualcomm, the Snapdragon 800 processor as a whole is up to 75% faster than the Snapdragon S4 Pro SoC. Qualcomm is aiming this processor at “premium” high end devices including Smart TVs, tablets, consumer electronics devices (ie: blu ray players with apps), and smartphones. Qualcomm expects to see devices powered by the new SoC become available sometime around the middle of 2013 (1H’13).
The new chips appear to offer up some noticeable performance and efficiency improvements over the current generation of Snapdragon processors. The Snapdragon 800 in particular is an impressive-sounding design. I am interested to see how it stacks up against competing chips such as NVIDIA’s Tegra 4, Samsung’s next-gen Exynos lineup, and whatever chip Apple has up its sleeve for the next iPad/iPhone refresh. This year is shaping up to be an exciting year for ARM-based SoCs!
If you are interested in the new silicon, Qualcomm has teased a few more details on its blog.
PC Perspective's CES 2013 coverage is sponsored by AMD.
Follow all of our coverage of the show at http://pcper.com/ces!