Podcast #166 - John Carmack interview, Crysis 2 DX11, Samsung SSD announcements, and more!

Subject: General Tech | August 18, 2011 - 05:32 PM |
Tagged: ssd, podcast, nvidia, Intel, amd

PC Perspective Podcast #166 - 8/18/2011

This week we talk about our John Carmack interview, Crysis 2 DX11, Samsung SSD announcements, and more!

You can subscribe to us through iTunes and you can still access it directly through the RSS page HERE.

The URL for the podcast is: http://pcper.com/podcast - Share with your friends!

  • iTunes - Subscribe to the podcast directly through the iTunes Store
  • RSS - Subscribe through your regular RSS reader
  • MP3 - Direct download link to the MP3 file

Hosts: Ryan Shrout, Jeremy Hellstrom, Josh Walrath and Allyn Malventano

This Podcast is brought to you by MSI Computer, and their all new Sandy Bridge Motherboards!

Program length: 1:04:28

Program Schedule:

  1. 0:00:37 Introduction
  2. 1-888-38-PCPER or podcast@pcper.com
  3. http://pcper.com/podcast
  4. http://twitter.com/ryanshrout and http://twitter.com/pcper
  5. 0:01:35 John Carmack Interview: GPU Race, Intel Graphics, Ray Tracing, Voxels and more!
  6. 0:14:43 NVIDIA Releases Q2 FY 2012 Results
  7. 0:23:17 Acer AC700-1099 Chromebook Review: Cut to the Bone
  8. 0:24:05 This Podcast is brought to you by MSI Computer, and their all new Sandy Bridge Motherboards!
  9. 0:25:20 Never mind the barrier, we even tessellated the water table !
  10. 0:31:00 SSD News
    1. Samsung Announces New High Performance SSDs for Mobile
    2. Samsung Announces New 830 SATA 3 SSDs for Consumers
    3. Intel Releasing Firmware Fix For 8MB SSD Bug In Two Weeks (correction: NOW)
    4. The Good, the bad and the ugly of SSDs
  11. 0:41:32 AMD Announces New Sub-$100 Triple Core A6-3500 APU
  12. 0:43:11 Intel ultra-balks at Ultrabook manufacturers requests
  13. 0:47:50 Sandy Bridge-E Processors: Cooler Sold Separately                                       AMD Considers Bundling FX Processors With Sealed Loop Water Coolers (LCS)
  14. 0:52:20 Bitcoin Trojan Stuff
  15. 0:55:08 Hardware / Software Pick of the Week
    1. Ryan: Tripit.com and apps
    2. Jeremy: Antikeylogger01-USB @ $49 or Brain experimentation 
    3. Josh: AMD A-3850... same price, but DiRT 3 for FREE!
    4. Allyn: Anti-pick: McAfee iOS app fail
  16. 1-888-38-PCPER or podcast@pcper.com
  17. http://pcper.com/podcast   
  18. http://twitter.com/ryanshrout and http://twitter.com/pcper
  19. 1:03:28 Closing
Source:

Llano is running short

Subject: General Tech | August 18, 2011 - 07:43 AM |
Tagged: shortage, llano, amd

Not all is well with AMD and GLOBALFOUNDRIES 32nm process as the yields have been so low as to effect the supply of Llano chips.  Currently only two chips, the A8-3850 and A6-3650 are on the market, with three more models expected fairly soon.  Since AMD beleives that there supply difficulties will be overcome by September the shortages should not delay the release of the new lower power chips.  DigiTimes also mentioned some news about NVIDIA's 28nm products that makes the outlook for this time next year a little bleak.

llano-roadmap.jpg

"AMD's latest Llano-based processors are currently suffering from shortages due to the weaker-than-expected yield rates of the related 32nm process; however, AMD has already notified its partners that the shortage should be resolved by early September, according to sources from motherboard makers.

Due to the new platform's strong performance/price ratio, market demand for Llano APUs is rising gradually with sales of the compatible A75-based motherboards also expected to increase, the sources noted. However, because the supply of Llano APUs in July started turn tight because of weak 32nm yields, AMD currently has a lot of orders from the retail channel, but is unable to fulfill the shipments.

With AMD set to resolve its APU shortages in early September, many motherboard makers are already starting to increase their A75-based motherboard shipments.

In addition to the existing Llano CPUs, A8-3850 and A6-3650, AMD will launch three more 65W APUs, A8-3800, A6-3600 and A6-3500 at the end of the third quarter.

In additional news, although AMD, Nvidia and Qualcomm's 28nm chips finished tape-outs in June, and the companies are all ready to place orders in the second half, as demand from the retail channel remains weak, it is likely that the players will delay their orders to a later time, the sources added."

Here is some more Tech News from around the web:

Tech Talk

Source: DigiTimes

AMD Catalyst 11.8 is now available

Subject: Graphics Cards | August 17, 2011 - 12:14 PM |
Tagged: graphics drivers, catalyst, amd

join.jpg

Performance highlights

Description:

  • Improves performance up to 10% in Crysis 2 DirectX 11 version for both non-Anti-Aliasing, and application enabled Anti-Aliasing cases on the AMD Radeon™ HD 6000 and AMD Radeon™ HD 5000 Series
  • Improves performance up to 8% in Fear 3 DirectX 11 version with application enabled Anti-Aliasing on the AMD Radeon™ HD 6000 and AMD Radeon™ HD 5000 Series
  • Improves performance up to 30% when AMD’s Morphological Anti-Aliasing (MLAA) is enabled through the Catalyst™ Control Center on the AMD Radeon™ HD 6000 and AMD Radeon™ HD 5000 Series
  • Improves performance up to 20% in Call of Duty Black Operations for single GPU and Multi-GPU configurations on the AMD Radeon™ HD 6000 and AMD Radeon™ HD 5000 Series

For more information on AMD Catalyst™ 11.8 (for Windows 7, Windows Vista, Windows XP), including all of the resolved issues and performance highlights in this release, please see the AMD Catalyst™ 11.8 release notes.

Check out the monthly AMD Catalyst blog
Follow Andrew Dodd on twitter @CatalystCreator
Follow Christopher Bell on twitter @ChrisBellAMD

Download Catalyst Now!

Source: AMD

AMD Announces New Sub-$100 Triple Core A6-3500 APU

Subject: Processors | August 17, 2011 - 09:03 AM |
Tagged: APU, amd radeon, amd, A6-3500

AMD announced today a new desktop APU (Accelerated Processing Unit). The A6-3500 processor combines three x86 CPU cores with 320 Radeon GPU cores. The new A6-3500 APU comes with a full sweep of AMD technology, including Turbo Core, Steady Video image stabilization technology, DDR3 1333 support, HDCP compatibility, and AMD VISION Engine software. Following its predecessors, the new three core APU is able to pair with select AMD Radeon HD 6000 series discrete graphics cards.

plat00.jpg

This FM1 socket awaits an A Series APU like the new A6-3500

The three core APU operates at 2.1GHz (2.4GHz with Turbo Boost active) on the CPU side and 444MHz on the GPU side of things. Further, the APU features 3MB of L2 cache, a TDP of 65 watts, and is designed for use with FM1 motherboards.

The APU is now available for purchase at various online retailers and system builders with an MSRP of $95 USD. AMD states that the processor “delivers a compelling, affordable desktop experience for consumers and gamers.”

At under a $100, the new APU is an attractive option for HTPC usage and starter gaming systems on a tight budget. For more information on AMD’s APU architecture, can check out PC Perspective’s AMD A8-3850 APU review here.

Source: AMD

AMD Considers Bundling FX Processors With Sealed Loop Water Coolers (LCS)

Subject: Cases and Cooling, Processors | August 12, 2011 - 11:53 PM |
Tagged: amd, FX, octocore, water cooling, sealed loop, LCS, hsf

According to Xbit Labs, AMD is considering switching out the usual air cooler (HSF) for a sealed loop liquid cooling solution (LCS) for its high end FX Processors. Specifically, AMD wants to pair their highest end eight core processor (and possibly the next highest end eight core chip) with the sealed loop liquid cooling solution. This information, they believe, comes from a “source with knowledge of the company’s plans.”

AMDplusLCS.png

If you are not familiar with the sealed loop water coolers, PC Perspective reviewed the Corsair H70 processor cooler last year and it is a good example. Sealed loop water coolers are similar to the large DIY water cooling loops comprised of a large radiator, copper CPU block, pump, and reservoir all connected in a loop by tubing; however, they usually have smaller radiators and pumps as well as coolant that cannot be refilled (and should not have to be).  This coolant carries heat away from the processor to be dissipated through a radiator.  Corsair in particular has heavily invested in this once very niche product with it’s H series of coolers.

Traditionally, both Intel and AMD have been content in pairing their chips with mid-range but cheap air coolers that did a decent job of keeping the processors within their thermal limits at stock speeds. Enthusiasts, and especially those interested in overclocking, have generally ditched the included cooler in favor of a more powerful and/or quieter aftermarket cooler. Needless to say, including a cooler, especially with high end chips that will likely go to enthusiasts, that’s never even used only serves to add additional unnecessary cost for both consumers and the manufacturer. Thus, this move to bundle a more powerful sealed loop water cooler with its high end chips may be an attempt by AMD to futher appeal to enthusiasts and keep with their traditional image of being friendly to overclockers and hardware enthusiasts. Having and using a water cooler that is supported by the chip maker certainly doesn’t hurt, especially if it ever came down to warranty and RMA situations. On the other hand, enthusiasts can be very picky about which cooler to use in their systems; therefore, bundling a cooler that is sure to add even more extra cost to the package may not be the right move for AMD. At best, consumers are likely to see an extra $50 or so added to the sure to be pricey highest end eight core chips.

Their idea, if true, surely has merit, but is it wise? Let us know your thoughts in the comments below!

Source: Xbit Labs

Carmack Speaks

Last week we were in Dallas, Texas covering Quakecon 2011 as well as hosting our very own PC Perspective Hardware Workshop.  While we had over 1100 attendees at the event and had a blast judging the case mod contest, one of the highlights of the event is always getting to sit down with John Carmack and pick his brain about topics of interest.  We got about 30 minutes of John's time over the weekend and pestered him with questions about the GPU hardware race, how Intel's intergrated graphics (and AMD Fusion) fit in the future of PCs, the continuing debate about ray tracing, rasterization, voxels and infinite detail engines, key technologies for PC gamers like multi-display engines and a lot more!

One of our most read articles of all time was our previous interview with Carmack that focused a lot more on the ray tracing and rasterization debate.  If you never read that, much of it is still very relevant today and is worth reading over. 

carmack201c.png

This year though John has come full circle on several things including ray tracing, GPGPU workloads and even the advantages that console hardware has over PC gaming hardware.

Continue reading to see the full video interview and our highlights from it!!

Podcast #165 - QuakeCon 2011, MSI's GTX580 Lightning, Intel 710 SSDs, Ultrabooks and more!

Subject: General Tech | August 11, 2011 - 11:27 AM |
Tagged: podcast, pcper, nvidia, msi, Intel, GTX580, amd

PC Perspective Podcast #165 - 8/11/2011

This week we talk about QuakeCon 2011, MSI's GTX580 Lightning, Intel 710 SSDs, Ultrabooks and more!

You can subscribe to us through iTunes and you can still access it directly through the RSS page HERE.

The URL for the podcast is: http://pcper.com/podcast - Share with your friends!

  • iTunes - Subscribe to the podcast directly through the iTunes Store
  • RSS - Subscribe through your regular RSS reader
  • MP3 - Direct download link to the MP3 file

Hosts: Ryan Shrout, Jeremy Hellstrom, Josh Walrath and Allyn Malventano

This Podcast is brought to you by MSI Computer, and their all new Sandy Bridge Motherboards!

Program length: 1:25:12

Program Schedule:

  1. 0:00:27 Introduction
  2. 1-888-38-PCPER or podcast@pcper.com
  3. http://pcper.com/podcast
  4. http://twitter.com/ryanshrout and http://twitter.com/pcper
  5. 0:02:02 Quakecon 2011 and our Workshop - Postmortem
    1. Day 1 Coverage
    2. Day 2 Coverage
    3. Day 3 Coverage
  6. 0:18:05 This Podcast is brought to you by MSI Computer, and their all new Sandy Bridge Motherboards!
  7. 0:18:54 MSI N580GTX Lightning Xtreme Edition Review: What a GTX 580 Should Be
  8. 0:30:18 Antec High Current Gamer HCG-750 PSU Review
  9. 0:31:30 Samsung Galaxy Tab 10.1 Review - The Best Android Tablet?
  10. 0:32:16 Just Delivered Exclusive: PNY XLR8 Liquid Cooled GTX 580 Combo
    1. ZOTAC Unveils Water-Cooling Solutions
  11. 0:36:40 Let us do some math, shall we? The cost of consoles
  12. 0:41:46 Intel 710 SSD Prices Leaked
  13. 0:47:40 ExpressCard trying to pull a (not so) fast one?
  14. 0:55:30 NVIDIA Outlines Multi-GPU and Cloud Graphics With Project Maximus and Virtual Graphics Technologies
  15. 1:06:50 Will Intel's Ultrabook form factor come with an integral Achilles Heel?
    1. Intel bets $300m on their Ultrabook-ie. Next step: broken legs.
  16. 1:09:15 Hardware / Software Pick of the Week
    1. Ryan: Blackmagic Intensity card 
    2. Jeremy: Strangely, I find myself thinking kindly upon BigFoot Networks
    3. Josh: http://www.faststone.org/FSResizerDetail.htm
    4. Allyn: http://pastebin.com and Ghostery
  17. 1-888-38-PCPER or podcast@pcper.com
  18. http://pcper.com/podcast   
  19. http://twitter.com/ryanshrout and http://twitter.com/pcper
  20. 1:23:50 Closing
Source:

ECS Announces Three New A55 Based AMD Motherboards

Subject: Motherboards | August 9, 2011 - 03:42 PM |
Tagged: motherboard, ECS, APU, amd, A55

According to Tech Connect, ECS is about to release three ECS FM1 motherboards powered by the lighter A55 chipset to compliment the company’s higher end A75 boards. The new A55 based motherboards will be known as the A55F-A, A55F-M2, and the A55F-M3, the first being ATX and the remaining two boards being micro-ATX.

ECSA55F-A.jpg

The new motherboards will support AMD’s A Series APUs and will feature one PCI-E x16 slot, Gigabit Ethernet, and one VGA connection. The standard ATX sized A55F-A will further have four DDR3 DIMM slots, five SATA II 3Gb/s ports, 12 USB 2.0 ports, and HDMI and DVI video connectors. The A55F-M2 on the other hand with receive two DDR3 DIMM slots, six SATA 3Gb/s ports, 12 USB 2.0 ports, and HDMI and optional DVI connections. Lastly, the A55F-M3 has two DDR3 DIMM slots, four SATA 3Gb/s ports, and eight USB 2.0 ports.

More photos of the new boards can be seen here. Price and availability of the new A55 chipset motherboards have not yet been released.

Source: Tech Connect

AMD will be snubbing the smartphone

Subject: General Tech | August 9, 2011 - 12:30 PM |
Tagged: amd, tablet, smartphones, trinity

In a revent interview, AMD's SVP and GM, Rick Bergman restated that AMD has no current plans in the works to jump to the handheld market.  They will continue to focus on their current product lines and that the only ultramobile development currently underway is for tablets.  That could help them get a leg up on Intel's Atom, as Intel is definitely making a move for the hand held market.  Focusing on tablets gives them a less strict power limitation and may just give them a boost as they push to the 28nm process with only one ultra low power Trinity APU product line to design.  Check out The Inquirer for more.

amd02.jpg

"CHIP DESIGNER AMD has ruled out making a move in the smartphone market, preferring to concentrate on tablets.

Rick Bergman, SVP and GM of AMD's products group told a conference that the chip designer has no plans to get into the smartphone market, saying that its expertise in graphics does not suit that market. Instead it will be up to AMD's Z-series embedded chip to push X86 into the tablet market."

Here is some more Tech News from around the web:

Tech Talk

Source: The Inquirer

AMD Accelerates APU OpenCL Performance With New SDK

Subject: Graphics Cards, Processors | August 8, 2011 - 05:28 PM |
Tagged: amd, APU, sdk, opencl

AMD released its new APUs (Accelerated Processing Unit) to the masses, and now they are revving the processors up with a new software development kit that increases performance and efficiency of OpenCL based applications. The new version 2.5 APP SDK is tailored to the APU architecture where the CPU and GPU are on the same die. Building on the OpenCL standard, APP SDK 2.5 promises to reduce the bandwidth limitation of the CPU to GPU connection, allowing for effective data transfer rates as high as 15GB per second in AMDs A Series APUs. Further performance enhancements include reduced kernel launch times and PCIe overhead.

APP_V3_longbnr.jpg

AMD states that the new APP SDK will improve multi-gpu support for AMD APU graphics paired with a discrete card, and will “enable advanced capabilities” to improve the user experience including gesture based interfaces, image stabilization, and 3D applications.

The new development kit is currently being used by developers worldwide in the AMD OpenCl coding competition, where up to $50,000 in prizes will be given away to winning software submissions. You can get started with the SDK here.

Source: AMD